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Электронный компонент: L6326

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L6326
February 2001
This is preliminary information on a new product now in development. Details are subject to change without notice.
s
Power Supplies +5Vdc, +8Vdc
s
Current bias or voltage bias (selectable) /
Voltage sense architecture
s
Single ended read input
s
24 pin TSSOP package, two channels
s
External Resistor for read and write currents or
trimmed internal resistor available (serial port
selectable)
s
Read channel -3dB bandwidth > 300MHz
(Rmr=60 ohms, no interconnect)
s
Input equivalent preamplifier voltage noise
0.5nV/rtHz typ
s
Input equivalent MR bias current noise 10pA/rtHz
typ
s
MR bias current programmable (5 bit DAC) 1.8-
8mA (GMR range), 3.8-10mA (AMR range)
s
MR bias voltage programmable (5 bit DAC) 100-
460mV (GMR range), 220-580mV (AMR range)
s
Programmable gain (100V and 150V)
s
Write frequency up to 250MHz (Lh=90nH,R=15
ohms, Ch=2pF, VDD=8V)
s
Rise/Fall time <0.7ns (Iw =40mA 0-pk,
Lh=90nH, Rh=15 ohms, Ch=2pF, VDD=8V)
s
Write current programmable (5 bit DAC) 15-60mA
s
Overshoot control 3 bit resolution (+1 bit for range)
s
Bi-directional 16-bit TTLs Serial interface for
head selection, read/write currents selection,
chip parameters modification, chip enable,
vendor code and fault status read back registers
s
2-wire mode selection (R/W, MRR)
s
Bank write feature for servo write
s
Digital buffered head voltage DBHV / Analog
buffered head voltage ABHV pin (gain 5)
s
Thermal asperity detection with adjustable
sensitivity level (6 bit DAC)
s
Thermal asperity correction
s
Read head open/short detection
s
Low supply detect and temperature monitoring
(high temperature warning and Analog
Temperature
s
Diode Voltage measurement)
s
Low write frequency detection
s
WRITE to READ fast recovery 250ns (same
head, including 150ns blanking period)
s
GMR Low-Bias in WRITE mode with fast
recovery to READ mode bias (250ns)
s
Head-to-head switch in READ mode - 10
s (typ)
s
Head and MR bias current switching transient
current head protection
s
READ-to-WRITE switching 30ns (same head)
s
Programmable read bias during write and bank
write operation
s
ESD diodes for GMR protections
s
Differential Write Driver to minimize coupling to
GMR element
DESCRIPTION
The L6326 is a two channel BICMOS monolithic inte-
grated circuit GMR pre-amplifier designed for use
with four-terminal magneto-resistive (AMR and GMR
heads) read/inductive write heads. The device con-
sists of a voltage sense current bias or voltage bias
(selectable), single ended input/ true differential out-
put (RDX, RDY), low-noise high bandwidth read am-
plifier and includes fast current switching write drivers
which support data rates up to 500 Mb/s with 90nH
write heads.
The GMR pre-amplifier provides programmable read
current/voltage bias and write current (5 bit DACs),
fault detection circuitry and servo writing features.
Read amplifier gain, write current wave shape (over-
shoot and damping) can be adjusted and a thermal
asperity detection and correction circuit can be en-
abled and programmed with different thresholds (6
bit DAC) through a 16-bit bi-directional serial inter-
face (SDEN, SDATA, SCLK). The device operates
from a +5V supply and a +8V supply (typical) for the
write drivers. No external components are required if
the internal trimmed resistor for reference current
setting is selected.
TSSOP24
ORDERING NUMBER: L6326
PRODUCT PREVIEW
2 CHANNEL VOLTAGE SENSE AMR/GMR PREAMPLIFIERS
L6326
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Figure 1. Preamplifier block diagram
R/W
HW0Y
HW1Y
HR0
PREDRIVER
WRITE
DRIVERS
VCC (+5V)
VGND (0V)
VDD (+8V)
WDX
WDY
FLT
SDATA
SCLK
SDEN
MRR
ABHV/
ADTV
RDX
RDY
RREF/NC
HGND
HW0X
HW1X
HR 1
FAULT PROCESSOR
Low supply detection,
Open/short heads,
TA detection,
low write frequency,
high temperature
SERIAL INTERFACE
CONTROL
HEAD SELECTION
&
MODE CONTROL
3v
VREF
MR
READ
INPUT
STAGES
Imr, Iwr
RW enable
head select
WRITE
DAC
READ
DAC
Rd
a
m
p
O
v
er
s
hoo
t
lo
w
b
i
a
s
TA detection,
TA correction
ABHV,
MR meas
Temperature
monitoring
Gain
boost
3v
3v
c
u
rre
n
t
/v
o
lta
g
e
L 6326
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L6326
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.00
1.05
0.031
0.039
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.003
0.008
D
7.70
7.80
7.90
0.303
0.307
0.311
E
6.40
0.252
E1
4.30
4.40
4.50
0.170
0.173
0.177
e
0.65
0.025
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.00
0.039
k
0 min., 8 max.
TSSOP24
7100777 (JEDEC MO-153-AD)
Thin Shrink Small Outline Package
OUTLINE AND
MECHANICAL DATA
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
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L6326