Rev 1

September 2005

CD00068498

1/17

LIS3L06AL

MEMS INERTIAL SENSOR:

3-axis - +/-2g/6g ULTRACOMPACT LINEAR ACCELEROMETER

Features

2.4V TO 3.6V SINGLE SUPPLY OPERATION

LOW POWER CONSUMPTION

2g/

6g USER SELECTABLE FULL-SCALE

0.5mg RESOLUTION OVER 100Hz
BANDWIDTH

EMBEDDED SELF TEST

OUTPUT VOLTAGE, OFFSET AND
SENSITIVITY RATIOMETRIC TO THE
SUPPLY VOLTAGE

HIGH SHOCK SURVIVABILITY

ECO-PACK COMPLIANT

Description

The LIS3L06AL is a low-power 3-axis linear
capacitive accelerometer that includes a sensing
element and an IC interface able to take the
information from the sensing element and to
provide an analog signal to the external world.

The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
process developed by ST to produce inertial
sensors and actuators in silicon.

The IC interface is manufactured using a standard
CMOS process that allows high level of integration

to design a dedicated circuit which is trimmed to
better match the sensing element characteristics.

The LIS3L06AL has a dynamically selectable full
scale of

2g/

6g and it is capable of measuring

accelerations over a bandwidth of 1.5 kHz for all
axes. The device bandwidth may be reduced by
using external capacitances. A self-test capability
allows to check the mechanical and electrical
signal path of the sensor.

The LIS3L06AL is available in plastic SMD
package and it is guaranteed to operate over an
extended temperature range of -40°C to +85°C.

The LIS3L06AL belongs to a family of products
suitable for a variety of applications:

Mobile terminals

Gaming and Virtual Reality input devices

Free-fall detection for data protection

Antitheft systems and Inertial Navigation

Appliance and Robotics.

Order codes

LGA-8

Part number

Temp range,

°C

Package

Packing

LIS3L06AL

-40°C to +85°C

LGA-8

Tray

LIS3L06ALTR

-40°C to +85°C

LGA-8

Tape & Reel

www.st.com

LIS3L06AL

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CD00068498

Contents

Block Diagram & Pins Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Mechanical and Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1

Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.4

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1

Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2

IC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.3

Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.1

Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.2

Output Response vs Orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.1

Mechanical Characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.2

Mechanical Characteristics derived from measurement in the
-40°C to +85°C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.3

Electrical characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

LIS3L06AL

2 Mechanical and Electrical Specifications

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Mechanical and Electrical Specifications

2.1 Mechanical

Characteristics.

Table 2.

Mechanical Characteristics

(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V,
T = 25°C unless otherwise noted

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Acceleration Range

Full-scale = 2g

±1.8

±2.0

Full-scale = 6g

±5.4

±6.0

Sensitivity

Full-scale = 2g

Vdd/510%

Vdd/5

Vdd/5+10%

V/g

Full-scale = 6g

Vdd/1510%

Vdd/15

Vdd/15+10%

V/g

SoDr

Sensitivity Change Vs
Temperature

Delta from +25°C

±0.01

%/°C

Voff

Zero-g Level

T = 25°C

Vdd/2-6%

Vdd/2

Vdd/2+6%

OffDr

Zero-g level Change Vs
Temperature

Delta from +25°C

±0.5

mg/°C

Non Linearity

Best fit straight line

Full-scale = 2g

X, Y axis

±0.3

±1.5

Best fit straight line

Full-scale = 2g

Z axis

±0.5

±1.5

CrossAx Cross-Axis

±2

±4

Acceleration Noise
Density

Vdd=3.3V;

Full-scale = 2g

µg/

Self test Output Voltage

Change

7,8,9

T = 25°C

Vdd=3.3V

Full-scale = 2g

X axis

-20

-50

-100

T = 25°C

Vdd=3.3V

Full-scale = 2g

Y axis

100

T = 25°C

Vdd=3.3V

Full-scale = 2g

Z axis

100

Fres

Sensing Element

Resonance Frequency

all axes

1.5

kHz

H z

2 Mechanical and Electrical Specifications

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CD00068498

Note: 1 The product is factory calibrated at 3.3V. The device can be powered from 2.4V to 3.6V. Voff, So

and Vt parameters will vary with supply voltage.

2 Typical specifications are not guaranteed

3 Guaranteed by wafer level test and measurement of initial offset and sensitivity

4 Zero-g level and sensitivity are essentially ratiometric to supply voltage

5 Guaranteed by design

6 Contribution to the measuring output of the inclination/acceleration along any perpendicular axis

7 Self test "output voltage change" is defined as Vout

(Vst=Logic1)

-Vout

(Vst=Logic0)

8 Self test "output voltage change" varies cubically with supply voltage

9 When Full Scale is set to

6g, "self test output change" is one third of the corresponding

2g range.

