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Электронный компонент: U2309B-FLG3

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U2309B
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
1 (8)
VHF/ UHF-Tuner-IC
Description
This tuner IC requires a power supply of 9 V and performs
the function of three separate oscillators an mixers,
SAWF-driver, L.O.-output and tri-state band switch.
Additional to TV-tuner application this IC is usable for
DAB (Digital Audio Broadcast) tuners.
Features
D 9 V supply voltage
D Frequency range from 48 to 860 MHz
D Band A: balanced high impedance mixer input and
amplitude controlled oscillator
D Band B + C: balanced low impedance mixer input and
symmetrical oscillator
D Balanced L. O.-outputs for prescalers or PLL
D SAW filter driver with low impedance output
D Voltage regulator for stable operating characteristics
D ESD protection on all pins except oscillator pins and
RF-inputs
Benefits
D The integration of 3 bands and the small SSO28
package allows to design very small and economical
3-band tuners with high performance.
Block Diagram
RF
Osc. A
Osc. B
Osc. C
Voltage stabiliser
Band switch
L.O.
Mixer output
SAWfilter driver
Band A
Band B
Band C

25 24 23
27
28
17
18
14
13
1 3
4 6 5 7
8 10 9 11
19 2
22 26 21
20
16 15
12
95 10717
Figure 1. Block diagram
U2309B
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
2 (8)
Pin Description
1
2
3
4
5
6
7
8
10
9
27
22
21
20
18
19
17
12
11
28
25
26
23
24
Osc B, coll.
Osc B, base
Osc C, base
Osc C, coll.
Osc C, coll.
Osc C, base
Osc B, base
Osc B, coll.
Band sw.
Osc A, coll.
GND (common)
Osc A, base
RF in, B
RF in, B
RF in, C
RF in, C
V
S
Mix out
RF in, A
RF in, A
Mix out
GND (RF)
L.O. out
L.O. out
16
15
14
13
95 10886
SAWF, out
SAWF, out
SAWF, inp.
SAWF, inp.
Pin
Symbol
Function
1
Osc A, base Oscillator band A, base
2
GND
(common)
Ground, common
3
Osc A, coll. Oscillator band A, collector
4, 7
Osc B, base Oscillator band B, bases
5, 6
Osc B, coll. Oscillator band B, collectors
8, 11
Osc C, base Oscillator band C, bases
9, 10
Osc C, coll. Oscillator band C, collectors
12
Band sw.
Tri-state band switch
13, 14
SAWF, out
SAW filter driver outputs
15, 16
SAWF, inp. SAW filter driver inputs
17, 18
Mix out
Mixer outputs, open collec-
tor
19
V
S
Supply voltage V
s
20, 21
RF in, C
RF inputs, band C
22, 23
RF in, B
RF inputs, band B
24, 25
RF in, A
RF inputs, band A
26
GND (RF)
Ground, RF part
27, 28
L.O. out
L.O.-outputs
Ordering Information
Extended Type Number
Package
Remarks
U2309B-FLG3
SO28
Taped and reeled
U2309B-FSG3
SSO28
Taped and reeled
U2309B
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
3 (8)
Absolute Maximum Ratings
All voltages are referred to GND, Pin 2
Parameters
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
Pin 19
V
S
10.5
V
RF inputs
Pin (20-25)
5.0
V
IF outputs
Pin 17-18
10.5
V
Tri-state switch voltage
Pin 12
ViTRI
10.5
V
Junction temperature
T
j
125
C
Storage temperature
T
stg
40
125
C
Operating Range
All voltages are referred to GND, Pin 2
Parameters
Test Conditions / Pins
Symbol
Min
Typ
Max
Unit
Supply voltage
Pin 17-19
V
S
8.1
9
9.9
V
Ambient temperature
T
amb
25
75
C
Thermal Resistance
Parameters
Symbol
Typ
Unit
Junction ambient
Package SO28 soldered to PCB
Package SSO28 soldered to PCB (see layout page 5)
