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Электронный компонент: TDA2006

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TDA2006
12W AUDIO AMPLIFIER
May 1995
PENTAWATT
ORDERING NUMBERS : TDA2006V
TDA2006H
DESCRIPTION
The TDA2006 is a monolithic integrated circuit in
Pentawatt package, intended for use as a low
frequency class "AB" amplifier. At
12V, d = 10 %
typically it provides 12W output power on a 4
load
and 8W on a 8
. The TDA2006 provides high
output current and has very low harmonic and
cross-over distortion. Further the device incorpo-
rates an original (and patented)short circuit protec-
tion system comprising an arrangement for
automatically limiting the dissipated power so as to
keep the working point of the output transistors
within their safe operating area. A conventional
thermal shutdown system is also included. The
TDA2006 is pin to pin equivalent to the TDA2030.
TYPICAL APPLICATION CIRCUIT
1/12
SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
s
Supply Voltage
15
V
V
i
Input Voltage
V
s
V
i
Differential Input Voltage
12
V
I
o
Output Peak Current (internaly limited)
3
A
P
tot
Power Dissipation at T
case
= 90
C
20
W
T
stg
, T
j
Storage and Junction Temperature
40 to 150
C
THERMAL DATA
Symbol
Parameter
Value
Unit
R
th (j-c)
Thermal Resistance Junction-case
Max
3
C/W
PIN CONNECTION
TDA2006
2/12
ELECTRICAL CHARACTERISTICS
(refer to the test circuit ; V
S
=
12V, T
amb
= 25
o
C unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
s
Supply Voltage
6
15
V
I
d
Quiescent Drain Current
V
s
=
15V
40
80
mA
I
b
Input Bias Current
V
s
=
15V
0.2
3
A
V
OS
Input Offset Voltage
V
s
=
15V
8
mV
I
OS
Input Offset Current
V
s
=
15V
80
nA
V
OS
Output Offset Voltage
V
s
=
15V
10
100
mV
P
o
Output Power
d = 10%, f = 1kHz
R
L
= 4
R
L
= 8
6
12
8
W
d
Distortion
P
o
= 0.1 to 8W, R
L
= 4
, f = 1kHz
P
o
= 0.1 to 4W, R
L
= 8
, f = 1kHz
0.2
0.1
%
%
V
i
Input Sensitivity
P
o
= 10W, R
L
= 4
, f = 1kHz
P
o
= 6W, R
L
= 8
, f = 1kHz
200
220
mV
mV
B
Frequency Response ( 3dB)
P
o
= 8W, R
L
= 4
20Hz to 100kHz
R
i
Input Resistance (pin 1)
f = 1kHz
0.5
5
M
G
v
Voltage Gain (open loop)
f = 1kHz
75
dB
G
v
Voltage Gain (closed loop)
f = 1kHz
29.5
30
30.5
dB
e
N
Input Noise Voltage
B ( 3dB) = 22Hz to 22kHz, R
L
= 4
3
10
V
i
N
Input Noise Current
B ( 3dB) = 22Hz to 22kHz, R
L
= 4
80
200
pA
SVR
Supply Voltage Rejection
R
L
= 4
, R
g
= 22k
, f
ripple
= 100Hz (*)
40
50
dB
I
d
Drain Current
P
o
= 12W, R
L
= 4
P
o
= 8W, R
L
= 8
850
500
mA
mA
T
j
Thermal Shutdown Junction
Temperature
145
C
(*) Referring to Figure 15, single supply.
TDA2006
3/12
Figure 1 :
Output Power versus Supply Voltage
Figure 2 :
Distortion versus Output Power
Figure 3 :
Distortion versus Frequency
Figure 4 :
Distortion versus Frequency
Figure 5 :
Sensitivity versus Output Power
Figure 6 :
Sensitivity versus Output Power
TDA2006
4/12
Figure 7 :
Frequency Response with different val-
ues of the rolloff Capacitor C8 (see
Figure 13)
Figure 8 :
Value of C8 versus Voltage Gain for dif-
ferent Bandwidths (see Figure 13)
Figure 9 :
Quiescent Current versus
Supply Voltage
Figure 10 : Supply Voltage Rejection versus
Voltage Gain
Figure 11 : Power Dissipation and Efficiency ver-
sus Output Power
Figure 12 : Maximum Power Dissipation versus
Supply Voltage
(sine wave operation)
TDA2006
5/12
Figure 13 : Application Circuit with Spilt Power Supply
Figure 14 : P.C. Board and Components Layout of the Circuit of Figure 13 (1:1 scale)
TDA2006
6/12
Figure 15 : Application Circuit with Single Power Supply
Figure 16 : P.C. Board and Components Layout of the Circuit of Figure 15 (1:1 scale)
TDA2006
7/12
Figure 17 : Bridge Amplifier Configuration with Split Power Supply (P
O
= 24W, V
S
=
12V)
PRACTICAL CONSIDERATIONS
Printed Circuit Board
The layout shown in Figure 14 should be adopted
by the designers. If different layout are used, the
ground points of input 1 and input 2 must be well
decoupled from ground of the output on which a
rather high current flows.
