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Электронный компонент: STPS360B-TR

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STPS360B(-TR)/B-1
July 1998 - Ed : 2B
POWER SCHOTTKY RECTIFIER
I
F(AV)
3 A
V
RRM
60 V
V
F
(max)
0.59 V
MAIN PRODUCT CHARACTERISTICS
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD DROP VOLTAGE
LOW CAPACITANCE
HIGH REVERSE AVALANCHE SURGE
CAPABILITY
TAPE AND REEL OPTION : -TR
FEATURES AND BENEFITS
High voltage Schottky rectifier suited to Switch
Mode
Power
Supplies
and
other
Power
Converters.
Packaged in DPAK and IPAK, this device is
intended for use in medium voltage operation, and
particularly, in high frequency circuitries where low
switching losses are required.
DESCRIPTION
DPAK
STPS360B
4
1
2
3
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
60
V
I
F(RMS)
RMS forward current
6
A
I
F(AV)
Average forward current
Tcase = 140
C
= 0.5
3
A
I
FSM
Surge non repetitive forward current
tp = 10 ms
Sinusoidal
50
A
I
RRM
Repetitive peak
reverse current
tp = 2
s
F = 1kHz
1
A
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum junction temperature
150
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting value)
2
4 (TAB)
3
1
2
3
4
IPAK
STPS360B-1
1/5
Symbol
Parameter
Value
Unit
R
th(j-c)
Junction to case
3.5
C/W
THERMAL RESISTANCES
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25
C
V
R
= 60 V
30
A
Tj = 125
C
3
10
mA
V
F
**
Forward voltage drop
Tj = 25
C
I
F
= 3 A
0.65
V
Tj = 125
C
I
F
= 3 A
0.55
0.59
STATIC ELECTRICAL CHARACTERISTICS
Pulse test :
* tp = 380
s,
< 2 %
** tp = 5 ms,
< 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.49 x I
F(AV)
+ 0.035 I
F
2
(RMS)
Typical junction capacitance, V
R
= 0V
F = 1MHz
Tj = 25
C
C = 700pF
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
2.0
2.5
IF(av) (A)
PF(av)(W)
T
=tp/T
tp
= 0.5
= 0.2
= 0.1
= 0.05
= 1
Fig. 1: Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Tamb(
C)
IF(av)(A)
Rth(j-a)=65
C/W
Rth(j-a)=Rth(j-c)
T
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (
=0.5).
STPS360B(-TR)/B-1
2/5
0
5 10 15 20 25 30 35 40 45 50 55 60
1E-7
1E-6
1E-5
1E-4
1E-3
1E-2
VR(V)
IR(A)
Tj=125
C
Tj=75
C
Tj=25
C
Tj=100
C
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
1
2
5
10
20
50
100
10
20
50
100
200
500
VR(V)
C(pF)
F=1MHz
Tj=25
C
Fig. 6: Junction capacitance versus reverse volt-
age applied (typical values).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.1
1.0
10.0
50.0
VFM(V)
IFM(A)
Tj=125
C
Tj=25
C
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
0
2
4
6
8
10
12
14
16
18
20
0
20
40
60
80
100
S(Cu) (cm )
Rth(j-a) (
C/W)
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35
m).
1E-3
1E-2
1E-1
1E+0
0
2
4
6
8
10
12
14
16
t(s)
IM(A)
Ta=25
C
Ta=50
C
Ta=100
C
I
M
t
=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-3
1E-2
1E-1
1E+0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
=tp/T
tp
Single pulse
= 0.5
= 0.2
= 0.1
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
STPS360B(-TR)/B-1
3/5
PACKAGE MECHANICAL DATA
IPAK
H
L
L1
G
B5
B
V1
D
C
A1
A3
A
C2
B3
B6
L2
E
B2
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A3
0.7
1.3
0.027
0.051
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
B3
0.85
0.033
B5
0.3
0.035
B6
0.95
0.037
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
15.9
16.3 0.626
0.641
L
9
9.4
0.354
0.370
L1
0.8
1.2
0.031
0.047
L2
0.8
1
0.031 0.039
V1
10
10
STPS360B(-TR)/B-1
4/5
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max
Min.
Typ.
Max.
A
2.20
2.40 0.086
0.094
A1
0.90
1.10 0.035
0.043
A2
0.03
0.23 0.001
0.009
B
0.64
0.90 0.025
0.035
B2
5.20
5.40 0.204
0.212
C
0.45
0.60 0.017
0.023
C2
0.48
0.60 0.018
0.023
D
6.00
6.20 0.236
0.244
E
6.40
6.60 0.251
0.259
G
4.40
4.60 0.173
0.181
H
9.35
10.10 0.368
0.397
L2
0.80
0.031
L4
0.60
1.00 0.023
0.039
V2
0
8
0
8
PACKAGE MECHANICAL DATA
DPAK
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsIbility for the consequences of
use of such informationnor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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1998 STMicroelectronics - Printed in Italy - All rights reserved.
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6.7
6.7
6.7
3
1.6
1.6
2.3
2.3
FOOT PRINT DIMENSIONS (in millimeters)
STPS360B(-TR)/B-1
5/5