R
thJA
70
128
K/W
Electrical Characteristics
Test conditions (unless otherwise specified): V
s
= 9 V. T
amb
= 25
C. Reference point Pin 2
Parameters
Test Conditions / Pins
Symbol
Min
Typ
Max
Unit
Supply voltage
Pin 17-19
V
S
8.1
9.0
9.9
V
Supply current
Pin 17-19
I
S
42
50
mA
Band switch
Voltage band A
Pin 12
VSWA
0
0
1.0
V
Voltage band B
Pin 12
VSWB
1.6
2.0
2.4
V
Voltage band C
Pin 12
VSWC
3.4
4.0
5.0
V
Switching current
VSW = 5 V
Pin 12
ISW
100
mA
L. O .-output
L. O. level each output
RL = 50 Ohm Pin 27, 28
PLO
25
17
dBm
SAW filter driver fi = 36 MHz
Input impedance
Pin 15, 16
ZiSAW
450
Ohm
Output impedance
Pin 13, 14
ZoSAW
70
Ohm
Voltage gain
Pin 15, 16
13, 14
GvSAW
17
dB
U2309B
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
4 (8)
Electrical Characteristics (continued)
Parameters
Test Conditions / Pins
Symbol
Min
Typ
Max
Unit
Band A
Input frequency range
Pin 24
fiA
48
170
MHz
Input impedance
Figure 3
Pin 24
S11A
Gain (note 4)
Pin I/P to O/P
GA
28
dB
Noise figure DSB (note 2)
Pin I/P to O/P
fiA = 50 MHz
fiA = 150 MHz
NF
NF
11.5
12
dB
dB
Input level for (note 3):
Each carrier
IM3 (interm. of 3rd order
fiA = 71 MHz Pin I/P
ViA
23
dBm
IM2 (interm. of 2nd order)
fiA = 71 MHz Pin I/P
ViA
22
dBm
Band B (note 1)
Input frequency range
Pin 22, 23
fiA
170
470
MHz
Input impedance
Pin 22, 23
S11B
see Fig. 3
Gain (note 4)
Pin I/P to O/P
GB
32
dB
Noise figure DSB (note 2)
Pin I/P to O/P
fiB = 200 MHz
fiB = 450 MHz
NF
NF
9.5
10
dB
dB
Input level for (note 3):
Each carrier
IM3 (interm. of 3rd order)
fiB = 300 MHz Pin I/P
ViB
28
dBm
Band C (note 1)
Input frequency range
Pin 20, 21
fiC
470
860
MHz
Input impedance
Figure 3
Pin 20, 21
S11C
Gain
Pin I/P to O/P
GC
32
dB
Noise figure DSB (note 2)
Pin I/P to O/P
fiC = 500 MHZ
fiC = 800 MHz
NF
NF
10.5
11.5
dB
dB
Input level for IM3
(interm. of 3rd order, note 3)
Each carrier
fiC = 600 MHz Pin I/P
ViC
28
dBm
Notes
1)
The RF inputs B and C are symmetrical driven by means of a hybrid for 180
phase shifting, consequently the
source impedance is 100
W. All other impedance for RF tests is 50 W.
2)
The noise figure (NF) is the value for double-side-band measurement.
3)
The intermodulation test (2-carrier-method) which is made on IF-centre is in reference to a signal-to-IM ratio
of 60 dB.
4)
Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input.
U2309B
TELEFUNKEN Semiconductors
Rev. A2, 29-May-96
5 (8)
Test and Principle Application Circuit
Hybrids 0 / 180 degree
with 50 ohms Z(in)
and 100 ohms (2x50) Z(out)
I/P
Band C
Band B
Band A
UHF
VHFH
VHFL
180
180
I/P
I/P
L6
15p
10n
VS
IF : PC 38.9 MHz
SC 33.4 MHz
1n 1n
1n 1n 1n 1n
1n 1n
100p
100p
L.O.
L.O.
U2309B
1
25
5
9
21
13
17
The outputvoltage of the
IF is calculated back to the
primary coil of L5
L5
IFOut
O/P
1n
1n
15p
L2
L3
2p2
2p7
1p
1p
1p
1p
68p
1p
2p
18
2p2
2p7
L1 8 turns 3.0 mm dia.
L2 3 turns 2.5 mm dia.
L3 3 turns 2.5 mm dia.
L4 3 turns 2.5 mm dia.
Air Coils 0.6 mm
enamelled copper wire
L5 12+2 turns
L6 6+6 turns
TOKOCoils
18k
BB620
82p
L1
1k
BB619
18k
18k
L4
BB515
8p2
100p
2k2
1n
18k
VSW
VT
10n
o
o
95 10718
Figure 2.
Test and principle application circuit
PCB for the R
thJA
-Measurement
R(th) SO28 U2300B
95 10719
Figure 3.
PCB for the R
thJA
-measurement
Material: 35
mm one-sided Cu-coated epoxy PCB,
40 mm
40 mm 1.5 mm