10 Minimum resonance frequency Fres=1.5kHz. Sensor bandwidth=1/(2*

*110k

*Cload) with

Cload>1nF.

2.2 Electrical

Characteristics

Note: 1 The product is factory calibrated at 3.3V

2 Typical specifications are not guaranteed
3 Minimum resonance frequency Fres=1.5KHz. Sensor bandwidth=1/(2*

*110k

*Cload) with

Cload>1nF

Top

Operating Temperature
Range

-40

+85

°C

Product Weight

0.08

gram

Table 3.

Electrical Characteristics

(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V, T=25°C
unless otherwise noted

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

Vdd

Supply Voltage

2.4

3.3

3.6

Idd

Supply Current

mean value

0.95

1.5

Vst

Self Test Input

Logic 0 level

0.3*Vdd

Logic 1 level

0.7*Vdd

Vdd

Vfs

Full Scale Input

Logic 0 level

0.3*Vdd

Logic 1 level

0.7*Vdd

Vdd

Rout

Output Impedance

110

140

Cload

Capacitive Load Drive

Top

Operating Temperature
Range

-40

+85

°C

Table 2.

Mechanical Characteristics

(continued)

(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V,
T = 25°C unless otherwise noted

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

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2 Mechanical and Electrical Specifications

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2.3 Absolute

maximum

ratings

Stresses above those listed as "absolute maximum ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.

Table 4.

Absolute maximum ratings

2.4 Terminology

Sensitivity describes the gain of the sensor and can be determined by applying 1g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the earth, note the output value, rotate the
sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1g
acceleration to the sensor. Subtracting the larger output value from the smaller one and dividing
the result by 2 will give the actual sensitivity of the sensor. This value changes very little over
temperature (see sensitivity change vs. temperature) and also very little over time. The
Sensitivity Tolerance describes the range of Sensitivities of a large population of sensors.

Zero-g level describes the actual output signal if there is no acceleration present. A sensor in a
steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis. The output is
ideally for a 3.3V powered sensor Vdd/2 = 1650mV. A deviation from ideal 0-g level (1650mV in
this case) is called Zero-g offset. Offset of precise MEMS sensors is to some extend a result of
stress to the sensor and therefore the offset can slightly change after mounting the sensor onto
a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over
temperature - see "Zero-g level change vs. temperature" - the Zero-g level of an individual
sensor is very stable over lifetime. The Zero-g level tolerance describes the range of Zero-g
levels of a population of sensors.

Symbol

Ratings

Maximum Value

Unit

Vdd

Supply voltage

-0.3 to 7

Vin

Input Voltage on Any Control pin (ST, FS)

-0.3 to Vdd +0.3

POW

Acceleration (Any axis, Powered, Vdd=3.3V)

3000g for 0.5 ms

10000g for 0.1 ms

UNP

Acceleration (Any axis, Not powered)

3000g for 0.5 ms

10000g for 0.1 ms

STG

Storage Temperature Range

-40 to +125

°C

ESD

Electrostatic Discharge Protection

2kV HBM

200V MM

1500V CDM

This is a Mechanical Shock sensitive device, improper handling can cause
permanent damages to the part

This is an ESD sensitive device, improper handling can cause permanent damages
to the part

2 Mechanical and Electrical Specifications

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CD00068498

Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic
mass to be moved by means of an electrostatic test-force. The Self Test function is off when the
ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force is applied to the
sensor, simulating a definite input acceleration. In this case the sensor outputs will exhibit a
voltage change in their DC levels which is related to the selected full scale and depending on
the Supply Voltage through the device sensitivity. When ST is activated, the device output level
is given by the algebraic sum of the signals produced by the acceleration acting on the sensor
and by the electrostatic test-force. If the output signals change within the amplitude specified
inside Table 2, than the sensor is working properly and the parameters of the interface chip are
within the defined specification.

Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 1nF and the internal
resistor. Due to the high resistor level only small, inexpensive external capacitors are needed to
generate low corner frequencies. When interfacing with an ADC it is important to use high input
impedance input circuitries to avoid measurement errors. Note that the minimum load
capacitance forms a corner frequency beyond the resonance frequency of the sensor. For a flat
frequency response a corner frequency well below the resonance frequency is recommended.
In general the smallest possible bandwidth for an particular application should be chosen to get
the best results.

