x
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
1
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
D
SMJ: QML Processing to MILPRF38535
D
TMP: Commercial Level Processing
D
Operating Temperature Ranges:
Military (M) 55
C to 125
C
Commercial (C) 25
C to 85
C
Commercial (L) 0
C to 70
C
D
Highest Performance Floating-Point Digital
Signal Processor (DSP)
'C40-50:
40-ns Instruction Cycle Time:
50 MFLOPS, 25 MIPS, 275 MOPS,
320 MBps
'C40-40:
50-ns Instruction Cycle Time:
40 MFLOPS, 20 MIPS, 220 MOPS,
256 MBps
D
Six Communications Ports
D
6-Channel Direct Memory Access (DMA)
Coprocessor
D
Single-Cycle Conversion to and From
IEEE-745 Floating-Point Format
D
Single Cycle 1/x, 1/
D
Source-Code Compatible With SMJ320C30
D
Validated Ada Compiler
D
Single-Cycle 40-Bit Floating-Point,
32-Bit Integer Multipliers
D
12 40-Bit Registers, 8 Auxiliary Registers,
14 Control Registers, and 2 Timers
D
IEEE Standard 1149.1
Test-Access Port
(JTAG)
D
Two Identical External Data and Address
Buses Supporting Shared Memory Systems
and High Data-Rate, Single-Cycle
Transfers:
High Port-Data Rate of 100 MBytes/s
(Each Bus)
16G-Byte Continuous
Program/Data/Peripheral Address Space
Memory-Access Request for Fast,
Intelligent Bus Arbitration
Separate Address-, Data-, and
Control-Enable Pins
Four Sets of Memory-Control Signals
Support Different Speed Memories in
Hardware
D
Fabricated Using Enhanced Performance
Implanted CMOS (EPIC
) Technology by
Texas Instruments (TI
)
D
Separate Internal Program, Data, and DMA
Coprocessor Buses for Support of Massive
Concurrent Input/Output (I/O) of Program
and Data Throughput, Maximizing
Sustained Central Processing Unit (CPU)
Performance
D
On-Chip Program Cache and
Dual-Access/Single-Cycle RAM for
Increased Memory-Access Performance
512-Byte Instruction Cache
8K Bytes of Single-Cycle Dual-Access
Program or Data RAM
ROM-Based Bootloader Supports
Program Bootup Using 8-, 16-, or 32-Bit
Memories Over Any One of the
Communications Ports
description
The TMP / SMJ320C40KGD DSP is a 32-bit, floating-point processor manufactured in 0.72-
m, double-level
metal CMOS technology. It is the fourth generation of DSPs from Texas Instruments, and it is the world's first
DSP designed for parallel processing. The on-chip parallel processing capabilities of the 'C40 make the
floating-point performance required by many applications achievable and cost-effective.
The TMP / SMJ320C40 is the first DSP with on-chip communication ports for processor-to-processor
communication using simple communication software with no external hardware. This allows connectivity with
no external glue logic. The communication ports remove I/O bottlenecks, and the independent smart-DMA
coprocessor is able to handle the CPU I/O requirements.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2001, Texas Instruments Incorporated
IEEE Standard 1149.11990 Standard Test-Access Port and Boundary-Scan Architecture
EPIC and TI are trademarks of Texas Instruments Incorporated.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
2
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
description (continued)
The features of the communication ports are:
D
Six communication ports for direct interprocessor communication and processor I/O
D
20 MBps bidirectional interface on each communication port for high-speed and low-cost multiprocessor
interface
D
Separate input and output first-in, first-out (FIFO) buffers for I / O and processor-to-processor
communication
D
Automatic arbitration and handshaking for direct processor-to-processor connection
The DMA coprocessor allows concurrent I/O and CPU processing for superior sustained CPU performance.
