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Электронный компонент: M27W201-120N6TR

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1/16
October 2001
M27W201
2 Mbit (256Kb x 8) Low Voltage UV EPROM and OTP EPROM
s
2.7V to 3.6V LOW VOLTAGE in READ
OPERATION
s
ACCESS TIME:
70ns at V
CC
= 3.0V to 3.6V
80ns at V
CC
= 2.7V to 3.6V
s
PIN COMPATIBLE with M27C2001
s
LOW POWER CONSUMPTION:
15A max Standby Current
15mA max Active Current at 5MHz
s
PROGRAMMING TIME 100s/byte
s
HIGH RELIABILITY CMOS TECHNOLOGY
2,000V ESD Protection
200mA Latchup Protection Immunity
s
ELECTRONIC SIGNATURE
Manufacturer Code: 20h
Device Code: 61h
DESCRIPTION
The M27W201 is a low voltage 2 Mbit EPROM of-
fered in the two range UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited
for microprocessor systems requiring large data or
program storage and is organised as 262,144 by 8
bits.
The M27W201 operates in the read mode with a
supply voltage as low as 2.7V at 40 to 85C tem-
perature range. The decrease in operating power
allows either a reduction of the size of the battery
or an increase in the time between battery re-
charges.
The FDIP32W (window ceramic frit-seal package)
has a transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For application where the content is programmed
only one time and erasure is not required, the
M27W201 is offered in PDIP32, PLCC32 and
TSOP32 (8 x 20mm and 8 x 14mm) packages.
Figure 1. Logic Diagram
AI01359
18
A0-A17
P
Q0-Q7
VPP
VCC
M27W201
G
E
VSS
8
1
32
32
1
FDIP32W (F)
PDIP32 (B)
PLCC32 (K)
TSOP32 (N)
8 x 20 mm
TSOP32 (NZ)
8 x 14 mm
M27W201
2/16
Figure 2B. LCC Connections
AI01360
A17
A8
A10
Q5
17
A1
A0
Q0
Q1
Q2
Q3
Q4
A7
A4
A3
A2
A6
A5
9
P
A9
1
A16
A11
A13
A12
Q7
32
V
PP
V
CC
M27W201
A15
A14
Q6
G
E
25
V
SS
Figure 2A. DIP Connections
A1
A0
Q0
A7
A4
A3
A2
A6
A5
A13
A10
A8
A9
Q7
A14
A11
G
E
Q5
Q1
Q2
Q3
VSS
Q4
Q6
A17
P
A16
A12
VPP
VCC
A15
AI02675
M27W201
8
1
2
3
4
5
6
7
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Table 1. Signal Names
A0-A17
Address Inputs
Q0-Q7
Data Outputs
E
Chip Enable
G
Output Enable
P
Program
V
PP
Program Supply
V
CC
Supply Voltage
V
SS
Ground
Figure 2C. TSOP Connections
A1
A0
Q0
A7
A4
A3
A2
A6
A5
A13
A10
A8
A9
Q7
A14
A11
G
E
Q5
Q1
Q2
Q3
Q4
Q6
A17
P
A16
A12
VPP
VCC
A15
AI01361
M27W201
8
1
9
16
17
24
25
32
VSS
3/16
M27W201
Table 2. Absolute Maximum Ratings
(1)
Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-
ity documents.
2. Minimum DC voltage on Input or Output is 0.5V with possible undershoot to 2.0V for a period less than 20ns. Maximum DC
voltage on Output is V
CC
+0.5V with possible overshoot to V
CC
+2V for a period less than 20ns.
3. Depends on range.
Table 3. Operating Modes
Note: X = V
IH
or V
IL
, V
ID
= 12V 0.5V.