LIS3L06AL

3 Functionality

CD00068498

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3 Functionality

The LIS3L06AL is a high performance, low-power, analog output 3-axis linear accelerometer
packaged in a LGA package. The complete device includes a sensing element and an IC
interface able to take the information from the sensing element and to provide an analog signal
to the external world.

3.1 Sensing

element

A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the substrate
in a few points called anchors and are free to move in the direction of the sensed acceleration.
To be compatible with the traditional packaging techniques a cap is placed on top of the
sensing element to avoid blocking the moving parts during the moulding phase of the plastic
encapsulation.

When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured using
charge integration in response to a voltage pulse applied to the sense capacitor.

At steady state the nominal value of the capacitors are few pF and when an acceleration is
applied the maximum variation of the capacitive load is up to 100fF.

3.2 IC

Interface

In order to increase robustness and immunity against external disturbances the complete signal
processing chain uses a fully differential structure. The final stage converts the differential
signal into a single-ended one to be compatible with the external world.

The signals of the sensing element are multiplexed and fed into a low-noise capacitive charge
amplifier that implements a Correlated Double Sampling system (CDS) at its output to cancel
the offset and the 1/f noise. The output signal is de-multiplexed and transferred to three
different S&Hs, one for each channel and made available to the outside.

The low noise input amplifier operates at 200 kHz while the three S&Hs operate at a sampling
frequency of 66 kHz. This allows a large oversampling ratio, which leads to in-band noise
reduction and to an accurate output waveform.

All the analog parameters (Zero-g level, sensitivity and self-test) are ratiometric to the supply
voltage. Increasing or decreasing the supply voltage, the sensitivity and the offset will increase
or decrease almost linearly. The self test voltage change varies cubically with the supply
voltage.

3.3 Factory

calibration

The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).
The trimming values are stored inside the device by a non volatile structure. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be employed
during the normal operation. This allows the user to employ the device without further
calibration.

4 Application hints

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CD00068498

4 Application

hints

Figure 3.

LIS3L06AL Electrical Connection

Power supply decoupling capacitors (100nF ceramic or polyester + 10

µF Aluminum) should be

placed as near as possible to the device (common design practice).

The LIS3L06AL allows to band limit Voutx, Vouty and Voutz through the use of external
capacitors. The re-commended frequency range spans from DC up to 1.5 KHz. In particular,
capacitors must be added at output pins to implement low-pass filtering for antialiasing and
noise reduction. The equation for the cut-off frequency (f

) of the external filters is:

Taking in account that the internal filtering resistor (R

out

) has a nominal value equal to 110k

the equation for the external filter cut-off frequency may be simplified as follows:

The tolerance of the internal resistor can vary typically of

20% within its nominal value of

110k

; thus the cut-off frequency will vary accordingly. A minimum capacitance of 1nF for

load

(x, y, z) is required in any case.

DIRECTION OF THE
DETECTABLE
ACCELERATIONS

Digital signals

Vout Z

Cload z

Optional

Vout Y

100nF

Cload y

LIS3L06AL

µF

Vdd

Vout X

GND

Cload x

(top view)

Optional

GND

o ut

l oa d

x y z

, ,

(

)

----------------------------------------------------------------

1.45

µF

l oa d

x y z

, ,

(

)

----------------------------------- Hz

[

]

LIS3L06AL

4 Application hints

CD00068498

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Table 5.

Filter Capacitor Selection, C

load

(x,y,z).

4.1 Soldering

information

The LGA-8 package is compliant with the ECOPACK,RoHs and "Green" standard.It is qualified
for soldering heat resistance according to JEDEC J-STD-020C.

Pin 1 indicator is electrically connected to ST pin. Leave pin 1 indicator unconnected during
soldering.

Land pattern and soldering recommendations are available upon request.

4.2

Output Response vs Orientation

Figure 4.

Output response vs Orientation

Figure 4 refers to LIS3L06AL device powered at 3.3V.

