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FEATURES
DESCRIPTION/ORDERING INFORMATION
D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
V
CC
6A
6Y
5A
5Y
4A
4Y
RGY PACKAGE
(TOP VIEW)
1
14
7
8
2
3
4
5
6
13
12
11
10
9
6A
6Y
5A
5Y
4A
1Y
2A
2Y
3A
3Y
1A
4Y
V
GND
CC
A
Y
SN74ALVC04
HEX INVERTER
SCES117J JULY 1997 REVISED JULY 2004
Operates From 1.65 V to 3.6 V
Max t
pd
of 2.8 ns at 3.3 V
24-mA Output Drive at 3.3 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
This hex inverter contains six independent inverters
designed for 1.65-V to 3.6-V V
CC
operation.
The SN74ALVC04 performs the Boolean function
Y = A.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN - RGY
Tape and reel
SN74ALVC04RGYR
VA04
Tube
SN74ALVC04D
SOIC - D
ALVC04
Tape and reel
SN74ALVC04DR
-40
C to 85
C
SOP - NS
Tape and reel
SN74ALVC04NSR
ALVC04
Tube
SN74ALVC04PW
TSSOP - PW
VA04
Tape and reel
SN74ALVC04PWR
TVSOP - DGV
Tape and reel
SN74ALVC04DGVR
VA04
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
OUTPUT
A
Y
H
L
L
H
LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright 19972004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS
(1)
SN74ALVC04
HEX INVERTER
SCES117J JULY 1997 REVISED JULY 2004
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
CC
Supply voltage range
-0.5
4.6
V
V
I
Input voltage range
(2)
-0.5
4.6
V
V
O
Output voltage range
(2) (3)
-0.5
V
CC
+ 0.5
V
I
IK
Input clamp current
V
I
< 0
-50
mA
I
OK
Output clamp current
V
O
< 0
-50
mA
I
O
Continuous output current
50
mA
Continuous current through V
CC
or GND
100
mA
D package
(4)
86
DGV package
(4)
127
JA
Package thermal impedance
NS package
(4)
76
C/W
PW package
(4)
113
RGY package
(5)
47
T
stg
Storage temperature range
-65
150
C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
This value is limited to 4.6 V maximum.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
(5)
The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS
(1)
MIN
MAX
UNIT
V
CC
Supply voltage
1.65
3.6
V
V
CC
= 1.65 V to 1.95 V
0.65
V
CC
V
IH
High-level input voltage
V
CC
= 2.3 V to 2.7 V
1.7
V
V
CC
= 2.7 V to 3.6 V
2
V
CC
= 1.65 V to 1.95 V
0.35
V
CC
V
IL
Low-level input voltage
V
CC
= 2.3 V to 2.7 V
0.7
V
V
CC
= 2.7 V to 3.6 V
0.8
V
I
Input voltage
0
3.6
V
V
O
Output voltage
0
V
CC
V
V
CC
= 1.65 V
-4
V
CC
= 2.3 V
-12
I
OH
High-level output current
mA
V
CC
= 2.7 V
-12
V
CC
= 3 V
-24
V
CC
= 1.65 V
4
V
CC
= 2.3 V
12
I
OL
Low-level output current
mA
V
CC
= 2.7 V
12
V
CC
= 3 V
24
t/
v
Input transition rise or fall rate
5
ns/V
T
A
Operating free-air temperature
-40
85
C
(1)
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
SN74ALVC04
HEX INVERTER
SCES117J JULY 1997 REVISED JULY 2004
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V
CC
MIN
TYP
(1)
MAX
UNIT
I
OH
= -100
A
1.65 V to 3.6 V
V
CC
- 0.2
I
OH
= -4 mA
1.65 V
1.2
I
OH
= -6 mA
2.3 V
2
V
OH
2.3 V
1.7
V
I
OH
= -12 mA
2.7 V
2.2
3 V
2.4
I
OH
= -24 mA
3 V
2
I
OL
= 100
A
1.65 V to 3.6 V
0.2
I
OL
= 4 mA
1.65 V
0.45
I
OL
= 6 mA
2.3 V
0.4
V
OL
V
2.3 V
0.7
I
OL
= 12 mA
2.7 V
0.4
I
OL
= 24 mA
3 V
0.55
I
I
V
I
= V
CC
or GND
3.6 V
5
A
I
CC
V
I
= V
CC
or GND,
I
O
= 0
3.6 V
10
A
I
CC
One input at V
CC
- 0.6 V,
Other inputs at V
CC
or GND
3 V to 3.6 V
