U2739M

Preliminary Information

Rev. A1, 02-Nov-98

1 (4)

DAB One-Chip Channel- and Source / Data Decoder

Description

The U2739M is an integrated circuit in advanced CMOS
technology for demodulation and decoding of a DAB
signal according to ETS 300 401. The channel decoder
part includes the main features OFDM demodulation and
time and frequency synchronization synchronization
algorithms on OAK DSP core platform. The audio source
decoder supports ISO MPEG 1, 2 layer II half and full
sampling rate. The data decoder part is realized on the
integrated OAK DSP core and includes 2 packet mode

decoders. Several standard interfaces, like I2C/L3, I2S or
RDI are implemented to offer a flexible utilization. The
U2739M offers a user-defined implementation of the time
and frequency synchronization by down-loading the
corresponding software algorithms to the OAK DSP core.

Electrostatic sensitive device.
Observe precautions for handling.

Features

D Support of mode I, II, III and IV

according to ETS 300 401

D Time and frequency synchronization with a wide-

range parameter set

Optional implementation of user-defined synchronization
strategy by using OAK USE-bootmode

D Flexible software configuration (set 1 (temic

kernel), set 2 (user extension) concept)

D Automatic mode detection (AMD)
D Generation of receiver status information
D Generation of tuner control signals
D Generation of pulse width modulated VCXO control

signal

D Plastic TQFP100 package or

plastic LQFP144 respectively
ceramic QFP144 package for software development

D Power supply 3.3 V, master clock 24.576 MHz

Channel Decoder

D Demodulation and decoding of up to 64 UEP/EEP

sub-channels

D Support of dynamic multipex reconfiguration (DMR)

without mute state

D Digital Null-Symbol detection (FSYNCH generation)
D Channel filtering (48 dB)
D Optional SAW filter equilization

Digital AFC (frequency tolerance < 0.5 Hz for mode I)

D Digital AGC with a gain control range of 40 dB
D On-chip de-interleaver memory for full 1.8 Mbit/s

decoding data rate

D Time and frequency synchronization on

DSP OAK core

D FIC interpreter
D Support of AIC decoding (set 2)
D Support of Tll decoding and corresponding RDI inser-

tion (set 2)

Audio Source Decoder

D Audio source decoder ISO MPEG 1, 2 layer II

(ISO/IEC 11172/3)

D Half (24 kHz according ISO/IEC 13818-3) and full

(48 kHz) sampling rate

D I2S and SPDIF output interfaces
D Programmable fader
D Programmable DRC

Data Decoder

D Support 2 packet mode decoder on OAK DSP core
D FIC on-chip memory, acces via MC interface
D V24/RS232 output

U2739M

Rev. A1, 02-Nov-98

Preliminary Information

2 (4)

Interfaces

D Source decoder output interface: I2S and SPDIF

D Data decoder output interface: V24/RS232

D Channel decoder output interface: RDI and SFCO

D Microcontroller interface: I2C/L3

D RDI

Extended high capacity mode

IEC 958 format

RDI control channel (RCC)

D SFCO simple full capacity output

Window-, serial sub-channel identifier (SbChld)-,
data-, error- and clock line

3.072 MHz burst mode interface

D 10-bit ADC interface

ADC sampling clock generation

ADC binary or 2's complement format selection

Support of several intermediate frequencies

D DSP OAK core bootstrap ROM interface
D Voltage controlled reference oscillator (VCXO) inter-

face

D Time deinterleaver SRAM (4 Mbit) interface
D High speed serial output HSSO (PAD, DD1, DD2,

CIR) interface, 3-line serial burst mode interface

Block Diagram

15004

Channel

decoder

Source

decoder

Data

decoder

RDI

interface

ADC

ROM

Tuner

DAC

I2S

SPDIF

V24/RS232

interface

MCU

SFCO

RDI

RAM

U2739M

HSSO

Figure 1. TEMIC DAB receiver concept

Ordering Information

Extended Type Number

Package

Remarks

U2739M

TQFP100

U2739M

LQFP144

U2739M

QFP144

U2739M

Rev. A1, 02-Nov-98

Preliminary Information

4 (4)

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It is the policy of TEMIC Semiconductor GmbH to

1. Meet all present and future national and international statutory requirements.

2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems

with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.

It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs ).

The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.

TEMIC Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.

1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively

2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental

Protection Agency ( EPA ) in the USA

3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.

TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.

We reserve the right to make changes to improve technical design and may do so without further notice.

Parameters can vary in different applications. All operating parameters must be validated for each customer

application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized

application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,

directly or indirectly, any claim of personal damage, injury or death associated with such unintended or

unauthorized use.

TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany

Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423

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