Cut-off frequency

Capacitor value

1 Hz

1500 nF

10 Hz

150 nF

20 Hz

68 nF

50 Hz

30 nF

100 Hz

15 nF

200 Hz

6.8 nF

500 Hz

3 nF

X=1.65V (0g)
Y=1.65V (0g)
Z=2.31V (+1g)

X=1.65V (0g)
Y=1.65V (0g)
Z=0.99V (-1g)

TOP VIEW

X=1.65V(0g)
Y=0.99V (-1g)

Earth's Surface

X=1.65V(0g)
Y=2.31V (+1g)

X=2.31V (+1g)
Y=1.65V (0g)

X=0.99V (-1g)
Y=1.65V (0g)

Z=1.65V (0g)

Top

Bottom

Top

Bottom

5 Typical performance characteristics

LIS3L06AL

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CD00068498

5 Typical

performance

characteristics

5.1

Mechanical Characteristics at 25°C

Figure 5.

x-axis Zero-g level at 3.3V

Figure 6.

y-axis Zero-g level at 3.3V

Figure 7.

z-axis Zero-g level at 3.3V

Figure 8.

x-axis sensitivity at 3.3V

Figure 9.

y-axis sensitivity at 3.3V

Figure 10. z-axis sensitivity at 3.3V

1.55

1.6

1.65

1.7

1.75

Zero-g Level (V)

Percent of parts (%)

1.55

1.6

1.65

1.7

1.75

Zero-g Level (V)

Percent of parts (%)

1.55

1.6

1.65

1.7

1.75

Zero-g Level (V)

Percent of parts (%)

0.62

0.63

0.64

0.65

0.66

0.67

0.68

0.69

0.7

Sensitivity (V/g)

Percent of parts (%)

0.62

0.63

0.64

0.65

0.66

0.67

0.68

0.69

0.7

Sensitivity (V/g)

Percent of parts (%)

0.62

0.63

0.64

0.65

0.66

0.67

0.68

0.69

0.7

Sensitivity (V/g)

Percent of parts (%)

LIS3L06AL

5 Typical performance characteristics

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5.2

Mechanical Characteristics derived from measurement in the
-40°C to +85°C temperature range

Figure 11. x-axis Zero-g level change Vs

temperature

Figure 12. y-axis Zero-g level change Vs

temperature

Figure 13. z-axis Zero-g level change Vs

temperature

Figure 14. x-axis sensitivity change Vs

temperature

Figure 15. y-axis sensitivity change Vs

temperature

Figure 16. z-axis sensitivity change Vs

temperature

-1

-0.5

0.5

Zero-g level change (mg/deg. C)

Percent of parts (%)

-1

-0.5

0.5

Zero-g level change (mg/deg. C)

Percent of parts (%)

-2

-1.5

-1

-0.5

Zero-g level change (mg/deg. C)

Percent of parts (%)

-0.05

-0.04

-0.03

-0.02

-0.01

0.01

0.02

0.03

Sensitivity Change(%/deg. C)

Percent of parts (%)

-0.05

-0.04

-0.03

-0.02

-0.01

0.01

0.02

0.03

Sensitivity Change (%/deg. C)

Percent of parts (%)

-0.05

-0.04

-0.03

-0.02

-0.01

0.01

0.02

0.03

Sensitivity Change (%/deg. C)

Percent of parts (%)

5 Typical performance characteristics

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CD00068498

5.3

Electrical characteristics at 25°C

Figure 17. Noise density at 3.3V (x,y axis)

Figure 18. Noise density at 3.3V (z axis)

Figure 19. Current Consumption at 3.3V

Noise density (ug/sqrt(Hz))

Percent of parts (%)

Noise density (ug/sqrt(Hz))

Percent of parts (%)

0.4

0.6

0.8

1.2

1.4

1.6

current consumption (mA)

Percent of parts (%)

LIS3L06AL

6 Package Information

CD00068498

15/17

6 Package

Information

In order to meet environmental requirements, ST offers these devices in ECOPACK

packages.

These packages have a Lead-free second level interconnect. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 20. LGA-8 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.460

1.520

1.600 0.0574 0.0598 0.0629

1.330

0.0523

0.180

0.220

0.260

0.007 0.0086 0.0102

4.850

5.000

5.150

0.190 0.1968 0.2027

4.850

5.000

5.150

0.190 0.1968 0.2027

1.270

0.05

2.540

0.1

1.225

0.0482

0.875

0.900

0.925 0.0344 0.0354 0.0364

2.000

0.0787

1.225

0.0482

1.170

0.046

1.300

1.350

1.400 0.0511 0.0531 0.0551

0.740

0.790

0.840 0.0291 0.0311 0.033

1.170

0.046

0.615

0.640

0.665 0.0242 0.0251 0.0261

1.200

1.600 0.0472

0.0629

0.150

0.0059

0.050

0.0019

0.100

0.0039

LGA8 (5x5x1.6mm)

Land Grid Array Package

7669231 C

DETAIL A

(4x)

Detail A

seating plane

= =

A
C

SOLDER MASK
OPENING

METAL PAD

LIS3L06AL

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17/17

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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Document Outline

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Document Outline

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