ChipFind - документация

Электронный компонент: L6275

Скачать:  PDF   ZIP
GENERAL
5V (+/- 10%) OPERATION.
REGISTER BASED ARCHITECTURE
MINIMUM EXTERNAL COMPONENTS
BICMOS + VERTICAL DMOS (1.5mm)
VCM DRIVER
1.5A DRIVE CAPABILITY
0.9
TOTAL BRIDGE IMPEDANCE AT 25
C
LINEAR MODE
PHASE SHIFT MODULATION (PWM MODE)
INSTANTANEOUS, (GLICH FREE) SWITCH
BETWEEN THE 2 MODES
CLASS AB OUTPUT DRIVERS
ZERO CROSSOVER DISTORSION
14 BIT DAC DEFINE OUTPUT CURRENT
SELECTABLE TRANSCONDUCTANCE
4 PROGRAMMABLE PARKING VOLTAGE
DYNAMIC BRAKE
SPINDLE DRIVER
2.0A DRIVE CAPABILITY
0.8
TOTAL BRIDGE IMPEDANCE AT 25
C
BEMF, INTERNAL OR EXTERNAL, PROC-
ESSING
SENSOR-LESS MOTOR COMMUTATION
PROGRAMMABLE COMMUTATION PHASE
DELAY
LINEAR MODE AND CONSTANT TOFF PWM
OPERATION MODE
INTERNAL FREQUENCY LOCKED LOOP
SPEED CONTROL (FLL)
BEMF RECTIFICATION DURING RETRACT
BUILT-IN ALIGNAMENT&GO START-UP
INDUCTIVE SENSING START UP OPTION
RESYNCHRONIZATION
DYNAMIC & REVERSE BRAKE
CONTROLLABLE OUTPUT SLEW RATE
OTHER FUNCTIONS
5V MONITORING WITH EXTERNAL SET
TRIP POINTS AND HYSTERESIS
POWER UP/DOWN SEQUENCING
LOW VOLTAGE SENSE
3.3V INPUT LOGIC COMPATIBILITY
THERMAL SHUTDOWN AND PRETHERMAL
WARNING
SYSTEM CLOCK WATCHDOG
DESCRIPTION
The L6275 integrates into a single chip both spin-
dle and VCM controllers as well as power stages.
The device is designed for 12V disk drive applica-
tion requiring up to 2.0A of spindle and 1.5A of
VCM peak currents.
A serial port with up to 25 MHz capability provides
easy interface to the microprocessor. A register
controlled Frequency Locked Loop (FLL) allows
flexibility in setting the spindle speed. Integrated
BEMF processing, digital masking, digital delay,
and sequencing minimize the number of external
components required.
Power On Reset (POR) circuitry is included. Upon
detection of a low voltage condition, POR is as-
serted, the internal registers are reset, and spin-
dle power circuitry is tri-stated. The BEMF is recti-
fied providing power for actuator retraction
followed by dynamic spindle braking.
The device is built in BICMOS technology allow-
ing dense digital/analog circuitry to be combined
with a high power DMOS output stage.
This is preliminary information on a new product now in development. Details are subject to change without notice.
