DD.M14C32/9811V1.1
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M14C32 DD
M14C32 Die Description
PRODUCT
M14C32
s
WAFER SIZE
152 mm (6 inches)
s
DIE IDENTIFICATION M14C32KA_R
s
DIE SIZE (X x Y)
2040 x 2355 m
s
SCRIBE LINE
100.5 x 101.7 m
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PAD OPENING
100 x 100 m
DIE LAYOUT
s
DI
Die Identification (at the position shown in Figure 1)
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C1, C2, C3, C5, C7
Pad contacts to the ISO pins (at the positions shown in Figure 1)
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C4, C6, C8
These ISO pins do not appear on the M14C32 die
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NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in m).
Figure 1. M14C32 Die Plot
AI02495
C3: SCL
(X= 837.28; Y= 904.24)
C7: SDA (X= 649.92; Y= +993.44)
DI
NC: TEST
NC: TEST
NC: TEST
C5: GND (X= +718.0; Y= +1010.0)
C2: WC
(X= 648.48; Y= 993.6)
C1: VCC (X= +650.08; Y= 993.76)
M14C32 DD
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