The key features of the DMA coprocessor:
D
Link pointers that allow DMA channels to auto-initialize
D
Parallel CPU operation and DMA transfers
D
Six DMA channels support communication-port-to-memory data transfers
The TMP/SMJ320C40KGD CPU is configured for high-speed internal parallel processing. The key features of
the CPU are:
D
Eight operations / cycles
40- / 32-bit floating-point / integer multiply
40-/32-bit floating-point / integer arithmetic and logic unit (ALU) operation
Two data accesses
Two address-register updates
D
IEEE floating-point conversion
D
Division and square-root support
D
'C30 assembly language compatibility
D
Byte and halfword accessibility
Key factors in a parallel-processing implementation are the development tools that are available. The 'C40 is
supported by a host of parallel-processing development tools for developing and simulating code and for
debugging parallel-processing systems. The code generation tools include:
D
Optimizing ANSI C compiler with a runtime library that supports use of communication ports and DMA
D
SPOX
, by Spectron Microsystems Incorporated, which provides parallel processing support as well as
DMA and communication port drivers
D
Assembler and linker with support for mapping program and data to parallel processors.
SPOX is a trademark of Spectron Microsystems, Inc.
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
3
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
description (continued)
The simulation tools include:
D
Parallel DSP system-level simulation, by Logic Modeling Corporation (LMC), which includes a hardware
verification (HV) model and a full functional (FF) model
D
TI software simulator with high-level language debugger interface for simulating a single processor
The hardware development and verification tools include:
D
Parallel processor in-circuit emulator and high-level language debugger: XDS510
D
Parallel processor development system with four TMS320C40s, local and global memory, and
communication port connections
For additional information when designing for cold temperature operation, please see Texas Instruments
application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature
number SGUA001.
known good die technology
Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications.
There are currently two verification technologies used at TI to support KGD requirements for the
TMP/SMJ320C40KGD: Removable Tab (R-Tab), and Temporary Wire Bond (TWB).
The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the
use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using modified bonding
parameters. This technique allows easy removal of the tape after all needed 100% screens and parametric tests
have been performed. The tape is removed from the tested part and the die is shipped in a conventional die
container. The gold bumps remain on the bond pads, which allow for subsequent attachment of gold-ball bonds.
Similarly, with KGD using the TWB technique, bond wires are attached to the bond pads using adjusted bonding
parameters which allow for easy removal of the die after all needed 100% screens and parametric tests have
been performed. The die is removed from the temporary package and the die is shipped in a conventional die
container.
visual inspection of known good die (KGD) using temporary wire bond (TWB) process
QML KGD devices produced using the TWB technology do not optically meet MIL-STD-883E (Method 2010,
paragraph 3.1.1.1.h) metal bond pad visual inspection criterion due to the bond pad marks formed during
bonding removal process. However, these devices have been reliably bonded using normal wire bond
precesses, and pass bond strength evaluations.
electrical specifications
For military electrical and timing specifications, please refer to the SMJ320C40 Digital Signal Processor data
sheet, literature number SGUS017. For commercial electrical and timing specifications, see the TMS320C40
Digital Signal Processor Data Sheet, literature number SPRS038.
XDS510 is a trademark of Texas Instruments Incorporated.
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
4
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
SMJ
320
C
40
M
KGD
50
PREFIX
SMJ =
MIL-PRF-38535 Processing
TMP =
Commercial Level
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
DEVICE
40 = Floating-Point DSP
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M (Military)
=
55
C to 125
C
L (Commercial) =
0
C to 70
C
C
DIE REVISION
C
= Revision 5.2
T
KGD OPTION
T
= TWB process
blank = R-Tab process
Figure 1. TMP / SMJ320C40KGD Device Nomenclature
JEDEC STANDARD
D
Die thickness is approximately 15 mils
1 mil.
D
Backside surface finish is silicon.
D
Maximum allowable die junction operating temperature is 175
C.
D
Glassivation material is compressive nitride.
D
Bond pad metal is composed of copper-doped aluminum.
D
Percent defective allowed for burned-in die is 5.
D
Life test data is available.
D
Configuration control notification.
D
Group A attribute summary is available (SMJ only).
D
Suggested die-attach material is silver glass (QMI 2569F).
D
Suggested bond wire size is 1.25 mil.
D
For gold bumped KGD die, suggested bonding method is gold-ball bonding.