April 1999
TQFP44 (10x10mm)
ORDERING NUMBER: L6275
L6275
5V DISK DRIVE SPINDLE & VCM, POWER
& CONTROL "COMBO"
PRODUCT PREVIEW
BICMOS TECHNOLOGY
1/17
CHARGE
PUMP
ISO
DRIVER
SUPPLY &
CLOCK FAULT
MONITORS
FREQUENCY
LOCK LOOP
SPINDLE SEQUENCER
REFERENCE
VOLTAGE
GENERATOR
14 BIT
VCM DAC
ZERO CROSS
DETECTION
A
A+
A-
A=4
SUPPLY
CP
FLL_RES
FLL_FILTER
SYS_CLK
FCOM
SPN_COMP
BRK_CAP
PWM/SLEW
VDD
POR_DELAY
PORB
VDD
GND
DGND
V5/2
VCM_CAL
ERROR_IN
ERROR_OUT
SENSE_OUT
OUT_A
OUT_B
RSENSE
OUT_C
VCM_A+
VDD
VCM_A-
SENSE_IN-
SENSE_IN+
D99IN1050
VCM_GND
CTAP
CS
SW1
SDATA
SCLK
SDEN
CLK_MON
TR_5V
ISENSE
INDEX
THERMAL
DAC
VCM
CALIBRATION
BEMF
RECTIFICATION
PARKING
VCM CURRENT
CONTROL PSM/LIN
START-UP
RE_SYNC
DYNAMIC/
REVERSE
BRAKE
SPINDLE
CURRENT
CONTROL
PWM/LIN
BEMF
PROCESSING
B
C
SERIAL
INTERFACE
REGISTERS
+
+
-
-
BLOCK DIAGRAM
1
2
3
5
6
4
7
8
9
10
17
11
18
19
20
21
22
44
43
42
41
39
40
38
37
36
35
34
28
27
26
24
23
25
33
32
31
29
30
R_SENSE
I_SENSE
OUT_C
CTAP
FCOM
PWM/SLEW
INDEX
OUT_A
R_SENSE
OUT_B
GND
BRK_CAP
VDD
DGND
SYS_CLK
SDATA
SDEN
SCLK
VDD
V5/2
FLL_FILTER
VCM_CAL
SPN_COMP
VDD
AGND
DAC
ERROR_IN
CLK_MON
ERROR_OUT
SENSE_OUT
POR_DELAY
TR_5V
PORB
VCM_GND
SENSE_IN+
VCM_A-
CS
CP
VDD
SW1
FLL_RES
VDD
SENSE_IN-
VCM_A+
D99IN1051
12
13
14
15
16
PIN CONNECTION
L6275
2/17
PIN DESCRIPTION (Pin Types: D = Digital, P = Power, A = Analog)
N.
Name
Function
1
FCOM
Output of the Spindle zero cross or Current Sense circuit.
2
CTAP
Spindle Central Tap used for differential BEMF sensing.
3
PWM/SLEW
RC network sets the Spindle Linear Slew Rate and PWM OFF-Tim e.
4
OUT_C
Spindle DMOS Half Bridge Output and Input C for BEMF sensing.
5
I_SENSE
Input to sense the voltage the SPINDLE Sense Resistor.
6
R_SENSE
Output connection for the Motor Current Sense Resistor to ground.
7
OUT_B
Spindle DMOS Half Bridge Output and Input B for BEMF sensing.
8
GND
Spindle Ground (Substrate).
9
R_SENSE
Output connection for the Motor Current Sense Resistor to ground.
10
OUT_A
Spindle DMOS Half Bridge Output and Input A for BEMF sensing.
11
INDEX
Input to allow Spindle to be locked to Index (servo) pulse.
12
BRK_CAP
Storage Capacitor for brake circuit. typically 5.9V.
13
VDD
+5V Power Supply for Spindle Power section.
14
DGND
Digital Ground.
15
SYS_CLK
Clock Frequency for system timers and counters.
16
SDEN
Serial Data Enable. Active high input pin for the serial port enable.
17
SDATA
Serial Port Data. Input/Output pin for serial data, 8bits of instruction/address followed by 8
bits of data. Open pin is at logic low as an input.
18
SCLK
Serial Port Data Clock. Positive edge triggered clock input for the serial data.
19
VDD
Digital/Analog power supply. +5V nominally.
20
V12/2
Reference Output for VCM control loop. Typically, half of the VCC except when parking.
21
FLL_FILTER
Speed loop R/C compensation connection used for FLL mode operation.
22
VCM_CAL
VCM loop offset voltage used for calibration.
23
CP
External Main Charge Pump Capacitor, Typically, Vz+Vcc is about 17.8V
24
CS
External Charge Pump Capacitor.
25
VDD
+5V Power Supply for VCM Power section.
26
VCM_A-
VCM Power Amplifier negative output terminal.
27
SENSE_IN+
Non inverting Input of the Sense Amplifier for VCM block.
28
VCM_GND
Ground for VCM Power section.
