Электронный компонент: M29DW324DT90ZA1F

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June 2003

M29DW324DT

M29DW324DB

32 Mbit (4Mb x8 or 2Mb x16, Dual Bank 16:16, Boot Block)

3V Supply Flash Memory

FEATURES SUMMARY

s

SUPPLY VOLTAGE

� V

CC

=

2.7V to 3.6V for Program, Erase and

Read

� V

PP

=12V for Fast Program (optional)

s

ACCESS TIME: 70, 90ns

s

PROGRAMMING TIME

� 10�s per Byte/Word typical

� Double Word/ Quadruple Byte Program

s

MEMORY BLOCKS

� Dual Bank Memory Array: 16Mbit+16Mbit

� Parameter Blocks (Top or Bottom Location)

s

DUAL OPERATIONS

� Read in one bank while Program or Erase in

other

s

ERASE SUSPEND and RESUME MODES

� Read and Program another Block during

Erase Suspend

s

UNLOCK BYPASS PROGRAM COMMAND

� Faster Production/Batch Programming

s

V

PP

/WP PIN for FAST PROGRAM and WRITE

PROTECT

s

TEMPORARY BLOCK UNPROTECTION
MODE

s

COMMON FLASH INTERFACE

� 64 bit Security Code

s

EXTENDED MEMORY BLOCK

� Extra block used as security block or to store

additional information

s

LOW POWER CONSUMPTION

� Standby and Automatic Standby

s

100,000 PROGRAM/ERASE CYCLES per
BLOCK

s

ELECTRONIC SIGNATURE

� Manufacturer Code: 0020h

� Top Device Code M29DW324DT: 225Ch

� Bottom Device Code M29DW324DB: 225Dh

Figure 1. Packages

TSOP48 (N)

12 x 20mm

FBGA

TFBGA63 (ZA)

7 x 11mm

FBGA

TFBGA48 (ZE)

6 x 8mm

M29DW324DT, M29DW324DB

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TABLE OF CONTENTS

SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 4. TFBGA63 Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 5. TFBGA48 Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 2. Bank Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 6. Block Addresses (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 7. Block Addresses (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Address Inputs (A0-A20). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Data Inputs/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Data Inputs/Outputs (DQ8-DQ14). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Data Input/Output or Address Input (DQ15A�1).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

V

PP/

Write Protect (V

PP/

WP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Reset/Block Temporary Unprotect (RP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Ready/Busy Output (RB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Byte/Word Organization Select (BYTE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

V

CC

Supply Voltage (2.7V to 3.6V).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

V

SS

Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

BUS OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Bus Read. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Bus Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Automatic Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Special Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Block Protect and Chip Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Block Protect and Chip Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 3. Bus Operations, BYTE = V

IL

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 4. Bus Operations, BYTE = V

IH

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

COMMAND INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Read/Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Auto Select Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Fast Program Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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M29DW324DT, M29DW324DB

Quadruple Byte Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Double Word Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Unlock Bypass Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Unlock Bypass Program Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Unlock Bypass Reset Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Chip Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Block Erase Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Erase Suspend Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Erase Resume Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Enter Extended Block Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Exit Extended Block Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 5. Commands, 16-bit mode, BYTE = V

IH

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 6. Commands, 8-bit mode, BYTE = V

IL

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 7. Program, Erase Times and Program, Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . . 19

STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 8. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 8. Data Polling Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 9. Data Toggle Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 9. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 10. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 10. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 11. AC Measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 11. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 12. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 12. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 13. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 13. Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 14. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 14. Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 15. Write AC Characteristics, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figure 15. Reset/Block Temporary Unprotect AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 16. Reset/Block Temporary Unprotect AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 16. Accelerated Program Timing Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 17. 48 Lead Plastic Thin Small Outline, 12x20 mm, Bottom View Package Outline . . . . . . 29

M29DW324DT, M29DW324DB

4/49

Table 17. 48 Lead Plastic Thin Small Outline, 12x20 mm, Package Mechanical Data . . . . . . . . . . 29

Figure 18. TFBGA63 7x11mm - 6x8 Ball Array, 0.8mm Pitch, Bottom View Package Outline . . . . 30

Table 18. TFBGA63 7x11mm - 6x8 Ball Array, 0.8mm Pitch, Package Mechanical Data. . . . . . . . 30

Figure 19. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Bottom View Package Outline . . . . . 31

Table 19. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Package Mechanical Data. . . . . . . . . 31

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Table 20. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

APPENDIX A. BLOCK ADDRESSES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 21. Top Boot Block Addresses, M29DW324DT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 22. Bottom Boot Block Addresses, M29DW324DB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