Assembly Suggestion
No electrical isolation is needed between the pack-
age and the heat-sink with single supply voltage
configuration.
Application Suggestion
The recommended values of the components are
the ones shown on application circuits of Figure 13.
Different values can be used. The table 1 can help
the designers.
Table 1
Component
Recommanded
Value
Purpose
Larger Than
Recommanded Value
Smaller Than
Recommanded Value
R
1
22 k
Closed Loop Gain Setting
Increase of Gain
Decrease of Gain (*)
R
2
680
Closed Loop Gain Setting
Decrease of Gain (*)
Increase of Gain
R
3
22 k
Non Inverting Input
Biasing
Increase of Input
Impedance
Decrease of Input
Impedance
R
4
1
Frequency Stability
Danger of Oscillation at
High Frequencies with
Inductive Loads
R
5
3 R
2
Upper Frequency Cut-off
Poor High Frequencies
Attenuation
Danger of Oscillation
C
1
2.2
F
Input DC Decoupling
Increase of Low
Frequencies Cut-off
C
2
22
F
Inverting Input DC
Decoupling
Increase of Low
Frequencies Cut-off
C
3
C
4
0.1
F
Supply Voltage by Pass
Danger of Oscillation
C
5
C
6
100
F
Supply Voltage by Pass
Danger of Oscillation
C
7
0.22
F
Frequency Stability
Danger of Oscillation
C
8
1
2
BR
1
Upper Frequency Cut-off
Lower Bandwidth
Larger Bandwidth
D
1
D
2
1N4001
To Protect the Device Against Output Voltage Spikes.
(*) Closed loop gain must be higher than 24dB.
TDA2006
8/12
SHORT CIRCUIT PROTECTION
Figure 18 : Maximum Output Current versus
Voltage V
CE (sat)
accross each Out-
put Transistor
Figure 19 : Safe Operating Area and Collector
Characteristics of the Protected
Power Transistor
The TDA2006 has an original circuit which limits
the current of the output transistors. Figure 18
shows that the maximum output current is a func-
tion of the collector emitter voltage ; hence the
output transistors work within their safe operating
area (Figure 19).
This function can therefore be considered as being
peak power limiting rather than simple current lim-
iting.
It reduces the possibility that the device gets dam-
aged during an accidental short circuit from AC
output to ground.
THERMAL SHUT DOWN
The presence of a thermal limiting circuit offers the
following advantages :
1) an overload on the output (even if it is
permanent), or an abo ve l imi t ambien t
temperature can be easily supported since the
T
j
cannot be higher than 150
C.
2) the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no possibility of device damage due to
high junction temperature.
If for any reason, the junction temperature in-
creases up to 150
C, the thermal shutdown simply
reduces the power dissipation and the current con-
sumption.
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e.
its thermal resistance) ; Figure 22 shows the dissi-
pable power as a function of ambient temperature
for different thermal resistances.
Figure 20 : Output Power and Drain Current ver-
sus Case Temlperature (R
L
= 4
)
Figure 21 : Output Power and Drain Current ver-
sus Case Temlperature (R
L
= 8
)
TDA2006
9/12
Figure 22 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
DIMENSION SUGGESTION
The followingtable shows the length of the heatsink
in Figure 23 for several values of P
tot
and R
th
.
P
tot
(W)
12
8
6
Lenght of Heatsink (mm)
60
40
30
R
th
of Heatsink (
C/W)
4.2
6.2
8.3
Figure 23 : Example of Heatsink
TDA2006
10/12
L2
L3
L5
L7
L6
Dia.
A
C
D
E
D1
H3
H2
F
G
G1
L1
L
MM
1
F1
PENTAWATT PACKAGE MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.8
0.189
C
1.37
0.054
D
2.4
2.8
0.094
0.110
D1
1.2
1.35
0.047
0.053
E
0.35
0.55
0.014
0.022
F
0.8
1.05
0.031
0.041
F1
1
1.4
0.039
0.055
G
3.4
0.126
0.134
0.142
G1
6.8
0.260
0.268
0.276
H2
10.4
0.409
H3
10.05
10.4
0.396
0.409
L
17.85
0.703
L1
15.75
0.620
L2
21.4
0.843
L3
22.5
0.886
L5
2.6
3
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6
6.6
0.236
0.260
M
4.5
0.177
M1
4
0.157
Dia
3.65
3.85
0.144
0.152
TDA2006
11/12
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All Rights Reserved
PENTAWATT
is Registered Trademark of SGS-THOMSON Microelectronics
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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TDA2006
12/12