D
ESD rating is Class II.
D
Maximum allowable peak process temperature for die-attach is 440
C
5
C (for QMS2569F)
D
Saw kerf is dependent on blade size used.
D
Die backside potential is left floating.
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
5
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
'320C40 (rev 5.2) known good die pad information
325
244
Die Side Number 4
Pad Number One
1
Die Side Number 1
81
Zero-Zero
(origin)
82
162
Die Side Number 2
243
Die Side Number 3
163
Die Designator
Figure 2. '320C40 Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
D
The 'C40 signal identities in relation to the pad numbers
D
The 'C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0)
In addition, the following notes are significant:
A.
X,Y coordinate data is in microns.
B.
The active silicon dimensions are 12 424.86
m
12 035.52
m (489.16 mils
473.83 mils).
C.
The die size is approximately 12 598.40
m
12 192.00
m (496.00 mils
480.00 mils).
D.
Bond pad dimensions are 108.00
m
108.00
m (4.25 mils
4.25 mils).
E.
Center of bond pad to edge of die min (without scribe) = 107.80
m (4.24 mils).
F.
For R-Tab devices, gold bump dimensions are approximately 92
m
92
m (3.62 mils
3.62 mils).
G.
Coordinate origin is at (0,0) (center of bond pad 82).
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
6
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m)
DIE SIDE #1
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
1
D31
11368.44
126.00 (1, 2)
2
D30
11242.44
126.00 (2, 3)
3
D29
11116.44
126.00 (3, 4)
4
D28
10990.44
126.00 (4, 5)
5
D27
10864.44
126.00 (5, 6)
6
D26
10738.44
126.00 (6, 7)
7
GDDVDD
10612.44
126.00 (7, 8)
8
D25
10486.44
126.00 (8, 9)
9
D24
10360.44
126.00 (9, 10)
10
D23
10234.44
126.00 (10, 11)
11
D22
10108.44
126.00 (11, 12)
12
D21
9982.44
126.00 (12, 13)
13
D20
9856.44
126.00 (13, 14)
14
D19
9730.44
126.00 (14, 15)
15
D18
9604.44
126.00 (15, 16)
16
D17
9478.44
126.00 (16, 17)
17
D16
9352.44
126.00 (17, 18)
18
CVSS
9226.44
126.00 (18, 19)
19
IVSS
9100.44
126.00 (19, 20)
20
GDDVDD
8974.44
126.00 (20, 21)
21
DVSS
429 48
8848.44
126.00 (21, 22)
22
D15
429.48
8722.44
126.00 (22, 23)
23
D14
8596.44
126.00 (23, 24)
24
D13
8470.44
126.00 (24, 25)
25
D12
8344.44
126.00 (25, 26)
26
D11
8218.44
126.00 (26, 27)
27
D10
8092.44
126.00 (27, 28)
28
D9
7966.44
126.00 (28, 29)
29
D8
7840.44
126.00 (29, 30)
30
D7
7714.44
126.00 (30, 31)
31
D6
7588.44
126.00 (31, 32)
32
D5
7462.44
126.00 (32, 33)
33
GDDVDD
7336.44
126.00 (33, 34)
34
D4
7210.44
126.00 (34, 35)
35
D3
7084.44
126.00 (35, 36)
36
D2
6958.44
126.00 (36, 37)
37
D1
6832.44
126.00 (37, 38)
38
D0
6706.44
156.42 (38, 39)
39
CE1
6550.02
172.80 (39, 40)
40
RDY1
6377.22
152.10 (40, 41)
41
DVSS
6225.12
126.00 (41, 42)
42
CVSS
6099.12
126.00 (42, 43)
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