29
SENSE_IN-
Inverting Input of the Sense Amplifier for VCM block.
30
VCM_A+
VCM Power Amplifier positive output terminal.
31
VDD
+5V Power Supply for VCM Power section.
32
FLL_RES
Resistor for setting accurate bias current sources for the chip (62K required).
33
SW1
External ISOFET driver.
34
PORB
Power on Reset Output. Low signal indicates the failure of the supplies.
35
TR_5V
Set Point Input for 5V Supply Monitor ( 2V threshold, 100mV Hysteresis)
36
POR_DELAY
Capacitor connection to set the Power on Reset Delay (3V threshold, 2
A charging)
37
SENSE_OUT
Output of the Sense Amplifier.
38
ERROR_OUT
Output of the Error Amplifier.
39
ERROR_IN
Inverting Input of the Error Amplifier.
40
CLK_MON
Watchdog clock monitoring pin
41
DAC
Output of the VCM DAC.
42
AGND
Analog Ground. For bang gap voltage reference.
43
VCC
+12V Power Supply for Spindle Power section.
44
SPN_COMP
External RC network that defines the compensation of the Spindle Transconductance Loop
in Linear Mode.
L6275
3/17
ELECTRICAL CHARACTERISTICS (All specifications are for 0 < T
amb
< 70
C, V
CC
= 12V; V
DD
= 5V,
FLL_RES = 62k
, unless otherwise specified.)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
POWER SUPPLIES
V
rectified
V
CC
Supply Rectified
3.5
13.2
V
V
dd
5V supply
4.5
5.5
V
I
Vdd
5V supply
SPINDLE + VCM
6
mA
SPINDLE ONLY
7
mA
VCM ONLY
12
mA
THERMAL SENSING
T
SD
Shutdown Temperature
150
180
C
T
HYS
Hysteresis
60
C
T
EW
Early Warning
T
SD
-25
C
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
CC
Maximum Supply voltage
-0.5 to 14
V
V
dd
Maximum Logic supply
-0.5 to 6
V
V
in max
Maximum digital input voltage
V
dd
+0.3V
V
V
in min
Minimum digital input voltage
GND - 0.3V
V
SPINDLE I
peak
Spindle peak sink/source output current
2.1
A
VCM I
peak
VCM peak sink/source output current
1.6
A
P
tot
(*)
Maximum Total Power Dissipation
1.7
W
T
stg
, T
j
Maximum Storage/Junction Temperature
-40 to 150
C
THERMAL DATA
Symbol
Parameter
Value
Unit
R
th j-case
Thermal Resistance Junction to Case
20
C/W
R
th j-amb
(*)
Thermal Resistance to Junction to ambient
40
C/W
(*) In typical application with multilayer 120X120mm Printed Circuit Board
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Value
Unit
V
dd
Supply Voltage
4.5 to 5.5
V
T
amb
Operating Ambient Temperature
0 to 70
C
T
j
Junction Temperature
0 to 125
C
L6275
4/17
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
SUPPLY MONITOR
V
TR
Trip Point
Input Rising
1.92
2
2.08
V
V
HYS
Hysteresis Voltage
Input falling
100
mV
I
DLY
Porb Delay Current
TR_5V, TR_12V > V
TR
Vpordly = 2V
1.5
2
2.5
A
R
on_por
Porb Pull Down Ron
V
dd
> 2V and sink 1mA
V
pordly
= 2V
500
V
DLY
Porb Dly Threshold
TR_5V > V
TR
2.0
V
I
IN
Input Current
V
IN
< 4V
-1
1
A
VOLTAGE BOOST
V
BOOST
Output Voltage
V
dd
+5
V
dd
+6.3
V
F
osc
Internal Oscillator
130
200
250
kHz
SYSTEM CLOCK WATCHDOG
Min_Clk
