STPR1020CB(-TR)
PRELIMINARY DATASHEET
February 1999 - Ed : 2B
HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES
I
F(AV)
2 x 5 A
V
RRM
200 V
t
rr
(max)
35 ns
MAIN PRODUCT CHARACTERISTICS
SUITED FOR SMPS AND DRIVES
SURFACE MOUNT
VERY LOW FORWARD LOSSES
NEGLIGIBLE SWITCHING LOSSES
HIGH SURGE CURRENT CAPABILITY
SURFACE MOUNT DEVICE
TAPE AND REEL OPTION : -TR
FEATURES AND BENEFITS
Dual rectifier suited for Switch Mode and high fre-
quency converters.
Packaged in DPAK, this surface mount device is
intended for use in low voltage, high frequency in-
verters, free wheeling and polarity protection appli-
cations.
DESCRIPTION
DPAK
(Plastic)
4
1
2
3
Symbol
Parameter
Value
Unit
V
RRM
Repetitive Peak Reverse Voltage
200
V
V
RSM
Non Repetitive Surge Reverse Voltage
220
V
I
F(RMS)
RMS Forward Current
Per diode
10
A
I
F(AV)
Average Forward Current
T
case
= 130C
= 0.5
Per diode
Per device
5
10
A
I
FSM
Surge Non Repetitive Forward Current
tp = 10 ms Sinusoidal
Per diode
70
A
Tstg
Storage Temperature Range
- 40 to + 150
C
Tj
Max. Junction Temperature
150
C
ABSOLUTE MAXIMUM RATINGS
2, 4(TAB)
3
1
1/3
Symbol
Parameter
Value
Unit
R
th (j-c)
Junction to Case Thermal Resistance
Per diode
5
C/W
Total
2.7
R
th (c)
Coupling
C/W
When the diodes 1 and 2 are used simultaneously :
Tj(diode 1) = P(diode) x R
th
(per diode) + P(diode 2) x R
th (c)
THERMAL RESISTANCES
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage Current
Tj = 25
C
V
R
= V
RRM
20
A
Tj = 100
C
0.15
0.5
mA
V
F
**
Forward Voltage drop
Tj = 25
C
I
F
= 10 A
1.25
V
Tj = 100
C
I
F
= 5 A
0.8
0.85
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Pulse test :
* tp = 5 ms, duty cycle < 2 %
** tp = 380
s, duty cycle < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.7 x I
F(AV)
+ 0.030 I
F
2
(RMS)
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
t
rr
Tj = 25C
I
F
= 1A
V
F
= 30V
dI
F
/dt = -50
/ms
35
ns
t
fr
Tj = 25C
I
F
= 1A
V
FR
= 1.1 x V
F
tr = 10 ns
20
ns
V
FP
Tj = 25C
I
F
= 1A
tr = 10 ns
5
V
RECOVERY CHARACTERISTICS
STPR1020CB(-TR)
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATA
DPAK
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max
Min.
Typ.
Max.
A
2.20
2.40 0.086
0.094
A1
0.90
1.10 0.035
0.043
A2
0.03
0.23 0.001
0.009
B
0.64
0.90 0.025
0.035
B2
5.20
5.40 0.204
0.212
C
0.45
0.60 0.017
0.023
C2
0.48
0.60 0.018
0.023
D
6.00
6.20 0.236
0.244
E
6.40
6.60 0.251
0.259
G
4.40
4.60 0.173
0.181
H
9.35
10.10 0.368
0.397
L2
0.80
0.031
L4
0.60
1.00 0.023
0.039
V2
0
8
0
8
FOOT PRINT in millimeters
6.7
6.7
6.7
3
1.6
1.6
2.3
2.3
STPR1020CB(-TR)
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