CC2550
Preliminary Data Sheet (rev. 1.1) SWRS039
Page 1 of 51
CC2550
Single Chip Low Cost Low Power RF-Transmitter
Applications
2400-2483.5MHz ISM/SRD band systems
Wireless game controllers
Wireless audio
Consumer Electronics
Product Description
The
CC2550 is a low cost true single chip
2.4GHz transmitter designed for very low
power wireless applications. The circuit is
intended for the ISM (Industrial, Scientific and
Medical) and SRD (Short Range Device) freq-
uency band at 2400MHz-2483.5MHz.
The RF transmitter is integrated with a highly
configurable baseband modulator which has a
configurable data rate up to 500kbps. The
communication range can be increased by
enabling a Forward Error Correction option,
which is integrated in the modulator.
The
CC2550 provides extensive hardware
support for packet handling, data buffering and
burst transmissions.
The main operating parameters and the 64-
byte transmit FIFO of
CC2550 can be controlled
via an SPI interface. In a typical system, the
CC2550 will be used together with a micro-
controller and a few additional passive
components.
CC2550 is based on Chipcon's SmartRF
04
technology in 0.18
m CMOS.
Key Features
Small size (QLP 4x4mm package, 16 pins)
True single chip 2.4GHz RF transmitter
Frequency
range:
2400MHz-2483.5MHz
Programmable data rate up to 500kbps
Low
current
consumption
Programmable output power up to +1dBm
Very few external components: Totally on-
chip frequency synthesizer, no external
filters needed
Programmable
baseband
modulator
Ideal for multi-channel operation
Configurable packet handling hardware
Suitable for frequency hopping systems
due to a fast settling frequency synthesizer
Optional Forward Error Correction with
interleaving
64-byte TX data FIFO
Suited for systems compliant with EN 300
328 and EN 300 440 class 2 (Europe),
CFR47 Part 15 (US), and ARIB STD-T66
(Japan)
Many powerful digital features allow a
high-performance RF system to be made
using an inexpensive microcontroller
Efficient SPI interface: All registers can be
programmed with one "burst" transfer
Integrated analog temperature sensor
Lead-free "green" package
Flexible support for packet oriented
systems: On chip support for sync word
insertion, flexible packet length and
automatic CRC handling
OOK
supported
2-FSK, GFSK and MSK supported.
Optional automatic whitening of data
Support for asynchronous transparent
transmit mode for backwards compatibility
with existing radio communication
protocols
CC2550
Preliminary Data Sheet (rev. 1.1) SWRS039
Page 2 of 51
Table Of Contents
APPLICATIONS...........................................................................................................................................1
PRODUCT DESCRIPTION.........................................................................................................................1
KEY FEATURES ..........................................................................................................................................1
TABLE OF CONTENTS ..............................................................................................................................2
1
ABBREVIATIONS............................................................................................................................4
2
ABSOLUTE MAXIMUM RATINGS ..............................................................................................5
3
OPERATING CONDITIONS ..........................................................................................................5
4
ELECTRICAL SPECIFICATIONS ................................................................................................5
5
GENERAL CHARACTERISTICS..................................................................................................6
6
RF TRANSMIT SECTION...............................................................................................................6
7
CRYSTAL OSCILLATOR...............................................................................................................7
8
FREQUENCY SYNTHESIZER CHARACTERISTICS ...............................................................7
9
ANALOG TEMPERATURE SENSOR...........................................................................................8
10
DC CHARACTERISTICS................................................................................................................8
11
POWER ON RESET .........................................................................................................................8
12
PIN CONFIGURATION...................................................................................................................9
13
CIRCUIT DESCRIPTION .............................................................................................................10
14
APPLICATION CIRCUIT .............................................................................................................11
15
CONFIGURATION OVERVIEW.................................................................................................12
16
CONFIGURATION SOFTWARE.................................................................................................13
17
4-WIRE SERIAL CONFIGURATION AND DATA INTERFACE ...........................................14
17.1
C
HIP
S
TATUS
B
YTE
............................................................................................................................14
17.2
R
EGISTER
A
CCESS
..............................................................................................................................15
17.3
C
OMMAND
S
TROBES
..........................................................................................................................15
17.4
FIFO
A
CCESS
.....................................................................................................................................15
17.5
PATABLE
A
CCESS
............................................................................................................................15
18
MICROCONTROLLER INTERFACE AND PIN CONFIGURATION ...................................17
18.1
C
ONFIGURATION
I
NTERFACE
..............................................................................................................17
18.2
G
ENERAL
C
ONTROL AND
S
TATUS
P
INS
..............................................................................................17
19
DATA RATE PROGRAMMING...................................................................................................18
20