Table 4. Electronic Signature
Symbol
Parameter
Value
Unit
T
A
Ambient Operating Temperature
(3)
40 to 125
C
T
BIAS
Temperature Under Bias
50 to 125
C
T
STG
Storage Temperature
65 to 150
C
V
IO
(2)
Input or Output Voltage (except A9)
2 to 7
V
V
CC
Supply Voltage
2 to 7
V
V
A9
(2)
A9 Voltage
2 to 13.5
V
V
PP
Program Supply Voltage
2 to 14
V
Mode
E
G
P
A9
V
PP
Q7-Q0
Read
V
IL
V
IL
X
X
V
CC
or V
SS
Data Out
Output Disable
V
IL
V
IH
X
X
V
CC
or V
SS
Hi-Z
Program
V
IL
V
IH
V
IL
Pulse
X
V
PP
Data In
Verify
V
IL
V
IL
V
IH
X
V
PP
Data Out
Program Inhibit
V
IH
X
X
X
V
PP
Hi-Z
Standby
V
IH
X
X
X
V
CC
or V
SS
Hi-Z
Electronic Signature
V
IL
V
IL
V
IH
V
ID
V
CC
Codes
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer's Code
V
IL
0
0
1
0
0
0
0
0
20h
Device Code
V
IH
0
1
1
0
0
0
0
1
61h
M27W201
4/16
DEVICE OPERATION
The operating modes of the M27W201 are listed in
the Operating Modes table. A single power supply
is required in the read mode. All inputs are TTL
levels except for V
PP
and 12V on A9 for Electronic
Signature.
Read Mode
The M27W201 has two control functions, both of
which must be logically active in order to obtain
data at the outputs. Chip Enable (E) is the power
control and should be used for device selection.
Output Enable (G) is the output control and should
be used to gate data to the output pins, indepen-
dent of device selection. Assuming that the ad-
dresses are stable, the address access time
(t
AVQV
) is equal to the delay from E to output
(t
ELQV
). Data is available at the output after a delay
of t
GLQV
from the falling edge of G, assuming that
E has been low and the addresses have been sta-
ble for at least t
AVQV
-t
GLQV
.
Standby Mode
The M27W201 has a standby mode which reduc-
es the supply current from 15mA to 15A with low
voltage operation V
CC
3.6V, see Read Mode DC
Characteristics table for details.The M27W201 is
placed in the standby mode by applying a CMOS
high signal to the E input. When in the standby
mode, the outputs are in a high impedance state,
independent of the G input.
Table 5. AC Measurement Conditions
High Speed
Standard
Input Rise and Fall Times
10ns
20ns
Input Pulse Voltages
0 to 3V
0.4V to 2.4V
Input and Output Timing Ref. Voltages
1.5V
0.8V and 2V
Figure 3. AC Testing Input Output Waveform
AI01822
3V
High Speed
0V
1.5V
2.4V
Standard
0.4V
2.0V
0.8V
Figure 4. AC Testing Load Circuit
AI01823B
1.3V
OUT
CL
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
3.3k
1N914
DEVICE
UNDER
TEST
Table 6. Capacitance
(1)
(T
A
= 25 C, f = 1 MHz)
Note: 1. Sampled only, not 100% tested.
Symbol
Parameter
Test Condition
Min
Max
Unit
C
IN
Input Capacitance
V
IN
= 0V
6
pF
C
OUT
Output Capacitance
V
OUT
= 0V
12
pF
5/16
M27W201
Table 7. Read Mode DC Characteristics
(1)
(T
A
= 40 to 85 C; V
CC
= 2.7V to 3.6V; V
PP
= V
CC
)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Maximum DC voltage on Output is V
CC
+0.5V.
Symbol
Parameter
Test Condition
Min
Max
Unit
I
LI
Input Leakage Current
0V
V
IN
V
CC
10
A
I
LO
Output Leakage Current
0V
V
OUT
V
CC
10
A
I
CC
Supply Current
E = V
IL
, G = V
IL
,
I
OUT
= 0mA, f = 5MHz
V
CC
3.6
V
15
mA
I
CC
1
Supply Current (Standby) TTL
E = V
IH
1
mA
I
CC
2
Supply Current (Standby) CMOS
E > V
CC
0.2V
V
CC
3.6
V
15
A
I
PP
Program Current
V
PP
= V
CC
10
A
V
IL
Input Low Voltage
0.6
0.2 V
CC
V
V
IH
(2)
Input High Voltage
0.7 V
CC
V
CC
+ 0.5
V
V
OL
Output Low Voltage
I
OL
= 2.1mA
0.4
V
V
OH
Output High Voltage TTL
I
OH
= 400A
2.4
V
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
CC
, has three seg-
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
capacitive and inductive loading of the device at
the output.