Min. System Clock Time
7
10
13
s
SW1 OUTPUT
R
GATE
Gate Driver for External Mosfet
Internal Resistor to CP
200
k
V
GATE
Off Gate State Voltage for
External Mosfet
I
O
= 1mA V
dd
= 3.5V
0.7
V
DIGITAL LOGIC LEVELS
V
IH
Input Logic "1"
2.5
V
V
IL
Input Logic "0"
0.5
V
V
OH
Output Logic "1"
I
SOURCE
= 20
A
V
dd
-0.2
V
V
OL
Output Logic "0"
I
SOURCE
= -400
A
0.4
V
F
SYSCLK
System Clock
20
25
MHz
VCM, DAC
Resolution
14
Bits
Differential Linearity
1 LSB Change
- Tested
- By design
-1
-0.5
1
0.5
LSB
Integral Linearity
9
Bits
Midscale Offset
Referenced to V
CC
/2
-5
5
mV
T
C
Convertion Time
5
s
Full Scale Voltage
Referenced to V
CC
/2
1
V
Full Scale Error
-4
4
%
VCM, ERROR AMPLIFIER
A
VOL
Open Loop Gain
DC
50
db
V
OS
Input Offset Voltage
-5
5
mV
I
IB
Input Bias Current
--250
250
nA
V
ICM
Input Common Mode Range
V
CC
/2-
0.5
V
CC
/2+
0.5
V
ELECTRICAL CHARACTERISTICS (Continued)
L6275
5/17
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
Vclamp
Output Clamp Voltage
-1mA < I
O
< 1mA
Lowside/Highside clamp
V
dd
/2
1.4V
V
F
ODB
Unity Gain Bandwidth
10
MHz
VCM, POWER STAGE
R
DS(ON)
Output ON Resistance (Each
device)
T
j
= 25
C
T
j
= 125
C
0.5
0.8
I
O
Operating Current
1.3
A
I
O(LEAK)
Output Leakage Current
V
CC
= 5.5V
1.0
mA
VCM, CURRENT SENSE AMPLIFIER
A
V
Voltage Gain
3.88
4
4.12
V/V
V
ICM
Input Common Mode Range
-0.3
V
dd
+0.3
V
V
OCM
Output Common Mode Range
-3mA < I
O
< 3mA
2
V
dd
-2
V
V
OS
Output Offset Voltage
SENSE_IN (
) = V
dd
/2
-15
15
mV
F
3dB
3dB Bandwidth
1
MHz
CMRR
Input Common Mode Rejection
50
dB
PSRR
Power Supply Rejection Ratio
60
dB
VCM, RETRACT
V
park
RETRACT VOLTAGE
PKV_1 = 0 & PKV_2 = 0
PKV_1 = 0 & PKV_2 = 1
PKV_1 = 1 & PKV_2 = 0
PKV_1 = 1 & PKV_2 = 1
0.850
0.650
1.600
1.150
mV
mV
mV
mV
Tretract
Retract Time
limited by the internal oscillator
200kHz
RT0 = 0 & RT1 = 0
RT0 = 0 & RT1 = 1
RT0 = 1 & RT1 = 0
RT0 = 1 & RT1 = 1
160
320
80
160
ms
ms
ms
ms
SPINDLE, PWM CURRENT SENSE COMPARATOR
T
DLY
Delay to FCOM Out
200
500
ns
SPINDLE, POWER STAGE
R
DS(ON)
Output On Resistance (Each
device)
T
j
= 25
C
T
j
= 125
C
0.45
0.74
I
O
Start-Up Current
2
A
I
O(LEAK)
Output Leakage Current
VCC = 14V
1.0
mA
dV
O
/d
t
Output Slew Rate (Linear)
R
slew
= 100k
0.2
0.3
0.5
V/
s
Output Slew Rate (PWM)
Reg#8Eh, Bit 0 = 0
Reg#8Eh, Bit 0 = 1
10
20
V/
s
V/
s
BEMF
MIN
Minimum BENF Voltage for
Detection
20
28
40
mVp-p
V
HYS
Hysteresis
15
mV
FLL CHARGE PUMP OUTPUT
I
LEAK
Off State Leakage
0 < Vfll_res , 3V
-50
+50
nA
I
O
On State Current
FLL_RES = 62k
ICP = "1"
ICP = "0"
22
80
25
100
32
120
A
A
V
RCP
Current Set Voltage
FLL_RES = 62k
1.18
1.225
1.25
V
ELECTRICAL CHARACTERISTICS (Continued)
L6275
6/17
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
CURRENT SENSE AMPLIFIER
I
BIAS
Input Bias Current
2
A
Av
Voltage Gain
3.8
4.0
4.2
V/V
dV
o
/d
t
Output Slew Rate
20
V/
s
SERIAL PORT
Symbol
Parameter
Min.