APPENDIX B. COMMON FLASH INTERFACE (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 23. Query Structure Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 24. CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 25. CFI Query System Interface Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Table 26. Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Table 27. Primary Algorithm-Specific Extended Query Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Table 28. Security Code Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

APPENDIX C. EXTENDED MEMORY BLOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Factory Locked Extended Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Customer Lockable Extended Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 29. Extended Block Address and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

APPENDIX D. BLOCK PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Programmer Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

In-System Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Table 30. Programmer Technique Bus Operations, BYTE = V

IH

or V

IL

. . . . . . . . . . . . . . . . . . . . . 43

Figure 20. Programmer Equipment Group Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Figure 21. Programmer Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 22. In-System Equipment Group Protect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 23. In-System Equipment Chip Unprotect Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table 31. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

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M29DW324DT, M29DW324DB

SUMMARY DESCRIPTION
The M29DW324D is a 32 Mbit (4Mb x8 or 2Mb
x16) non-volatile memory that can be read, erased
and reprogrammed. These operations can be per-
formed using a single low voltage (2.7 to 3.6V)
supply. On power-up the memory defaults to its
Read mode where it can be read in the same way
as a ROM or EPROM.

The device features an asymmetrical block archi-
tecture. The M29DW324D has an array of 8 pa-
rameter and 63 main blocks and is divided into two
Banks, A and B, providing Dual Bank operations.
While programming or erasing in Bank A, read op-
erations are possible in Bank B and vice versa.
Only one bank at a time is allowed to be in pro-
gram or erase mode. The bank architecture is
summarized in Table 2. M29DW324DT locates the
Parameter Blocks at the top of the memory ad-
dress space while the M29DW324DB locates the
Parameter Blocks starting from the bottom.
M29DW324D has an extra 32 KWord (x16 mode)
or 64 KByte (x8 mode) block, the Extended Block,
that can be accessed using a dedicated com-
mand. The Extended Block can be protected and
so is useful for storing security information. How-

ever the protection is irreversible, once protected
the protection cannot be undone.
Each block can be erased independently so it is
possible to preserve valid data while old data is
erased. The blocks can be protected to prevent
accidental Program or Erase commands from
modifying the memory. Program and Erase com-
mands are written to the Command Interface of
the memory. An on-chip Program/Erase Controller
simplifies the process of programming or erasing
the memory by taking care of all of the special op-
erations that are required to update the memory
contents. The end of a program or erase operation
can be detected and any error conditions identi-
fied. The command set required to control the
memory is consistent with JEDEC standards.
Chip Enable, Output Enable and Write Enable sig-
nals control the bus operation of the memory.
They allow simple connection to most micropro-
cessors, often without additional logic.
The memory is offered in TSOP48 (12x20mm),
TFBGA63 (7x11mm, 0.8mm pitch) and TFBGA48
(6x8mm, 0.8mm pitch) packages. The memory is
supplied with all the bits erased (set to '1').