750
A
C
i
V
I
= V
CC
or GND
3.3 V
3.5
pF
(1)
All typical values are at V
CC
= 3.3 V, T
A
= 25
C.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
V
CC
= 2.5 V
V
CC
= 3.3 V
V
CC
= 1.8 V
V
CC
= 2.7 V
FROM
TO
0.2 V
0.3 V
PARAMETER
UNIT
(INPUT)
(OUTPUT)
TYP
MIN
MAX
MIN
MAX
MIN
MAX
t
pd
A
Y
(1)
1
3
3.3
1
2.8
ns
(1)
This information was not available at the time of publication.
T
A
= 25
C
V
CC
= 1.8 V
V
CC
= 2.5 V
V
CC
= 3.3 V
PARAMETER
TEST CONDITIONS
UNIT
TYP
TYP
TYP
C
pd
Power dissipation capacitance per inverter
C
L
= 0,
f = 10 MHz
(1)
23
27.5
pF
(1)
This information was not available at the time of publication.
3
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PARAMETER MEASUREMENT INFORMATION
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
OH
V
OL
t
h
t
su
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
Open
GND
R
L
R
L
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at V
LOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
0 V
V
OL
+ V
V
OH
- V
0 V
V
I
0 V
0 V
t
w
V
I
V
I
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
t
pd
t
PLZ
/t
PZL
t
PHZ
/t
PZH
Open
V
LOAD
GND
TEST
S1
NOTES: A. C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR
10 MHz, Z
O
= 50
.
D. The outputs are measured one at a time, with one transition per measurement.
E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as t
en
.
G. t
PLH
and t
PHL
are the same as t
pd
.
H. All parameters and waveforms are not applicable to all devices.
0 V
V
I
V
M
t
PHL
V
M
V
M
V
I
0 V
V
OH
V
OL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
V
M
V
M
t
PLH
V
LOAD
V
LOAD
/2
1.8 V
0.15 V
2.5 V
0.2 V
2.7 V
3.3 V
0.3 V
1 k
500
500
500
V
CC
R
L
2
V
CC
2
V
CC
6 V
6 V
V
LOAD
C
L
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
V
CC
V
CC
2.7 V
2.7 V
V
I
V
CC
/2
V
CC
/2
1.5 V
1.5 V
V
M
t
r
/t
f
2 ns
2 ns
2.5 ns
2.5 ns
INPUT
SN74ALVC04
HEX INVERTER
SCES117J JULY 1997 REVISED JULY 2004
Figure 1. Load Circuit and Voltage Waveforms
4
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74ALVC04D
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74ALVC04DGVR
ACTIVE
TVSOP
DGV
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ALVC04DGVRE4
ACTIVE
TVSOP
DGV
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ALVC04DR
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74ALVC04NSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74ALVC04NSRE4
ACTIVE
SO
NS
14
2000
TBD
Call TI
Call TI
SN74ALVC04PW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ALVC04PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
Call TI
SN74ALVC04PWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ALVC04RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2005
Addendum-Page 1
MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50
4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
1
12
24
13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
38
24
16
4,90
5,10
3,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins MO-153
14/16/20/56 Pins MO-194
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20
16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Copyright
2005, Texas Instruments Incorporated
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