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Электронный компонент: L6210

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L6210
April 1993
DUAL SCHOTTKY DIODE BRIDGE
.
MONOLITHIC ARRAY OF EIGHT SCHOTTKY
DIODES
.
HIGH EFFICIENCY
.
4A PEAK CURRENT
.
LOW FORWARD VOLTAGE
.
FAST RECOVERY TIME
.
TWO SEPARATED DIODE BRIDGES
DESCRIPTION
The L6210is a monolithic IC containing eight Schot-
tky diodes arranged as two separated diode
bridges.
This diodes connection makes this device versatile
in many applications.
They are used particular in bipolar steppermotor ap-
plications, where high efficient operation, due to low
forward voltage drop and fast reverse recovery time,
are required.
The L6210 is available in a 16 Pin Powerdip Pack-
age (12 + 2 + 2) designed for the 0 to 70xC ambient
temperature range.
N
DIP16
(Plastic Package))
ORDERING NUMBER : L6210
PIN CONNECTION (top view)
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BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
I
f
Repetitive Forward Current Peak
2
A
V
r
Peak Reverse Voltage (per diode)
50
V
T
amb
Operating Ambient Temperature
70
o
C
T
stg
Storage Temperature Range
55 to +150
o
C
THERMAL DATA
Symbol
Parameter
Value
Unit
R
th j-case
Thermal Impedance Junction-case
Max.
14
o
C/W
R
th j-amb
Thermal Impedance Junction-ambient without External Heatsink
Max.
65
o
C/W
ELECTRICAL CHARACTERISTICS (T
j
= 25
o
C unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
f
Forward Voltage Drop
I
f
= 100 mA
0.65
0.8
i
f
= 500 mA
0.8
1
V
I
f
= 1 A
1
1.2
I
L
Leakage Current
V
R
= 40 V, T
amb
= 25
o
C
1
mA
No te :
At forward currents of greater than 1A, a parasiti c current of approxim ately 10mA may be col lected by adi acent di-
odes.
L6210
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Figure 1 : Reverse Current verus Voltage
Figure 2 : Forward Voltage versus Current
The Rth j-amb of the L6210 can be reduced by sol-
dering the GND pins to suitable copper area of the
printed circuit boards as shown in figure 3 or to an
external heatsink (figure 4). During soldering the pin
temperaturemust not exceed 260
o
C and the solder-
ing time must not be longer then 12s. The external
heatsink or printed circuit copper area must be con-
nected to electrical ground.
Figure 3 : Example of P.C. Board Copper Area
which is used as Heatsink
Figure 4 : Example of an External Heatsink
MOUNTING INSTRUCTIONS
L6210
3/5
POWERDIP16 PACKAGE MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
a1
0.51
0.020
B
0.85
1.40
0.033
0.055
b
0.50
0.020
b1
0.38
0.50
0.015
0.020
D
20.0
0.787
E
8.80
0.346
e
2.54
0.100
e3
17.78
0.700
F
7.10
0.280
I
5.10
0.201
L
3.30
0.130
Z
1.27
0.050
L6210
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Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica-
tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre-
viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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L6210
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