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Электронный компонент: L6327

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L6327
L6332
February 2001
This is preliminary information on a new product now in development. Details are subject to change without notice.
s
Power Supplies +5Vdc, -5Vdc
s
Current bias or voltage bias (selectable) /
Differential Voltage Sense architecture
s
6 or 4 channel versions
s
38-pin TSSOP package (for either 6 or 4
channels)
s
Internal reference Resistor for read and write
currents
s
Read channel -3dB bandwidth > 400MHz
(Rmr=50 ohm no interconnect)
s
Input equivalent preamplifier voltage noise
0.5nV/rtHz nominal
s
Input equivalent MR bias current noise 10 pA/
rtHz nominal
s
MR bias current programmable (5 bit DAC) 1.5-
7.0mA nominal MR bias voltage programmable
(5 bit DAC) 65-335mV nominal
s
Programmable gain (100V/V, 150, 200 and
250V/V) and read bandwidth
s
Write frequency up to 300 MHz (Lh=70nH,
Rh=20 ohms, Ch=2pF, VEE=-5V)
s
Rise/Fall time 0.6ns ( Iw =40mA 0-pk, Lh=70nH,
Rh=20 ohms, Ch=2pF, VEE=-5V)
s
Write current programmable (5 bit DAC) 15-60mA
s
PECL write data input
s
Bi-directional 16-bit TTL Serial interface for
head selection, read/write currents selection,
chip parameters modification, chip enable,
vendor code and fault status read back registers
s
2-pin mode selection (R/W, MRR)
s
Bank write feature for servo write
s
Digital buffered head voltage DBHV / Analog
buffered head voltage ABHV pin (gain 5)
s
Thermal asperity detection & correction with
adjustable sensitivity level (6 bit DAC)
s
Automatic successive approximation digital
measurement of temperature and Rmr (7 bits)
s
Read and write head open/short detection, low
low supply detect and temperature monitoring
(high temperature warning and Analog
Temperature Diode Voltage measurement)
s
Low write frequency detection.
s
WRITE to READ fast recovery 150ns (same
head, including 100ns blanking period)
s
Head-to-head switch in READ mode - 10
s (nom)
s
Head and MR bias current switching transient
current head protection
s
READ-to-WRITE switching 50ns (same head)
s
Programmable read bias during write and bank
write operation
s
ESD diode for GMR head protection
DESCRIPTION
L6327/L6332 is a BICMOS monolithic integrated cir-
cuit GMR differential preamplifier designed for use
with four-terminal magneto-resistive GMR read/in-
ductive write heads. It is available as either a six
(L6327) or four (L6332) channel device. The devices
consist of a voltage-sense, current-bias or voltage-
bias (selectable), differential input and differential
output, low-noise, high bandwidth read amplifier and
include fast current switching write drivers which sup-
port data rates in excess of 550 Mb/s with 70nH write
heads.
The GMR preamplifier provides programmable read
current / voltage bias and write current (5 bit DAC for
the read bias, 5 bit DAC for the write current), fault
detection circuitry and servo writing features. Read
amplifier gain, write current wave shape (overshoot,
undershoot and damping) can be adjusted and a
thermal asperity detection and correction circuit can
be enabled and programmed with different thresh-
olds (6 bit DAC) through a 16-bit bi-directional serial
interface (SDEN, SDATA, SCLK). The device oper-
ates from a +5V supply and a -5V supply (nominal).
No external components are required as a trimmed
or untrimmed resistor for reference current setting is
employed.
TSSOP38
ORDERING NUMBERS: L6327
L6332
PRODUCT PREVIEW
6 / 4 CHANNEL VOLTAGE SENSE GMR PREAMPLIFIER
L6327 - L6332
2/4
BLOCK DIAGRAM
R/W
HW0N
HW1/5N
PREDRIVER
WRITE
DRIVERS
VCC (+5V)
VGND (0V)
VEE (-5V)
WDP
WDN
FLT
SDATA
SCLK
SEN
MRR
ABHV/
ADTV
RDP
RDN
HW0P
HW1/5P
FAULT PROCESSOR
Low supply detection,
Open/short heads,
TA detection,
low write frequency,
high temperature
SERIAL INTERFACE
CONTROL
HEAD SELECTION
&
MODE CONTROL
3v
VREF
MR
READ
INPUT
STAGES
Imr, Iwr
RW enable
head select
WRITE
DAC
READ
DAC
R
dam
p
O
v
er
s
hoot,
U
nder
s
hhot
lo
w
bia
s
TA detection,
TA correction
ABHV,
MR meas
Temperature
monitoring
Gain boost,
Low pass filter
3v
3v
c
u
rre
n
t/v
o
l
ta
g
e
HR0P
HR0N
HR1/5P
HR1/5N
L6327/L6332 6/4 CH
High pass
filter
A2D
RMR, temp
3/4
L6327 - L6332
TSSOP38
Thin Shrink Small Outline Package
c
E1
k
A
b
e
D
E
Pin 1 identification
19
38
20
TSSO3 8M
Gage Plane
0.25mm
L
0.010 mm
A1
SEATING PLANE
0.004 inch
SEATING PLANE
A2
A1
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.10
0.043
A1
0.05
0.15
0.002
0.006
A2
0.85
0.90
0.95
0.033
0.035
0.037
b
0.17
0.27
0.007
0.011
c
0.09
0.20
0.0035
0.008
D
9.60
9.70
9.80
0.378
0.382
0.386
E
6.40
0.252
e
0.50
0.020
E1
4.30
4.40
4.50
0.169
0.173
0.177
L
0.50
0.60
0.70
0.020
0.024
0.028
k
0 (min.) 8 (max.)
OUTLINE AND
MECHANICAL DATA
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
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L6327 - L6332