Figure 2. Logic Diagram

Table 1. Signal Names

AI06867B

21

A0-A20

W

DQ0-DQ14

VCC

M29DW324DT
M29DW324DB

E

VSS

15

G

RP

DQ15A�1

RB

VPP/WP

BYTE

A0-A20

Address Inputs

DQ0-DQ7

Data Inputs/Outputs

DQ8-DQ14

Data Inputs/Outputs

DQ15A�1

Data Input/Output or Address Input

E

Chip Enable

G

Output Enable

W

Write Enable

RP

Reset/Block Temporary Unprotect

RB

Ready/Busy Output

BYTE

Byte/Word Organization Select

V

CC

Supply Voltage

V

PP

/WP

V

PP

/Write Protect

V

SS

Ground

NC

Not Connected Internally

Document Outline

• FEATURES SUMMARY
  • Figure 1. Packages
• table of contents
• SUMMARY DESCRIPTION
  • Figure 2. Logic Diagram
  • Table 1. Signal Names
  • Figure 3. TSOP Connections
  • Figure 4. TFBGA63 Connections (Top view through package)
  • Figure 5. TFBGA48 Connections (Top view through package)
  • Table 2. Bank Architecture
  • Figure 6. Block Addresses (x8)
  • Figure 7. Block Addresses (x16)
• SIGNAL DESCRIPTIONS
  • Address Inputs (A0-A20).
  • Data Inputs/Outputs (DQ0-DQ7).
  • Data Inputs/Outputs (DQ8-DQ14).
  • Data Input/Output or Address Input (DQ15A�1).
  • Chip Enable (E).
  • Output Enable (G).
  • Write Enable (W).
  • VPP/Write Protect (VPP/WP).
  • Reset/Block Temporary Unprotect (RP).
  • Ready/Busy Output (RB).
  • Byte/Word Organization Select (BYTE).
  • VCC Supply Voltage (2.7V to 3.6V).
  • VSS Ground.
• BUS OPERATIONS
  • Bus Read.
  • Bus Write.
  • Output Disable.
  • Standby.
  • Automatic Standby.
  • Special Bus Operations
    • Electronic Signature.
    • Block Protect and Chip Unprotect.
    • Table 3. Bus Operations, BYTE = VIL
    • Table 4. Bus Operations, BYTE = VIH
• COMMAND INTERFACE
  • Read/Reset Command
  • Auto Select Command
  • Read CFI Query Command
  • Program Command
  • Fast Program Commands
    • Quadruple Byte Program Command.
    • Double Word Program Command.
  • Unlock Bypass Command.
  • Unlock Bypass Program Command.
  • Unlock Bypass Reset Command.
  • Chip Erase Command.
  • Block Erase Command.
  • Erase Suspend Command.
  • Erase Resume Command.
  • Enter Extended Block Command
  • Exit Extended Block Command.
  • Block Protect and Chip Unprotect Commands.
    • Table 5. Commands, 16-bit mode, BYTE = VIH
    • Table 6. Commands, 8-bit mode, BYTE = VIL
    • Table 7. Program, Erase Times and Program, Erase Endurance Cycles
• STATUS REGISTER
  • Data Polling Bit (DQ7).
  • Toggle Bit (DQ6).
  • Error Bit (DQ5).
  • Erase Timer Bit (DQ3).
  • Alternative Toggle Bit (DQ2).
  • Table 8. Status Register Bits
  • Figure 8. Data Polling Flowchart
  • Figure 9. Data Toggle Flowchart
• MAXIMUM RATING
  • Table 9. Absolute Maximum Ratings
• DC and AC PARAMETERS
  • Table 10. Operating and AC Measurement Conditions
  • Figure 10. AC Measurement I/O Waveform
  • Figure 11. AC Measurement Load Circuit
  • Table 11. Device Capacitance
  • Table 12. DC Characteristics
  • Figure 12. Read Mode AC Waveforms
  • Table 13. Read AC Characteristics
  • Figure 13. Write AC Waveforms, Write Enable Controlled
  • Table 14. Write AC Characteristics, Write Enable Controlled
  • Figure 14. Write AC Waveforms, Chip Enable Controlled
  • Table 15. Write AC Characteristics, Chip Enable Controlled
  • Figure 15. Reset/Block Temporary Unprotect AC Waveforms
  • Table 16. Reset/Block Temporary Unprotect AC Characteristics
  • Figure 16. Accelerated Program Timing Waveforms
• PACKAGE MECHANICAL
  • Figure 17. 48 Lead Plastic Thin Small Outline, 12x20 mm, Bottom View Package Outline
  • Table 17. 48 Lead Plastic Thin Small Outline, 12x20 mm, Package Mechanical Data
  • Figure 18. TFBGA63 7x11mm - 6x8 Ball Array, 0.8mm Pitch, Bottom View Package Outline
  • Table 18. TFBGA63 7x11mm - 6x8 Ball Array, 0.8mm Pitch, Package Mechanical Data
  • Figure 19. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Bottom View Package Outline
  • Table 19. TFBGA48 6x8mm - 6x8 Ball Array, 0.8mm Pitch, Package Mechanical Data
• PART NUMBERING
  • Table 20. Ordering Information Scheme
• APPENDIX A. BLOCK ADDRESSES
  • Table 21. Top Boot Block Addresses, M29DW324DT
  • Table 22. Bottom Boot Block Addresses, M29DW324DB
• APPENDIX B. COMMON FLASH INTERFACE (CFI)
  • Table 23. Query Structure Overview
  • Table 24. CFI Query Identification String
  • Table 25. CFI Query System Interface Information
  • Table 26. Device Geometry Definition
  • Table 27. Primary Algorithm-Specific Extended Query Table
  • Table 28. Security Code Area
• APPENDIX C. EXTENDED MEMORY BLOCK
  • Factory Locked Extended Block
  • Customer Lockable Extended Block
    • Table 29. Extended Block Address and Data
• APPENDIX D. BLOCK PROTECTION
  • Programmer Technique
  • In-System Technique
    • Table 30. Programmer Technique Bus Operations, BYTE = VIH or VIL
    • Figure 20. Programmer Equipment Group Protect Flowchart
    • Figure 21. Programmer Equipment Chip Unprotect Flowchart
    • Figure 22. In-System Equipment Group Protect Flowchart
    • Figure 23. In-System Equipment Chip Unprotect Flowchart
• REVISION HISTORY
  • Table 31. Document Revision History