Qualpack TS80C31X2/C32X2
2
Rev. 2 January 1999
1. Contents
1. Contents........................................................................................................................................................ 2
2. General Information ..................................................................................................................................... 3
3. Technology Information .............................................................................................................................. 4
3.1 W
AFER
P
ROCESS
T
ECHNOLOGY
..................................................................................................................... 4
3.2 P
RODUCT
D
ESIGN
.......................................................................................................................................... 5
3.3 P
ACKAGE
T
ECHNOLOGY
................................................................................................................................. 6
3.3.1 SOIC.300 16 leads............................................................................................................................... 6
3.3.2 Other available packages .................................................................................................................... 7
3.4 T
EST
............................................................................................................................................................. 7
3.5 D
EVICE
C
ROSS
S
ECTION
................................................................................................................................ 8
3.6 W
AFER
P
ROCESS
C
ONTROL
........................................................................................................................... 9
4. Qualification ............................................................................................................................................... 10
4.1 C
HANGE
P
ROCEDURE
................................................................................................................................... 11
4.2 Q
UALIFICATION
F
LOW
................................................................................................................................... 12
4.3 W
AFER
P
ROCESS
Q
UALIFICATION
................................................................................................................. 13
4.4 P
ACKAGE
Q
UALIFICATION
............................................................................................................................. 14
4.5 D
EVICE
Q
UALIFICATION
................................................................................................................................ 16
4.5.1 ESD and Latch-up results .................................................................................................................. 17
4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17
4.5.3 Qualification status............................................................................................................................. 17
4.6 O
UTGOING
Q
UALITY AND
R
ELIABILITY
............................................................................................................ 18
4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18
4.6.2 EFR (Early Failure Rate).................................................................................................................... 19
4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19
5. User Information ........................................................................................................................................ 20
5.1 S
OLDERING
R
ECOMMENDATIONS
.................................................................................................................. 20
5.2 DRY PACK O
RDERING RULES
..................................................................................................................... 20
5.3 ESD
CAUTION
.............................................................................................................................................. 20
6. Environmental Information ....................................................................................................................... 21
7. Other Data................................................................................................................................................... 22
7.1 ISO9001 A
PPROVAL
C
ERTIFICATE
................................................................................................................ 22
7.2 D
ATABOOK
R
EFERENCE
................................................................................................................................ 23
7.3 A
DDRESS
R
EFERENCE
.................................................................................................................................. 23
8. Revision History......................................................................................................................................... 24
Qualpack TSS463 / TSS461C
Rev. 2 January 1999
3
2. General Information
Product Name:
TSS463 / TSS461C
Function:
Van Controllers
Specific features:
Serial Interface (TSS463)
Wafer process:
Z86E
Available plastic package types:
SOIC16 (TSS463), SOIC24 (TSS461C)
Locations:
Process, product development
TEMIC Semiconductors Nantes, France
Wafer plant
TEMIC Semiconductors Nantes, France
QC responsability
TEMIC Semiconductors Nantes, France
Assembly
ANAM, Korea, Philippines
Probe test
TEMIC Semiconductors Nantes, France
Final test
GATEWAY Philippines
ANAM Korea
Quality Assurance
TEMIC Semiconductors Nantes, France
Reliability testing
TEMIC Semiconductors Nantes, France
Failure analysis
TEMIC Semiconductors Nantes, France
Quality Assurance Management Nantes
Signed..........................................................
PDF 
ZIP
