TDA2030
14W Hi-Fi AUDIO AMPLIFIER
DESCRIPTION
The TDA2030 is a monolithic integrated circuit in
Pentawatt
package, intended for use as a low
frequency class AB amplifier. Typically it provides
14W output power (d = 0.5%) at 14V/4
; at
14V
the guaranteed output power is 12W on a 4
load
and 8W on a 8
(DIN45500).
The TDA2030 provides high output current and has
very low harmonic and cross-over distortion.
Further the device incorporates an original (and
patented) short circuit protection system compris-
ing an arrangement for automatically limiting the
dissipated power so as to keep the working point
of the output transistors within their safe operating
area. A conventional thermal shut-down system is
also included.
March 1993
Symbol
Parameter
Value
Unit
V
s
Supply voltage
18
V
V
i
Input voltage
V
s
V
i
Differential input voltage
15
V
I
o
Output peak current (internally limited)
3.5
A
P
tot
Power dissipation at T
case
= 90
C
20
W
T
stg
, T
j
Stoprage and junction temperature
-40 to 150
C
ABSOLUTE MAXIMUM RATINGS
TYPICAL APPLICATION
Pentawatt
ORDERING NUMBERS : TDA2030H
TDA2030V
1/11
2/11
PIN CONNECTION (top view)
TEST CIRCUIT
+V
S
OUTPUT
-V
S
INVERTING INPUT
NON INVERTING INPUT
TDA2030
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
s
Supply voltage
6
18
V
I
d
Quiescent drain current
V
s
=
18V
40
60
mA
I
b
Input bias current
0.2
2
A
V
os
Input offset voltage
2
20
mV
I
os
Input offset current
20
200
nA
P
o
Output power
d = 0.5%
G
v
= 30 dB
f = 40 to 15,000 Hz
R
L
= 4
R
L
= 8
12
8
14
9
W
W
d = 10%
f = 1 KHz
R
L
= 4
R
L
= 8
G
v
= 30 dB
18
11
W
W
d
Distortion
P
o
= 0.1 to 12W
R
L
= 4
G
v
= 30 dB
f = 40 to 15,000 Hz
0.2
0.5
%
P
o
= 0.1 to 8W
R
L
= 8
G
v
= 30 dB
f = 40 to 15,000 Hz
0.1
0.5
%
B
Power Bandwidth
(-3 dB)
G
v
= 30 dB
P
o
= 12W
R
L
= 4
10 to 140,000
Hz
R
i
Input resistance (pin 1)
0.5
5
M
G
v
Voltage gain (open loop)
90
dB
G
v
Voltage gain (closed loop)
f = 1 kHz
29.5
30
30.5
dB
e
N
Input noise voltage
B = 22 Hz to 22 KHz
3
10
V
i
N
Input noise current
80
200
pA
SVR
Supply voltage rejection
R
L
= 4
G
v
= 30 dB
R
g
= 22 k
V
ripple
= 0.5 V
eff
f
ripple
= 100 Hz
40
50
dB
I
d
Drain current
P
o
= 14W
P
o
= W
R
L
= 4
R
L
= 8
900
500
mA
mA
T
j
Thermal shut-down junction
temperature
145
C
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, V
s
=
14V, T
amb
= 25
C unless otherwise
specified)
Symbol
Parameter
Value
Unit
R
th j-case
Thermal resistance junction-case
max
3
C/W
THERMAL DATA
3/11
TDA2030
4/11
Figure 1. Output power vs.
supply voltage
Figure 2. Output power vs.
supply voltage
F ig u re 3 . Di stor ti on v s.
output power
Fi gur e 4. Di st ort ion v s.
output power
F ig ure 5. Di st ort ion vs.
output power
F ig u re 6 . Di stor ti on v s.
frequency
F igu r e 7. Di stor ti on vs .
frequency
Fig ure 8. Fre que nc y re -
sponse with different values
of the rolloff capacitor C8
(see fig. 13)
Figure 9. Quiescent current
vs. supply voltage
TDA2030
Figure 10. Supply voltage
rejection vs. voltage gain
Figure 11. Power dissipa-
tion and efficiency vs. output
power
Figure 12. Maximum power
dissipation vs. supply volt-
age (sine wave operation)
APPLICATION INFORMATION
Figure 13. Typical amplifier
with split power supply
Figure 14. P.C. board and component layout for
the circuit of fig. 13 (1 : 1 scale)
5/11
TDA2030
6/11
APPLICATION INFORMATION (continued)
Figure 15. Typical amplifier
with single power supply
Figure 16. P.C. board and component layout for
the circuit of fig. 15 (1 : 1 scale)
Figure 17. Bridge amplifier configuration with split power supply (P
o
= 28W, V
s
=
14V)
TDA2030
PRACTICAL CONSIDERATIONS
Printed circuit board
The layout shown in Fig. 16 should be adopted by
the designers. If different layouts are used, the
ground points of input 1 and input 2 must be well
decoupled from the ground return of the output in
which a high current flows.