Typ.
Max.
Unit
T
SCK
SCLK Period
40
ns
T
CKL
SCLK low time
15
ns
T
CKH
SCLK high time
15
ns
T
SDENS
Enable to SCLK
35
ns
T
SDENH
SCLK to disable
20
ns
T
DS
Data set-up time before rising edge SCLK
10
ns
T
DH
Data Hold Time
10
ns
T
SDENL
Minimum SDEN Low Time
50
ns
T
SDV
SCLK falling edge (A6) to SDATA valid on READ op.
3
10
ns
T
SDV
SCLK rising edge (D0-D7) to SDATA Transition on READ op.
5
35
ns
ELECTRICAL CHARACTERISTICS (Continued)
0
A0
A1
1st Byte
2nd Byte
A6
D0
D1
D2
D7
SDEN
SCLK
SDATA
SERIAL PORT WRITE TIMING
SERIAL PORT READ TIMING
1
A0
A1
1st Byte
2nd Byte
D98IN844
A6
D0
D1
D2
D7
SDEN
SCLK
SDATA
Figure 1. Serial Port Timing Information.
L6275
7/17
SERIAL PORT OPERATION
The serial port interface is a bi-directional port for reading and writing programming data from/to the in-
ternal registers of this device. For data transfers SDEN* is brought high, serial data is presented at the
SDATA pin, and a serial clock is applied to the SCLK pin. After the SDEN* goes high , the first 16 pulses
applied to the SCLK pin will shift the data presented at the SDATA pin into an internal shift register on
the rising edge of each clock. An internal counter prevents more than 16 bits from being shifted into the
register. The data in the shift register is latched after the 16th SCLK pulse. If less than 16 clock pulses
are provided before SDEN* goes low, the data transfer is aborted.
All transfers are shifted into the serial port LSB first. The first byte of the transfer is for R/W and address
and instruction information. The first bit is R/W instruction bit, 0 is for WRITE and 1 is for READ.
Following 7 bits are Address.
INSTRUCTION, 1 BIT
ADDRESS, 7 BITS
D98IN845
DATA, 8 BITS
SDEN
SCLK
SDATA
Figure 2. Serial Port Data Transfer Format.
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
0
VCM DAC (High) Register
Write only
0Eh
BIT
LABEL
DESCRIPTION
0
VDAC BIT8
VCM DAC bit 8
1
VDAC BIT9
VCM DAC bit 9
2
VDAC BIT10
VCM DAC bit 10
3
VDAC BIT11
VCM DAC bit 11
4
VDAC BIT12
VCM DAC bit 12
5
VDAC BIT13
MSB resistor ladder of the 14 bit VCM DAC
6
PSM/LINEAR
Selects Voice Coil PSM or Linear Output Current Control. 1=PSM
0=Linear.
7
VCM_CAL
VCM calibration. 1 = Enables VCM control circuits and tristates
VCM power transistors.
L6275
8/17
INTERNAL REGISTER DEFINITION
VCM DAC (High and Low) Registers
Bit 0 through 5 of the VCM DAC (High) Registers and bit 0 through 7 of the VCM DAC (Low) Registers
control the absolute value of the voice coil current. Bit is the sign bit, controlling the current direction. All
the 13 bits are part of a resistor divider network.
Note. It is required to write on register 1 to make effective changes on register 0.