PACKET HANDLING HARDWARE SUPPORT .......................................................................18
20.1
D
ATA WHITENING
...............................................................................................................................18
20.2
P
ACKET FORMAT
................................................................................................................................19
20.3
P
ACKET
H
ANDLING IN
T
RANSMIT
M
ODE
............................................................................................20
21
MODULATION FORMATS ..........................................................................................................20
21.1
F
REQUENCY
S
HIFT
K
EYING
................................................................................................................20
21.2
M
INIMUM
S
HIFT
K
EYING
....................................................................................................................20
21.3
A
MPLITUDE
M
ODULATION
.................................................................................................................21
22
FORWARD ERROR CORRECTION WITH INTERLEAVING ..............................................22
22.1
F
ORWARD
E
RROR
C
ORRECTION
(FEC)...............................................................................................22
22.2
I
NTERLEAVING
...................................................................................................................................22
23
RADIO CONTROL.........................................................................................................................23
23.1
P
OWER ON START
-
UP SEQUENCE
.........................................................................................................23
23.2
C
RYSTAL
C
ONTROL
............................................................................................................................24
23.3
V
OLTAGE
R
EGULATOR
C
ONTROL
.......................................................................................................24
23.4
A
CTIVE
M
ODE
....................................................................................................................................24
23.5
T
IMING
...............................................................................................................................................25
24
DATA FIFO .....................................................................................................................................25
CC2550
Preliminary Data Sheet (rev. 1.1) SWRS039
Page 3 of 51
25
FREQUENCY PROGRAMMING.................................................................................................26
26
VCO ..................................................................................................................................................27
26.1
VCO
AND
PLL
S
ELF
-C
ALIBRATION
...................................................................................................27
27
VOLTAGE REGULATORS ..........................................................................................................27
28
OUTPUT POWER PROGRAMMING .........................................................................................27
29
CRYSTAL OSCILLATOR.............................................................................................................29
29.1
R
EFERENCE SIGNAL
............................................................................................................................29
30
EXTERNAL RF MATCH ..............................................................................................................29
31
GENERAL PURPOSE / TEST OUTPUT CONTROL PINS ......................................................30
32
ASYNCHRONOUS AND SYNCHRONOUS SERIAL OPERATION .......................................32
32.1
A
SYNCHRONOUS OPERATION
..............................................................................................................32
32.2
S
YNCHRONOUS SERIAL OPERATION
....................................................................................................32
33
CONFIGURATION REGISTERS.................................................................................................32
33.1
C
ONFIGURATION
R
EGISTER
D
ETAILS
.................................................................................................36
33.2
S
TATUS REGISTER DETAILS
.................................................................................................................45
34
PACKAGE DESCRIPTION (QLP 16)..........................................................................................47
34.1
R
ECOMMENDED
PCB
LAYOUT FOR PACKAGE
(QLP
16) .....................................................................48
34.2
P
ACKAGE THERMAL PROPERTIES
........................................................................................................48
34.3
S
OLDERING INFORMATION
..................................................................................................................48
34.4
T
RAY SPECIFICATION
..........................................................................................................................49
34.5
C
ARRIER TAPE AND REEL SPECIFICATION
...........................................................................................49
35
ORDERING INFORMATION.......................................................................................................49
36
GENERAL INFORMATION.........................................................................................................49
36.1
D
OCUMENT
H
ISTORY
.........................................................................................................................49
36.2
P
RODUCT
S
TATUS
D
EFINITIONS
.........................................................................................................50
36.3
D
ISCLAIMER
.......................................................................................................................................50
36.4
T
RADEMARKS
.....................................................................................................................................50
36.5
L
IFE
S
UPPORT
P
OLICY
........................................................................................................................50
37
ADDRESS INFORMATION ..........................................................................................................51
CC2550
Preliminary Data Sheet (rev. 1.1) SWRS039
Page 4 of 51
1 Abbreviations
Abbreviations used in this data sheet are described below.