Assembly suggestion
No electrical isolation is needed between the
packageand the heatsinkwith single supply voltage
configuration.
Application suggestions
The recommended values of the components are
those shown on application circuit of fig. 13.
Different values can be used. The following table
can help the designer.
Componen t
Recomm.
value
Purpose
Larger than
recommended value
Smaller than
recommended value
R1
22 k
Closed loop gain
setting
Increase of gain
Decrease of gain (*)
R2
680
Closed loop gain
setting
Decrease of gain (*)
Increase of gain
R3
22 k
Non inverting input
biasing
Increase of input
impedance
Decrease of input
impedance
R4
1
Frequency stability
Danger of osccilat. at
high frequencies
with induct. loads
R5
3 R2
Upper frequency
cutoff
Poor high frequencies
attenuation
Danger of
oscillation
C1
1
F
Input DC
decoupling
Increase of low
frequencies cutoff
C2
22
F
Inverting DC
decoupling
Increase of low
frequencies cutoff
C3, C4
0.1
F
Supply voltage
bypass
Danger of
oscillation
C5, C6
100
F
Supply voltage
bypass
Danger of
oscillation
C7
0.22
F
Frequency stability
Danger of oscillation
C8
1
2
B R1
Upper frequency
cutoff
Smaller bandwidth
Larger bandwidth
D1, D2
1N4001
To protect the device against output voltage spikes
(*) Closed loop gain must be higher than 24dB
7/11
TDA2030
8/11
SHORT CIRCUIT PROTECTION
The TDA2030 has an original circuit which limits the
current of the output transistors. Fig. 18 shows that
the maximum output current is a function of the
collector emitter voltage; hence the output transis-
tors work within their safe operating area (Fig. 2).
This function can therefore be considered as being
peak power limiting rather than simple current lim-
iting.
It reduces the possibility that the device gets dam-
aged during an accidental short circuit from AC
output to ground.
F i gu r e 1 8. Ma ximum
o u t pu t
c urr en t
v s .
voltage [V
CEsat
] across
each output transistor
Figure 19. Safe operating area and
collector characteristics of the
protected power transistor
THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers the
following advantages:
1. An overload on the output (even if it is perma-
nent), or an abovelimit ambient temperaturecan
be easily supported since the T
j
cannot be
higher than 150
C.
2. The heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no possibility of device damage due to
high junction temperature.If for any reason, the
junction temperature increases up to 150
C, the
thermal shut-down simply reduces the power
dissipation at the current consumption.
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e. its
thermal resistance); fig. 22 shows this dissipable
power as a function of ambient temperature for
different thermal resistance.
TDA2030
Figure 20. Output power and
d ra i n cu r ren t vs. c ase
temperature (R
L
= 4
)
Figure 21. Output power and
d r a i n c u rr en t vs. c as e
temperature (R
L
= 8
)
F i gu r e
2 2.
Ma ximum
allowable power dissipation
vs. ambient temperature
Figure 23. Example of heat-sink
Dimension : suggestion.
The following table shows the length that
the heatsink in fig.23 must have for several
values of P
tot
and R
th
.
Ptot (W)
12
8
6
Length of heatsink
(mm)
60
40
30
Rth of heatsink
(
C/W)
4.2
6.2
8.3
9/11
TDA2030
10/11
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.8
0.189
C
1.37
0.054
D
2.4
2.8
0.094
0.110
D1
1.2
1.35
0.047
0.053
E
0.35
0.55
0.014
0.022
F
0.8
1.05
0.031
0.041
F1
1
1.4
0.039
0.055
G
3.4
0.126
0.134
0.142
G1
6.8
0.260
0.268
0.276
H2
10.4
0.409
H3
10.05
10.4
0.396
0.409
L
17.85
0.703
L1
15.75
0.620
L2
21.4
0.843
L3
22.5
0.886
L5
2.6
3
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6
6.6
0.236
0.260
M
4.5
0.177
M1
4
0.157
Dia
3.65
3.85
0.144
0.152
PENTAWATT PACKAGE MECHANICAL DATA
L2
L3
L5
L7
L6
Dia.
A
C
D
E
D1
H3
H2
F
G
G1
L1
L
MM
1
F1
TDA2030
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
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TDA2030
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