The associated transient voltage peaks can be
suppressed by complying with the two line output
control and by properly selected decoupling ca-
pacitors. It is recommended that a 0.1F ceramic
capacitor be used on every device between V
CC
and V
SS
. This should be a high frequency capaci-
tor of low inherent inductance and should be
placed as close to the device as possible. In addi-
tion, a 4.7F bulk electrolytic capacitor should be
used between V
CC
and V
SS
for every eight devic-
es. The bulk capacitor should be located near the
power supply connection point. The purpose of the
bulk capacitor is to overcome the voltage drop
caused by the inductive effects of PCB traces.
Two Line Output Control
Because EPROMs are usually used in larger
memory arrays, this product features a 2 line con-
trol function which accommodates the use of mul-
tiple memory connection. The two line control
function allows:
a. the lowest possible memory power dissipation,
b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
M27W201
6/16
Figure 5. Read Mode AC Waveforms
AI00719B
tAXQX
tEHQZ
A0-A17
E
G
Q0-Q7
tAVQV
tGHQZ
tGLQV
tELQV
VALID
Hi-Z
VALID
Table 8. Read Mode AC Characteristics
(1)
(T
A
= 40 to 85 C; V
CC
= 2.7V to 3.6V; V
PP
= V
CC
)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Sampled only, not 100% tested.
3. Speed obtained with High Speed AC measurement conditions.
Symbol
Alt
Parameter
Test
Condition
M27W201
Unit
-80
(3)
-100
(-120/-150/-200)
V
CC
= 3.0V to 3.6V V
CC
= 2.7V to 3.6V V
CC
= 2.7V to 3.6V
Min
Max
Min
Max
Min
Max
t
AVQV
t
ACC
Address Valid to
Output Valid
E = V
IL
,
G = V
IL
70
80
100
ns
t
ELQV
t
CE
Chip Enable Low to
Output Valid
G = V
IL
70
80
100
ns
t
GLQV
t
OE
Output Enable Low
to Output Valid
E = V
IL
40
50
60
ns
t
EHQZ
(2)
t
DF
Chip Enable High to
Output Hi-Z
G = V
IL
0
40
0
50
0
60
ns
t
GHQZ
(2)
t
DF
Output Enable High
to Output Hi-Z
E = V
IL
0
40
0
50
0
60
ns
t
AXQX
t
OH
Address Transition
to Output Transition
E = V
IL
,
G = V
IL
0
0
0
ns
7/16
M27W201
Table 9. Programming Mode DC Characteristics
(1)
(T
A
= 25 C; V
CC
= 6.25V 0.25V; V
PP
= 12.75V 0.25V)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
Table 10. Programming Mode AC Characteristics
(1)
(T
A
= 25 C; V
CC
= 6.25V 0.25V; V
PP
= 12.75V 0.25V)
Note: 1. V
CC
must be applied simultaneously with or before V
PP
and removed simultaneously or after V
PP
.