2-FSK
Binary Frequency Shift Keying
OOK
On-Off-Keying
ADC
Analog to Digital Converter
PA
Power Amplifier
AFC
Automatic Frequency Offset Compensation
PCB
Printed Circuit Board
AGC
Automatic Gain Control
PD
Power Down
AMR
Automatic Meter Reading
PER
Packet Error Rate
ASK
Amplitude Shift Keying
PLL
Phase Locked Loop
BER
Bit Error Rate
PQI
Preamble Quality Indicator
CCA
Clear Channel Assessment
RCOSC
RC Oscillator
CRC
Cyclic Redundancy Check
RF
Radio Frequency
EIRP
Equivalent Isotropic Radiated Power
RSSI
Received Signal Strength Indicator
ESR
Equivalent Series Resistance
RX
Receive, Receive Mode
FEC
Forward Error Correction
SAW
Surface Aqustic Wave
FIFO First-In-First-Out
SNR
Signal to Noise Ratio
FSK
Frequency Shift Keying
SPI
Serial Peripheral Interface
GFSK
Gaussian shaped Frequency Shift Keying
TBD
To Be Defined
LNA
Low Noise Amplifier
TX
Transmit, Transmit Mode
LO
Local Oscillator
VCO
Voltage Controlled Oscillator
LQI
Link Quality Indicator
XOSC
Crystal Oscillator
MCU Microcontroller
Unit
XTAL Crystal
MSK
Minimum Shift Keying
CC2550
Preliminary Data Sheet (rev. 1.1) SWRS039
Page 5 of 51
2 Absolute
Maximum
Ratings
Under no circumstances must the absolute maximum ratings given in Table 1 be violated. Stress
exceeding one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
Parameter
Min
Max
Units
Condition
Supply voltage
0.3
3.6
V
All supply pins must have the same voltage
Voltage on any digital pin
0.3
VDD+0.3
max 3.6
V
Voltage on the pins RF_P, RF_N
and DCOUPL
0.3 2.0 V
Voltage ramp-up rate
120
kV/s
Input RF level
10
dBm
Storage temperature range
50
150
C
Solder reflow temperature
260
C
T = 10 s
Table 1: Absolute Maximum Ratings
3 Operating
Conditions
The operating conditions for
CC2550 are listed Table 2 in below.
Parameter
Min
Max
Unit
Condition
Operating temperature
40
85
C
Operating supply voltage
1.8
3.6
V
All supply pins must have the same voltage
Table 2: Operating Conditions
4 Electrical
Specifications
Tc = 25
C, VDD = 3.0V if nothing else stated. The values are preliminary results and will be updated in later versions of
the data sheet.
Parameter
Min Typ Max Unit Condition
Current consumption
1.2
mA
Only voltage regulator to digital part and crystal oscillator running
(IDLE state)
6.8
mA
Only the frequency synthesizer running (after going from IDLE
until reaching TX state, and frequency calibration states)
12.8
mA
Transmit mode, 12dBm output power (TX state)
16.4
mA
Transmit mode, -6dBm output power (TX state)
22.8
mA
Transmit mode, 0dBm output power (TX state)
Current consumption in power
down modes
180
A
Voltage regulator to digital part on, all other modules in power
down (XOFF state)
200
nA
Voltage regulator to digital part off (SLEEP state)
Table 3: Electrical Specifications
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