Reg:
Name:
Type:
Address:
1
VCM DAC (Low) Registers
Write only
1Eh
BIT
LABEL
DESCRIPTION
0
VDAC BIT0
LSB resistor ladder of the 14 bit VCM DAC
1
VDAC BIT1
VCM DAC bit 1
2
VDAC BIT2
VCM DAC bit2
3
VDAC BIT3
VCM DAC bit3
4
VDAC BIT4
VCM DAC bit4
5
VDAC BIT5
VCM DAC bit5
6
VDAC BIT6
VCM DAC bit6
7
VDAC BIT7
VCM DAC bit7
Reg:
Name:
Type:
Address:
2
Spindle Control Register
Write only
2Eh
BIT
LABEL
DESCRIPTION
0
INCRE_SEQ
A 0 to 1 transition of this bit increments the spindle Sequencer.
1
START_UP
1 = Spindle Internal start up, 0 = Spindle External start up
2
R_SEQ
Reset Spindle sequencer. 1 = Reset sequencer to phase 1.
3
RUN
1 = Start Spindle ALIGN & GO, 0 = Reset Spindle control logic.
4
SPIN_EN
Enable Spindle section. 1 = Enable, 0 = Disable.
5
MEC/ELEC
Specifies electrical or mechanical cycle for Spindle FLL control.
1=Electrical, 0 = Mechanical.
6
PWM/LINEAR
Selects Spindle PWM or Linear Output Current Control. 1 = PWM,
0=Linear.
7
EXT/INT
External or internal Spindle loop feedback. 1 = external feedback
via index pin.
L6275
9/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
3
Spindle Delay Register
Write only
3Eh
BIT
LABEL
DESCRIPTION
0
MASK_TIME
Spindle BEMF Mask Time. 0 = 15 degree, 1 = 7.5 degree
1
MIN2
Control Spindle PWM on time
Min 1
Min2
Min. on Time
0
0
5.9
s
2
MIN1
0
1
1.4
s
1
0
12
s
1
1
5.21
s
3
8_12_POLE
Selects 8 or 12 pole motors. 1 = 8 pole, 0 = 12 pole.
4
SD3
Spindle commutation delay MSB
5
SD2
Spindle commutation delay bit
6
SD1
Spindle commutation delay bit
7
SD0
Spindle commutation delay LSB
SPINDLE PHASE DELAY
SD3-0 set the phase delay from BEMF zero crossing to the next commutation. The 30 theoretical degree
value can be changed to compensate for switching and other delays that are always present. The delay
adjustment range is from 1.875 through to 30 electrical degrees in 1.875 degree increments.
Reg:
Name:
Type:
Address:
4
FLL Coarse Counter Register
Write only
4Eh
BIT
LABEL
DESCRIPTION
0
C4
Bit 4 of Spindle FLL Coarse Counter
1
C5
Bit 5 of Spindle FLL Coarse Counter
2
C6
Bit 6 of Spindle FLL Coarse Counter
3
C7
Bit 7 of Spindle FLL Coarse Counter
4
C8
Bit 8 of Spindle FLL Coarse Counter
5
C9
Bit 9 of Spindle FLL Coarse Counter
6
C10
Bit 10 of Spindle FLL Coarse Counter
7
C11
MSB of Spindle FLL Coarse Counter
L6275
10/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
5
FLL Coarse/Fine Counter Register
Write only
5Eh
BIT
LABEL
DESCRIPTION
0
F8
Bit 8 of Spindle FLL Fine Counter
1
F9
Bit 9 of Spindle FLL Fine Counter
2
F10
MSB of Spindle FLL Fine Counter
3
Unused. Set = 0
4
C0
LSB of Spindle FLL Coarse Counter
5
C1
Bit 1 of Spindle FLL Coarse Counter
6
C2
Bit 2 of Spindle FLL Coarse Counter
7
C3
Bit 3 of Spindle FLL Coarse Counter
Reg:
Name:
Type:
Address:
6
FLL Fine Counter Register
Write only
6Eh
BIT
LABEL
DESCRIPTION
0
F0
LSB of Spindle FLL Fine Counter
1
F1
Bit 1 of Spindle FLL Fine Counter
2
F2
Bit 2 of Spindle FLL Fine Counter
3
F3
Bit 3 of Spindle FLL Fine Counter
4
F4
Bit 4 of Spindle FLL Fine Counter
5
F5
Bit 5 of Spindle FLL Fine Counter
6
F6
Bit 6 of Spindle FLL Fine Counter
7
F7
Bit 7 of Spindle FLL Fine Counter
L6275
11/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
7
Spindle Status Register
Read only
7Eh
BIT
LABEL
DESCRIPTION
0
THERMAL
Thermal Shutdown = 0 indicates that the chip temperature has exceeded 160
C.