7
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #1 (CONTINUED)
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
43
LOCK
5973.12
126.00 (43, 44)
44
VDDL
5847.12
126.00 (44, 45)
45
VSSL
5721.12
156.42 (45, 46)
46
CE0
5564.70
172.80 (46, 47)
47
RDY0
5391.90
172.80 (47, 48)
48
DE
5219.10
172.80 (48, 49)
49
TCK
5046.30
152.10 (49, 50)
50
TDO
4894.20
156.42 (50, 51)
51
TDI
4737.78
172.80 (51, 52)
52
TMS
4564.98
172.80 (52, 53)
53
TRST
4392.18
151.10 (53, 54)
54
EMU0
4240.08
126.00 (54, 55)
55
EMU1
4114.08
126.00 (55, 56)
56
DVSS
3988.08
126.00 (56, 57)
57
DVDD
3962.08
126.00 (57, 58)
58
PAGE1
3736.08
126.00 (58, 59)
59
R / W1
3610.08
126.00 (59, 60)
60
STRB1
3484.08
126.00 (60, 61)
61
STAT0
3358.08
126.00 (61, 62)
62
STAT1
429.48
3232.08
126.00 (62, 63)
63
IVSS
3106.08
126.00 (63, 64)
64
STAT2
2980.08
126.00 (64, 65)
65
STAT3
2854.08
127.44 (65, 66)
66
PAGE0
2726.64
126.00 (66, 67)
67
R / W0
2600.64
126.00 (67, 68)
68
STRB0
2474.64
156.42 (68, 69)
69
AE
2318.22
174.24 (69, 70)
70
RESETLOC 1
2143.98
152.10 (70, 71)
71
DVDD
1991.88
156.42 (71, 72)
72
RESETLOC 0
1835.46
172.80 (72, 73)
73
RESET
1662.66
172.80 (73, 74)
74
CRDY5
1510.56
126.00 (74, 75)
75
CSTRB5
1384.56
126.00 (75, 76)
76
CACK5
1258.56
126.00 (76, 77)
77
CREQ5
1132.56
126.00 (77, 78)
78
CRDY4
1006.56
126.00 (78, 79)
79
CSTRB4
880.56
126.00 (79, 80)
80
CACK4
754.56
126.00 (80, 81)
81
CREQ4
628.56
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
8
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #2
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
82
CVSS
0.00
1062.00 (82, 83)
83
DVSS
1062.00
126.00 (83, 84)
84
DVDD
1188.00
126.00 (84, 85)
85
C5D7
1314.00
126.00 (85, 86)
86
C5D6
1440.00
126.00 (86, 87)
87
C5D5
1566.00
126.00 (87, 88)
88
C5D4
1692.00
126.00 (88, 89)
89
C5D3
1818.00
126.00 (89, 90)
90
C5D2
1944.00
126.00 (90, 91)
91
C5D1
2070.00
126.00 (91, 92)
92
C5D0
2196.00
126.00 (92, 93)
93
DVDD
2322.00
126.00 (93, 94)
94
C4D7
2448.00
126.00 (94, 95)
95
C4D6
2574.00
126.00 (95, 96)
96
C4D5
2700.00
126.00 (96, 97)
97
C4D4
2813.40
126.00 (97, 98)
98
C4D3
2952.00
126.00 (98, 99)
99
C4D2
3078.00
126.00 (99, 100)
100
C4D1
3204.00
126.00 (100, 101)
101
C4D0
3330.00
126.00 (101, 102)
102
CVSS
3456.00
0 00
126.00 (102, 103)
103
DVSS
3582.00
0.00
126.00 (103, 104)
104
DVDD
3708.00
126.00 (104, 105)
105
C3D7
3834.00
126.00 (105, 106)
106
C3D6
3960.00
126.00 (106, 107)
107
C3D5
4086.00
126.00 (107, 108)
108
C3D4
4212.00
126.00 (108, 109)
109
C3D3
4338.00
126.00 (109, 110)
110
C3D2
4464.00
126.00 (110, 111)
111
C3D1
4590.00
126.00 (111, 112)
112
C3D0
4716.00
126.00 (112, 113)
113
DVDD
4842.00
126.00 (113, 114)
114
IVSS
4968.00
126.00 (114, 115)
115
C2D7
5094.00
126.00 (115, 116)
116
C2D6
5220.00
126.00 (116, 117)
117
C2D5
5346.00
126.00 (117, 118)
118
C2D4
5472.00