2. Sampled only, not 100% tested.
Symbol
Parameter
Test Condition
Min
Max
Unit
I
LI
Input Leakage Current
0
V
IN
V
CC
10
A
I
CC
Supply Current
50
mA
I
PP
Program Current
E = V
IL
50
mA
V
IL
Input Low Voltage
0.3
0.8
V
V
IH
Input High Voltage
2
V
CC
+ 0.5
V
V
OL
Output Low Voltage
I
OL
= 2.1mA
0.4
V
V
OH
Output High Voltage TTL
I
OH
= 400A
2.4
V
V
ID
A9 Voltage
11.5
12.5
V
Symbol
Alt
Parameter
Test Condition
Min
Max
Unit
t
AVPL
t
AS
Address Valid to Program Low
2
s
t
QVPL
t
DS
Input Valid to Program Low
2
s
t
VPHPL
t
VPS
V
PP
High to Program Low
2
s
t
VCHPL
t
VCS
V
CC
High to Program Low
2
s
t
ELPL
t
CES
Chip Enable Low to Program Low
2
s
t
PLPH
t
PW
Program Pulse Width
95
105
s
t
PHQX
t
DH
Program High to Input Transition
2
s
t
QXGL
t
OES
Input Transition to Output Enable Low
2
s
t
GLQV
t
OE
Output Enable Low to Output Valid
100
ns
t
GHQZ
(2)
t
DFP
Output Enable High to Output Hi-Z
0
130
ns
t
GHAX
t
AH
Output Enable High to Address
Transition
0
ns
ming '0's into the desired bit locations. Although
only '0's will be programmed, both '1's and '0's can
be present in the data word. The only way to
change a `0' to a `1' is by die exposure to ultraviolet
light (UV EPROM). The M27W201 is in the pro-
gramming mode when V
PP
input is at 12.75V, E is
at V
IL
and P is pulsed to V
IL
. The data to be pro-
grammed is applied to 8 bits in parallel to the data
output pins. The levels required for the address
and data inputs are TTL. V
CC
is specified to be
6.25V 0.25V.
Programming
The M27W201 has been designed to be fully com-
patible with the M27C2001 and has the same elec-
tronic signature. As a result the M27W201 can be
programmed as the M27C2001 on the same pro-
gramming equipment applying 12.75V on V
PP
and
6.25V on V
CC
by the use of the same PRESTO II
algorithm.
When delivered (and after each `1's erasure for UV
EPROM), all bits of the M27W201 are in the '1'
state.Data is introduced by selectively program-
M27W201
8/16
Figure 7. Programming Flowchart
AI00715D
n = 0
Last
Addr
VERIFY
P = 100
s Pulse
++n
= 25
++ Addr
VCC = 6.25V, VPP = 12.75V
FAIL
CHECK ALL BYTES
1st: VCC = 5V
2nd: VCC = 2.7V
YES
NO
YES
NO
YES
NO
PRESTO II Programming Algorithm
PRESTO II Programming Algorithm allows the
whole array to be programmed with a guaranteed
margin, in a typical time of 26.5 seconds. Pro-
gramming with PRESTO II consists of applying a
sequence of 100s program pulses to each byte
until a correct verify occurs (see Figure 7). During
programming and verify operation, a MARGIN
MODE circuit is automatically activated in order to
guarantee that each cell is programmed with
enough margin. No overprogram pulse is applied
since the verify in MARGIN MODE at V
CC
much
higher than 3.6V, provides the necessary margin
to each programmed cell.
Program Inhibit
Programming of multiple M27W201s in parallel
with different data is also easily accomplished. Ex-
cept for E, all like inputs including G of the parallel
M27W201 may be common. A TTL low level pulse
applied to a M27W201's P input, with E low and
V
PP
at 12.75V, will program that M27W201. A high
level E input inhibits the other M27W201s from be-
ing programmed.
Program Verify
A verify (read) should be performed on the pro-
grammed bits to determine that they were correct-
ly programmed. The verify is accomplished with E
and G at V
IL
, P at V
IH
, V
PP
at 12.75V and V
CC
at
6.25V.