The bit will reset (=1) when the temperature falls below 130
C. When Thermal
Shutdown =0, the spindle logic will tristate both high and low side drivers,
protecting the output circuitry.
1
THERM_WARN
Thermal Shutdown Warning =0 indicates that the chip temperature is
approximately 25
C before the device goes in thermal shut down.
2
ROTOR_STUCK
0 = A sequential Spindle BEMF has not been detected
3
FAULT
1 = Rapid deceleration of the Spindle motor or High frequency on FCOM signal.
4
MASK_TIME
Mask Time toggled to "0" indicates that the Spindle BEMF is masked.
5
ERROR_LOCK
0 = Indicates error Spindle speed > 16msec/sample, either electrical or
mechanical.
6
ALIGN
0 indicate that the Spindle is in the Internal Start-Up Align Phase.
7
GO
0 indicate that the Spindle is in the Internal Start-Up Go Phase.
Reg:
Name:
Type:
Address:
8
Spindle FLL Register
Write only
8Eh
BIT
LABEL
DESCRIPTION
0
SSLEW
Spindle PWM (chopping) Slew Rate. 0 = 10V
S, 1 = 20V
s
1
ICP
Spindle FLL Charge pump current. 1= 25
A, 0 = 100
A.
2
Unused. Set = 0.
3
ISNS
1 = Puts output of the Spindle sense amplifier on FCOM pin and changes limit to
roughly 1/3 of normal.
4
IL1
Adjust maximum voltage on Spindle Rsense
5
IL0
Adjust maximum voltage on Spindle Rsense
6
CPL
1 = Spindle FLL Charge pump low
7
CPH
1 = Spindle FLL Charge pump high
"IL0"
"IL1"
"ISNS"
V(I_SENSE) LIMIT (
10%)
0
0
0
0.45V
1
0
0
0.50V
0
1
0
0.55V
1
1
0
0.75V
0
0
1
0.15V
1
0
1
0.20V
0
1
1
0.25V
1
1
1
0.30V
L6275
12/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
9
System Control Register
Write only
9Eh
BIT
LABEL
DESCRIPTION
0
PKV_1
VCM Parking Voltage
1
PKV_2
VCM Parking Voltage
2
VR
1 = connects internal VR reference (2V) to level shift Opamp (for
Vcm calibration).
3
RT0 (*)
VCM Retract Time
4
DOUBLE
1 = Spindle Internal Start-Up Align and Energization time doubled.
5
VCM_EN
Enable VCM section. 1 = Enable, 0 = Disable.
6
RT1 (*)
VCM Retract Time
7
RETRACT
1= VCM retract
"PKV_1"
"PKV_2"
"PARKING VOLTAGE"
0
0
0.850V
0
1
0.650V
1
0
1.600V
1
1
1.150V
"RT0"
"RT1"
"RETRACT TIME"
0
0
160ms
0
1
320ms
1
0
80ms
1
1
160ms
(*) When program Retract Time (RT0 and RT1), Bit 2 REG#8Eh must be always written to 0.
L6275
13/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
10
Test Control Register
Write only
AEh
BIT
LABEL
DESCRIPTION
0
Unused. Set = 0
1
Unused. Set = 0
2
Unused. Set = 0
3
Unused. Set = 0
4
FLL_OUT
1 = Spindle Mech/Elec (see bit 5 register 2) output, 0 = Spindle
zero crossing output.
5
REV_BRAKE
Spindle Reverse Brake command. 1 = Brake. "0" has to be
reinserted to enable the spindle start up.