126.00 (118, 119)
119
C2D3
5598.00
126.00 (119, 120)
120
C2D2
5724.00
126.00 (120, 121)
121
C2D1
5850.00
126.00 (121, 122)
122
C2D0
5976.00
126.00 (122, 123)
123
CVSS
6102.00
126.00 (123, 124)
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
9
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #2 (CONTINUED)
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
124
DVSS
6228.00
126.00 (124, 125)
125
DVDD
6354.00
126.00 (125, 126)
126
CRDY3
6480.00
126.00 (126, 127)
127
CSTRB3
6606.00
126.00 (127, 128)
128
CACK3
6732.00
126.00 (128, 129)
129
CREQ3
6858.00
126.00 (129, 130)
130
VDDL
6984.00
126.00 (130, 131)
131
VSSL
7110.00
126.00 (131, 132)
132
CRDY2
7236.00
126.00 (132, 133)
133
CSTRB2
7362.00
126.00 (133, 134)
134
CACK2
7488.00
126.00 (134, 135)
135
CREQ2
7614.00
126.00 (135, 136)
136
DVDD
7740.00
126.00 (136, 137)
137
CRDY1
7866.00
126.00 (137, 138)
138
CSTRB1
7992.00
126.00 (138, 139)
139
CACK1
8118.00
126.00 (139, 140)
140
CREQ1
8244.00
126.00 (140, 141)
141
CRDY0
8370.00
126.00 (141, 142)
142
CSTRB0
8496.00
126.00 (142, 143)
143
CACK0
8622.00
0.00
126.00 (143, 144)
144
CREQ0
8748.00
126.00 (144, 145)
145
CVSS
8874.00
126.00 (145, 146)
146
DVSS
9000.00
126.00 (146, 147)
147
IVSS
9126.00
126.00 (147, 148)
148
DVDD
9252.00
126.00 (148, 149)
149
C1D7
9378.00
126.00 (149, 150)
150
C1D6
9504.00
126.00 (150, 151)
151
C1D5
9630.00
126.00 (151, 152)
152
C1D4
9756.00
126.00 (152, 153)
153
C1D3
9882.00
126.00 (153, 154)
154
C1D2
10008.00
126.00 (154, 155)
155
C1D1
10134.00
126.00 (155, 156)
156
C1D0
10260.00
126.00 (156, 157)
157
DVDD
10386.00
126.00 (157, 158)
158
C0D7
10512.00
126.00 (158, 159)
159
C0D6
10638.00
126.00 (159, 160)
160
C0D5
10764.00
126.00 (160, 161)
161
C0D4
10890.00
126.00 (161, 162)
162
C0D3
11016.00
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
10
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #3
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
163
C0D2
810.00
126.00 (163, 164)
164
C0D1
936.00
126.00 (164, 165)
165
C0D0
1062.00
126.00 (165, 166)
166
CVSS
1188.00
126.00 (166, 167)
167
DVDD
1314.00
156.42 (167, 168)
168
ROMEN
1470.42
152.46 (168, 169)
169
IIOF0
1622.88
126.00 (169, 170)
170
DVSS
1748.88
126.00 (170, 171)
171
IIOF1
1874.88
126.00 (171, 172)
172
IIOF2
2000.88
126.00 (172, 173)
173
IIOF3
2126.88
156.42 (173, 174)
174
NMI
2283.30
152.10 (174, 175)
175
LSTRB0
2435.40
126.00 (175, 176)
176
LR / W0
2561.40
126.00 (176, 177)
177
LPAGE0
2687.40
156.42 (177, 178)
178
LRDY0
2843.82
172.80 (178, 179)
179
LCE0
3016.62
152.10 (179, 180)
180
LSTRB1
3168.72
126.00 (180, 181)
181
LR / W1
3294.72
126.00 (181, 182)
182
DVDD
3420.72
126.00 (182, 183)
183
CVSS
11779 74
3546.72
126.00 (183, 184)
184
LPAGE1
11779.74
3672.72
156.42 (184, 185)
185
LRDY1
3829.14
172.80 (185, 186)
186
LCE1
4001.94
172.80 (186, 187)