Figure 6. Programming and Verify Modes AC Waveforms
tAVPL
VALID
AI00720
A0-A17
Q0-Q7
VPP
VCC
P
G
DATA IN
DATA OUT
E
tQVPL
tVPHPL
tVCHPL
tPHQX
tPLPH
tGLQV
tQXGL
tELPL
tGHQZ
tGHAX
PROGRAM
VERIFY
9/16
M27W201
ERASURE OPERATION (applies to UV EPROM)
The erasure characteristics of the M27W201 are
such that erasure begins when the cells are ex-
posed to light with wavelengths shorter than ap-
proximately 4000 . It should be noted that
sunlight and some type of fluorescent lamps have
wavelengths in the 3000-4000 range. Data
shows that constant exposure to room level fluo-
rescent lighting could erase a typical M27W201 in
about 3 years, while it would take approximately 1
week to cause erasure when exposed to direct
sunlight. If the M27W201 is to be exposed to these
types of lighting conditions for extended periods of
time, it is suggested that opaque labels be put over
the M27W201 window to prevent unintentional
erasure. The recommended erasure procedure for
the M27W201 is exposure to short wave ultraviolet
light which has wavelength of 2537 . The inte-
grated dose (i.e. UV intensity x exposure time) for
erasure should be a minimum of 15 W-sec/cm
2
.
The erasure time with this dosage is approximate-
ly 15 to 20 minutes using an ultraviolet lamp with
12000 W/cm
2
power rating. The M27W201
should be placed within 2.5 cm (1 inch) of the lamp
tubes during the erasure. Some lamps have a filter
on their tubes which should be removed before
erasure.
Electronic Signature
The Electronic Signature (ES) mode allows the
reading out of a binary code from an EPROM that
will identify its manufacturer and type. This mode
is intended for use by programming equipment to
automatically match the device to be programmed
with its corresponding programming algorithm.
The ES mode is functional in the 25C 5C am-
bient temperature range that is required when pro-
gramming the M27W201. To activate the ES
mode, the programming equipment must force
11.5V to 12.5V on address line A9 of the
M27W201 with V
PP
= V
CC
= 5V. Two identifier
bytes may then be sequenced from the device out-
puts by toggling address line A0 from V
IL
to V
IH
. All
other address lines must be held at V
IL
during
Electronic Signature mode. Byte 0 (A0 = V
IL
)
repres ents the manufacturer code and byte 1
(A0 = V
IH
) the device identifier code. For the ST-
Microelectronics M27W201, these two identifier
bytes are given in Table 4 and can be read-out on
outputs Q7 to Q0. Note that the M27W201 and
M27C2001 have the same identifier byte.
M27W201
10/16
Table 11. Ordering Information Scheme
Note: 1. High Speed, see AC Characteristics section for further information.
2. This speed also guarantees 70ns access time at V
CC
= 3.0V to 3.6V.
3. These speeds are replaced by the 100ns.
4. Packages option available on request. Please contact STMicroelectronics local Sales Office.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
Table 12. Revision History
Example:
M27W201
-80
K
6
TR
Device Type
M27
Supply Voltage
W = 2.7V to 3.6V
Device Function
201 = 2 Mbit (256Kb x 8)
Speed
-80
(1,2)
= 80 ns
-100 = 100 ns
Not For New Design
(3)
-120 = 120 ns
-150 = 150 ns
-200 = 200 ns
Package
F = FDIP32W
(4)
B = PDIP32
K = PLCC32
N = TSOP32: 8 x 20 mm
(4)
NZ = TSOP32: 8 x 14 mm
(4)
Temperature Range
6 = 40 to 85 C
Options
TR = Tape & Reel Packing
Date
Version
Revision Details
July 1999
-01
First Issue
19-Apr-2000
-02
FDIP32W Package Dimension, L Max added (Table 13)
TSOP32 Package Dimension changed (Table 16)
0 to 70C Temperature Range deleted, Programming Time changed
24-Oct-2001
-03
TSOP32 8x14mm added
11/16
M27W201
Table 13. FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
5.72
0.225
A1
0.51
1.40
0.020
0.055
A2
3.91
4.57
0.154
0.180
A3
3.89
4.50
0.153
0.177
B
0.41
0.56
0.016
0.022
B1
1.45
0.057
C
0.23
0.30
0.009
0.012
D
41.73
42.04
1.643
1.655
D2
38.10
1.500
E
15.24
0.600
E1
13.06
13.36
0.514
0.526
e
2.54
0.100
eA
14.99
0.590
eB
16.18
18.03
0.637
0.710
L
3.18
4.10
0.125
0.161
S
1.52
2.49
0.060
0.098
7.11
0.280
4
11
4
11
N
32
32
Figure 8. FDIP32W - 32 pin Ceramic Frit-seal DIP, with window, Package Outline
Drawing is not to scale.