6
Unused. Set = 0
7
VB/DIS
1 = Disable Vboost
Reg:
Name:
Type:
Address:
11
VCM Control Register
Write only
BEh
BIT
LABEL
DESCRIPTION
0
VCMS
VCM PSM (chopping) Slew Rate. 0 = 10V/
s, 1 = 20V/
s
1
VCMH
1 = Forces VCM outputs to be High in PSM mode.
2
SLEEP
Unused (for future power saving mode).
3
COMSLEW
Spindle PWM (phase commutation) Slew Rate. 0 = 30V
s, 1 =
2V
s.
4
Unused. Set = 0
5
1 = Tristate the VCM outputs for half of the Retract Time during
retract.
6
1 = Brakes the VCM outputs for half of the Retract Time during
retract.
7
Unused. Set = 0
L6275
14/17
INTERNAL REGISTER DEFINITION
Reg:
Name:
Type:
Address:
12
Chip ID Register
Read only
FFh
BIT
LABEL
DESCRIPTION
0
ID_REV_0
Minor Revision Bit 0.
1
ID_REV_1
Minor Revision Bit 1.
2
ID_REV_2
Minor Revision Bit 2.
3
ID_REV_3
Minor Revision Bit 3.
4
ID_REV_4
Minor Revision Bit 0.
5
ID_REV_5
Minor Revision Bit 1.
6
ID_REV_6
Minor Revision Bit 2.
7
ID_REV_7
Minor Revision Bit 3.
1N4148
STN4NE03
VCC
VCC
5V_VDD
PORB
5V_VDD
12V_VCC
5V_VDD
2N2222
100nF
100nF
2.2
F
1
F
100nF
22
F
16V
(1)
22
F
16V
(1)
100nF
1nF
22
F
16V
(1)
20K
15K
10K
62K
10K
18.2K
220pF(3)
10nF(4)
51K
5K(4)
0.3(1W)
0.25(1W)
62K
620K
4.7K
5K(4)
1
F
1
24
CS
13,43
6,9
5
VCC
RSENSE
ISENSE
2
CTAP
CTAP
10
OUT_A
OUT_A
7
OUT_B
OUT_B
4
28
OUT_C
VCM_GND
OUT_C
26
27
30
VCM_A-
SENSE_IN+
VCM_A+
VCM_A-
29
21
32
25,31
11
SENSE_IN-
FLL-FILTER
FLL_RES
VCC
INDEX
VCM_A+
INDEX
CP
SW1
POR_DELAY
BRK_CAP
PWM/SLEW
SPN_COMP
AGND
CLK_MON
GND
VDD
TR_5V
23
33
36
12
3
DGND
14
44
42
40
8
19
35
VCM_CAL
22
V12/2
DAC
ERROR_IN
ERROR_OUT
SENSE_OUT
20
41
39
38
37
15
SYS_CLK
SYS_CLK
18
SCLK
SCLK
17
SDATA
SDATA
16
SDEN
SDEN
D99IN1052
1
FCOM
FCOM
34
PORB
Voice Coil Ground
Power Ground
Analog Ground
(1) This capacitor must be Tantalum
(2) Place these components close to thedevice
(3) Do not mount this component if Spindle Linear mode is used
(4) Do not mount this component if Spindle Pwm mode is used
Digital Ground
20
H
Figure 3. Application Circuit.
L6275
15/17
TQFP44 (10 x 10)
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.60
0.063
A1
0.05
0.15
0.002
0.006
A2
1.35
1.40
1.45
0.053
0.055
0.057
B
0.30
0.37
0.45
0.012
0.014
0.018
C
0.09
0.20
0.004
0.008
D
12.00
0.472
D1
10.00
0.394
D3
8.00
0.315
e
0.80
0.031
E
12.00
0.472
E1
10.00
0.394
E3
8.00
0.315
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.00
0.039
K
0
(min.), 3.5
(typ.), 7
(max.)
A
A2
A1
B
Seating Plane
C
11
12
22
23
33
34
44
E1
E
D1
D
e
1
K
B
TQFP4410
L
0.10mm
.004
OUTLINE AND
MECHANICAL DATA
L6275
16/17
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics Printed in Italy All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
http://www.st.com
L6275
17/17