187
LDE
4174.74
152.10 (187, 188)
188
TCLK0
4326.84
126.00 (188, 189)
189
TCLK1
4452.84
126.00 (189, 190)
190
H3
4578.84
126.00 (190, 191)
191
H1
4704.84
156.42 (191, 192)
192
LAE
4861.26
152.10 (192, 193)
193
IVSS
5013.36
126.00 (193, 194)
194
LLOCK
5139.36
126.00 (194, 195)
195
LSTAT0
5265.36
126.00 (195, 196)
196
LSTAT1
5391.36
126.00 (196, 197)
197
LSTAT2
5517.36
126.00 (197, 198)
198
LSTAT3
5643.36
127.44 (198, 199)
199
IACK
5770.80
126.00 (199, 200)
200
VDDL
5896.80
126.00 (200, 201)
201
VSSL
6022.80
131.94 (201, 202)
202
X1
6154.74
171.58 (202, 203)
203
X2 / CLKIN
6326.28
168.12 (203, 204)
204
CVSS
6494.40
126.00 (204, 205)
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
11
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #3 (CONTINUED)
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
205
DVDD
6620.40
126.00 (205, 206)
206
DVSS
6746.40
127.44 (206, 207)
207
LA30
6873.84
126.00 (207, 208)
208
LA29
6999.84
126.00 (208, 209)
209
LA28
7125.84
126.00 (209, 210)
210
LA27
7251.84
126.00 (210, 211)
211
LADVDD
7377.84
126.00 (211, 212)
212
LA26
7503.84
126.00 (212, 213)
213
LA25
7629.84
126.00 (213, 214)
214
LA24
7755.84
126.00 (214, 215)
215
LA23
7881.84
126.00 (215, 216)
216
LA22
8007.84
126.00 (216, 217)
217
LA21
8133.84
126.00 (217, 218)
218
LA20
8259.84
126.00 (218, 219)
219
LA19
8385.84
126.00 (219, 220)
220
LA18
8511.84
126.00 (220, 221)
221
LA17
8637.84
126.00 (221, 222)
222
LA16
8763.84
126.00 (222, 223)
223
LADVDD
8889.84
126.00 (223, 224)
224
CVSS
11779.74
9015.84
126.00 (224, 225)
225
DVSS
9141.84
126.00 (225, 226)
226
LA15
9267.84
126.00 (226, 227)
227
LA14
9393.84
126.00 (227, 228)
228
LA13
9519.84
126.00 (228, 229)
229
LA12
9645.84
126.00 (229, 230)
230
LA11
9771.84
126.00 (230, 231)
231
LA10
9897.84
126.00 (231, 232)
232
LA9
10023.84
126.00 (232, 233)
233
LA8
10149.84
126.00 (233, 234)
234
LA7
10275.84
126.00 (234, 235)
235
LA6
10401.84
126.00 (235, 236)
236
LA5
10527.84
126.00 (236, 237)
237
LA4
10653.84
126.00 (237, 238)
238
LADVDD
10779.84
126.00 (238, 239)
239
LA3
10905.84
126.00 (239, 240)
240
LA2
11031.84
126.00 (240, 241)
241
LA1
11157.84
126.00 (241, 242)
242
LA0
11283.84
205.92 (242, 243)
243
DVSS
11489.76
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
12
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #4
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
244
CVSS
10953.72
126.00 (244, 245)
245
LD31
10827.72
126.00 (245, 246)
246
LD30
10701.72
126.00 (246, 247)
247
LD29
10575.72
126.00 (247, 248)
248
LD28
10449.72
126.00 (248, 249)
249
LDDVDD
10323.72
126.00 (249, 250)
250
LD27
10197.72
126.00 (250, 251)
251
LD26
10071.72
126.00 (251, 252)
252
LD25
9945.72
126.00 (252, 253)
253
LD24
9819.72
126.00 (253, 254)
254
LD23
9693.72
126.00 (254, 255)
255
LD22
9567.72
126.00 (255, 256)
256
LD21
9441.72
