July 2006
Rev 1
1/7
7
STTH2006
Turbo 2 ultrafast high voltage rectifier
Main product characteristics
Features and benefits
Ultrafast switching
Low reverse current
Low thermal resistance
Reduces switching and conduction losses
Description
The STTH2006 uses ST Turbo 2 600 V
technology and is especially suited for use in
switching power supplies, and industrial
applications, such as rectification and continuous
mode PFC boost diode.
Order Codes
I
F(AV)
20 A
V
RRM
600 V
T
j
175 C
V
F
(typ)
1.0 V
t
rr
(max)
50 ns
Part Number
Marking
STTH2006W
STTH2006W
K
A
DO-247
STTH2006W
Table 1.
Absolute Ratings (limiting values)
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
600
V
I
F(RMS)
RMS forward voltage
50
A
I
F(AV)
Average forward current
T
c
= 120 C
= 0.5
20
A
I
FSM
Surge non repetitive forward current
t
p
= 10 ms sinusoidal
160
A
T
stg
Storage temperature range
-65 to + 175
C
T
j
Maximum operating junction temperature
175
C
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Characteristics
STTH2006
2/7
1 Characteristics
s
To evaluate the conduction losses use the following equation:
P = 1.13 x I
F(AV)
+ 0.011 I
F
2
(RMS)
Table 2.
Thermal resistance
Symbol
Parameter
Value
(max).
Unit
R
th(j-c)
Junction to case
1.1
C/W
Table 3.
Static electrical characteristic
Symbol
Parameter
Test conditions
Min.
Typ
Max.
Unit
I
R
(1)
1.
Pulse test: t
p
= 5 ms,
< 2%
Reverse leakage
current
T
j
= 25 C
V
R
= V
RRM
25
A
T
j
= 150 C
80
800
V
F
(2)
2.
Pulse test: t
p
= 380 s,
< 2%
Forward voltage drop
T
j
= 25 C
I
F
= 20 A
1.75
V
T
j
= 150 C
1.00
1.35
Table 4.
Dynamic characteristics
Symbol
Parameter
Test conditions
Min.
Typ Max. Unit
t
rr
Reverse recovery
time
T
j
= 25 C
I
F
= 0.5 A I
rr
= 0.25 A I
R
=1 A
50
ns
I
F
= 1 A dI
F
/dt = -50 A/s
V
R
=30 V
50
70
I
RM
Reverse recovery
current
T
j
= 125 C
I
F
= 30 A V
R
= 400 V
dI
F
/dt = -100 A/s
8
11
A
t
fr
Forward recovery
time
T
j
= 25 C
I
F
= 30 A dI
F
/dt = 100 A/s
V
FR
= 1.1 x V
Fmax
500
ns
V
FP
Forward recovery
voltage
T
j
= 25 C
I
F
= 30 A dI
F
/dt = 100 A/s
V
FR
= 1.1 x V
Fmax
2.5
V
STTH2006
Characteristics
3/7
Figure 1.
Conduction losses versus
average forward current
Figure 2.
Forward voltage drop versus
forward current
0
5
10
15
20
25
30
35
0
5
10
15
20
25
P(W)
=0.05
=0.1
=0.2
=0.5
=1
T
=tp/T
tp
I
F(AV)
(A)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
I
FM
(A)
T
j
=25 C
(Maximum values)
T
j
=150 C
(Maximum values)
T
j
=150 C
(Maximum values)
T
j
=150 C
(Typical values)
T
j
=150 C
(Typical values)
V
FM
(V)
Figure 3.
Relative variation of thermal
impedance junction to case
versus pulse duration
Figure 4.
Peak reverse recovery current
versus dI
F
/dt (typical values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03
1.E-02
1.E-01
1.E+00
Z
/R
th(j-c)
th(j-c)
t (s)
p
Single pulse
0
5
10
15
20
25
30
0
50
100
150
200
250
300
350
400
450
500
I
(A)
RM
dI /dt(A/s)
F
I =2 x I
F
F(AV)
I =I
F
F(AV)
I =0.5 x I
F
F(AV)
I =0.25 x I
F
F(AV)
V =400V
T =125C
R
j
Figure 5.
Reverse recovery time versus
dI
F
/dt (typical values)
Figure 6.
Reverse recovery charges versus
dI
F
/dt (typical values)
0
50
100
150
200
0
200
400
600
800
1000
t (ns)
rr
dI /dt(A/s)
F
I =I
F
F(AV)
I =0.5 x I
F
F(AV)
V =400V
T =125C
R
j
I =2 x I
F
F(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
200
400
600
800
1000
Q (C)
rr
I =2 x I
F
F(AV)
I =I
F
F(AV)
I =0.5 x I
F
F(AV)
V =400V
T =125C
R
j
dI /dt(A/s)
F
Characteristics
STTH2006
4/7
Figure 7.
Softness factor versus dI
F
/dt
(typical values)
Figure 8.
Relative variations of dynamic
parameters versus junction
temperature
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0
50
100
150
200
250
300
350
400
450
500
S factor
I
2 x I
T =125C
F
F(AV)
j
V =400V
R
dI /dt(A/s)
F
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
25
50
75
100
125
I
RM
Q
RR
S factor
T (C)
j
I =I
Reference: T =125C
F
F(AV)
j
V =400V
R
Figure 9.
Transient peak forward voltage
versus dI
F
/dt (typical values)
Figure 10.
Forward recovery time versus dI
F
/dt
(typical values)
Figure 11.
Junction capacitance versus
reverse voltage applied
(typical values)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
0
100
200
300
400
500
V
(V)
FP
dI /dt(A/s)
F
I =I
T =125C
F
F(AV)
j
0
100
200
300
400
500
600
700
800
0
100
200
300
400
500
t (ns)
fr
dI /dt(A/s)
F
I =I
T =125C
F
F(AV)
j
V
=1.1 x V max.
FR
F
10
100
1000
1
10
100
1000
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25C
OSC
RMS
j
STTH2006
Package information
5/7
2 Package
information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 Nm
Maximum torque value: 0.70 Nm
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 5.
DO-247 Package dimensions
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.85
5.15
0.191
0.203
D
2.20
2.60
0.086
0.102
E
0.40
0.80
0.015
0.031
F
1.00
1.40
0.039
0.055
F2
2.00
0.078
F3
2.00
2.40
0.078
0.094
G
10.90
0.429
H
15.45
15.75 0.608
0.620
L
19.85
20.15 0.781
0.793
L1
3.70
4.30
0.145
0.169
L2
18.50
0.728
L3
14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00
0.078
0.118
V
5
5
V2
60
60
Dia.
3.55
3.65
0.139
0.143
F2
V2
L4
L2
L1
L3
D
L
L5
M
E
H
V
V
A
Dia.
F3
G
F
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