FDIPW-a
A3
A1
A
L
B1
B
e
D
S
E1
E
N
1
C
eA
D2
eB
A2
M27W201
12/16
Table 14. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Mechanical Data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
5.08
0.200
A1
0.38
0.015
A2
3.56
4.06
0.140
0.160
B
0.38
0.51
0.015
0.020
B1
1.52
0.060
C
0.20
0.30
0.008
0.012
D
41.78
42.04
1.645
1.655
D2
38.10
1.500
E
15.24
0.600
E1
13.59
13.84
0.535
0.545
e1
2.54
0.100
eA
15.24
0.600
eB
15.24
17.78
0.600
0.700
L
3.18
3.43
0.125
0.135
S
1.78
2.03
0.070
0.080
0
10
0
10
N
32
32
Figure 9. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline
Drawing is not to scale.
PDIP
A2
A1
A
L
B1
B
e1
D
S
E1
E
N
1
C
eA
eB
D2
13/16
M27W201
Table 15. PLCC32 - 32 lead Plastic Leaded Chip Carrier, rectangular, Package Mechanical Data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
2.54
3.56
0.100
0.140
A1
1.52
2.41
0.060
0.095
A2
0.38
0.015
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
D
12.32
12.57
0.485
0.495
D1
11.35
11.56
0.447
0.455
D2
9.91
10.92
0.390
0.430
e
1.27
0.050
E
14.86
15.11
0.585
0.595
E1
13.89
14.10
0.547
0.555
E2
12.45
13.46
0.490
0.530
F
0.00
0.25
0.000
0.010
R
0.89
0.035
N
32
32
Nd
7
7
Ne
9
9
CP
0.10
0.004
Figure 10. PLCC32 - 32 lead Plastic Leaded Chip Carrier, rectangular, Package Outline
Drawing is not to scale.
PLCC
D
Ne
E1 E
1 N
D1
Nd
CP
B
D2/E2
e
B1
A1
A
R
0.51 (.020)
1.14 (.045)
F
A2
M27W201
14/16
Figure 11. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline
Drawing is not to scale.
TSOP-a
D1
E
1
N
CP
B
e
A2
A
N/2
D
DIE
C
L
A1
Table 16. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
1.200
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
0.950
1.050
0.0374
0.0413
B
0.150
0.270
0.0059
0.0106
C
0.100
0.210
0.0039
0.0083
D
19.800
20.200
0.7795
0.7953
D1
18.300
18.500
0.7205
0.7283
e
0.500
0.0197
E
7.900
8.100
0.3110
0.3189
L
0.500
0.700
0.0197
0.0276
0
5
0
5
CP
0.100
0.0039
N
32
32
15/16
M27W201
Figure 12. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 14 mm, Package Outline
Drawing is not to scale.
TSOP-a
D1
E
1
N
CP
B
e
A2
A
N/2
D
DIE
C
L
A1
Table 17. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 14 mm, Package Mechanical Data
Symbol
millimeters
inches
Typ
Min
Max
Typ
Min
Max
A
1.200
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
0.950
1.050
0.0374
0.0413
B
0.170
0.270
0.0067
0.0106
C
0.100
0.210
0.0039
0.0083
D
13.800
14.200
0.5433
0.5591
D1
12.300
12.500
0.4843
0.4921
e
0.500
0.0197
E
7.900
8.100
0.3110
0.3189
L
0.500
0.700
0.0197
0.0276
0
5
0
5
CP
0.100
0.0039
N
32
32
M27W201
16/16
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