126.00 (256, 257)
257
LD20
9315.72
126.00 (257, 258)
258
LD19
9189.72
126.00 (258, 259)
259
LD18
9063.72
126.00 (259, 260)
260
LD17
8937.72
126.00 (260, 261)
261
LDDVDD
8811.72
126.00 (261, 262)
262
CVSS
8685.72
126.00 (262, 263)
263
DVSS
8559.72
126.00 (263, 264)
264
IVSS
8433.72
11819 88
126.00 (264, 265)
265
LD16
8307.72
11819.88
126.00 (265, 266)
266
LD15
8181.72
126.00 (266, 267)
267
LD14
8055.72
126.00 (267, 268)
268
LD13
7929.72
126.00 (268, 269)
269
LD12
7803.72
126.00 (269, 270)
270
LD11
7677.72
126.00 (270, 271)
271
LD10
7551.72
126.00 (271, 272)
272
LD9
7425.72
126.00 (272, 273)
273
LD8
7299.72
126.00 (273, 274)
274
LD7
7173.72
126.00 (274, 275)
275
LD6
7047.72
126.00 (275, 276)
276
LD5
6921.72
126.00 (276, 277)
277
LDDVDD
6795.72
126.00 (277, 278)
278
LD4
6669.72
126.00 (278, 279)
279
LD3
6543.72
126.00 (279, 280)
280
LD2
6417.72
126.00 (280, 281)
281
LD1
6291.72
126.00 (281, 282)
282
LD0
6165.72
127.62 (282, 283)
283
VDDL
6038.10
126.00 (283, 284)
284
VSSL
5912.10
126.00 (284, 285)
285
CVSS
5786.10
126.00 (285, 286)
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024C MARCH 1997 REVISED OCTOBER 2001
13
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
Table 1. '320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72
m) (Continued)
DIE SIDE #4 (CONTINUED)
C40 DIE BOND
PAD LOCATIONS
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
286
DVSS
5660.10
126.00 (286, 287)
287
A30
5534.10
126.00 (287, 288)
288
A29
5408.10
126.00 (288, 289)
289
A28
5282.10
126.00 (289, 290)
290
GADVDD
5156.10
126.00 (290, 291)
291
A27
5030.10
126.00 (291, 292)
292
A26
4904.10
126.00 (292, 293)
293
A25
4778.10
126.00 (293, 294)
294
A24
4652.10
126.00 (294, 295)
295
A23
4526.10
126.00 (295, 296)
296
A22
4400.10
126.00 (296, 297)
297
A21
4274.10
126.00 (297, 298)
298
A20
4148.10
126.00 (298, 299)
299
A19
4022.10
126.00 (299, 300)
300
A18
3896.10
126.00 (300, 301)
301
A17
3770.10
126.00 (301, 302)
302
GADVDD
3644.10
126.00 (302, 303)
303
CVSS
3518.10
126.00 (303, 304)
304
DVSS
3392.10
126.00 (304, 305)
305
A16
3266.10
11819 88
126.00 (305, 306)
306
A15
3140.10
11819.88
126.00 (306, 307)
307
A14
3014.10
126.00 (307, 308)
308
A13
2888.10
126.00 (308, 309)
309
A12
2762.10
126.00 (309, 310)
310
A11
2636.10
126.00 (310, 311)
311
A10
2510.10
126.00 (311, 312)
312
A9
2384.10
126.00 (312, 313)
313
A8
2258.10
126.00 (313, 314)
314
A7
2132.10
126.00 (314, 315)
315
A6
2006.10
126.00 (315, 316)
316
A5
1880.10
126.00 (316, 317)
317
A4
1754.10
126.00 (317, 318)
318
GADVDD
1628.10
126.00 (318, 319)
319
A3
1502.10
126.00 (319, 320)
320
A2
1376.10
126.00 (320, 321)
321
A1
1250.10
126.00 (321, 322)
322
A0
1124.10
126.00 (322, 323)
323
CVSS
998.10
558.00 (323, 324)
324
DVSS
440.10
630.00 (324, 325)
325
SUBS
189.90
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