1
Data sheet acquired from Harris Semiconductor
SCHS159C
Features
Buffered Positive Edge Triggered Clock
Asynchronous Common Reset
Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30% of V
CC
at V
CC
= 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
IL
= 0.8V (Max), V
IH
= 2V (Min)
- CMOS Input Compatibility, I
l
1
A at V
OL
, V
OH
Description
The 'HC174 and 'HCT174 are edge triggered flip-flops which
utilize silicon gate CMOS circuitry to implement D-type flip-
flops. They possess low power and speeds comparable to low
power Schottky TTL circuits. The devices contain six master-
slave flip-flops with a common clock and common reset.
Data on the D input having the specified setup and hold
times is transferred to the Q output on the low to high
transition of the CLOCK input. The MR input, when low, sets
all outputs to a low state.
Each output can drive ten low power Schottky TTL
equivalent loads. The 'HCT174 is functional as well as, pin
compatible to the 'LS174.
Pinout
CD54HC174, CD54HCT174
(CERDIP)
CD74HC174, CD74HCT174
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER
TEMP. RANGE
(
o
C)
PACKAGE
CD54HC174F3A
-55 to 125
16 Ld CERDIP
CD54HCT174F3A
-55 to 125
16 Ld CERDIP
CD74HC174E
-55 to 125
16 Ld PDIP
CD74HC174M
-55 to 125
16 Ld SOIC
CD74HC174MT
-55 to 125
16 Ld SOIC
CD74HC174M96
-55 to 125
16 Ld SOIC
CD74HCT174E
-55 to 125
16 Ld PDIP
CD74HCT174M
-55 to 125
16 Ld SOIC
CD74HCT174MT
-55 to 125
16 Ld SOIC
CD74HCT174M96
-55 to 125
16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
MR
Q
0
D
0
D
1
Q
1
D
2
GND
V
CC
Q
5
D
5
D
4
Q
4
D
3
Q
3
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
CP
Q
2
August 1997 - Revised October 2003
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
2003, Texas Instruments Incorporated
CD54HC174, CD74HC174,
CD54HCT174, CD74HCT174
High-Speed CMOS Logic
Hex D-Type Flip-Flop with Reset
[ /Title
(CD74
HC174
,
CD74
HCT17
4)
/Sub-
ject
(High
Speed
CMOS
Logic
Hex D-
Type
Flip-
Flop
2
Functional Diagram
Logic Diagram
TRUTH TABLE
INPUTS
OUTPUT
RESET (MR)
CLOCK CP
DATA D
n
Q
n
L
X
X
L
H
H
H
H
L
L
H
L
X
Q
0
H = High Voltage Level, L = Low Voltage Level, X = Irrelevant,
= Transition from Low to
High Level, Q
0
= Level Before the Indicated Steady-State Input Conditions Were Established
CP
D
R
Q
0
Q
1
Q
2
Q
3
Q
4
Q
5
D
0
CP
D
1
D
2
D
3
D
4
D
5
MR
C
L
p
n
C
L
D
n
MR
CP
1
9
3 (4, 6, 11, 13, 14)
D
C
L
C
L
C
L
C
L
TO OTHER FIVE F/F
TO OTHER FIVE F/F
R
Q
n
2 (5, 7, 10, 12, 15)
Q
CP
C
L
p
n
C
L
p
n
C
L
C
L
p
n
8
16
V
CC
ONE OF SIX F/F
CD54HC174, CD74HC174, CD54HCT174, CD74HCT174
3
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . .
20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
20mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
25mA
DC V
CC
or Ground Current, I
CC or
I
GND
. . . . . . . . . . . . . . . . . .
50mA
Operating Conditions
Temperature Range (T
A
) . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
67
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
73
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO +85
o
C
-55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
High Level Input
Voltage
V
IH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
Low Level Input
Voltage
V
IL
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or
V
IL
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
High Level Output
Voltage
TTL Loads
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or
V
IL
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
or
GND
-
6
-
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
6
-
-
8
-
80
-
160
A
CD54HC174, CD74HC174, CD54HCT174, CD74HCT174
4
HCT TYPES
High Level Input
Voltage
V
IH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
V
IL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or
V
IL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
High Level Output
Voltage
TTL Loads
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or
V
IL
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
4
4.5
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
to
GND
0
5.5
-
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
5.5
-
-
8
-
80
-
160
A
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
I
CC
(Note 2)
V
CC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
A
NOTE:
2. For dual-supply systems theoretical worst case (V
I
= 2.4V, V
CC
= 5.5V) specification is 1.8mA.
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO +85
o
C
-55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HCT Input Loading Table
INPUT
UNIT LOADS
CP
0.80
MR
0.55
D
0.15
NOTE: Unit Load is
I
CC
limit specified in DC Electrical
Specifications table, e.g. 360
A max at 25
o
C.
Prerequisite For Switching Function
PARAMETER
SYMBOL
TEST
CONDITIONS V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
MIN
MAX
MIN
MAX
MIN
MAX
HC TYPES
Clock Pulse Width
t
w
-
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
MR Pulse Width
t
w
-
2
80
-
100
-
120
-
ns
4.5
16
-
20
-
24
-
ns
6
14
-
17
-
20
-
ns
CD54HC174, CD74HC174, CD54HCT174, CD74HCT174
5
Setup Time, Data to Clock
t
SU
-
2
60
-
75
-
90
-
ns
4.5
12
-
15
-
18
-
ns
6
10
-
13
-
15
-
ns
Hold Time, Data to Clock
t
H
-
2
5
-
5
-
5
-
ns
4.5
5
-
5
-
5
-
ns
6
5
-
5
-
5
-
ns
Removal Time, MR to Clock
t
REM
-
2
5
-
5
-
5
-
ns
4.5
5
-
5
-
5
-
ns
6
5
-
5
-
5
-
ns
Clock Frequency
f
MAX
-
2
6
-
5
-
4
-
MHz
4.5
30
-
24
-
20
-
MHz
6
35
-
28
-
24
-
MHz
HCT TYPES
Clock Pulse Width
t
w
-
4.5
20
-
25
-
30
-
ns
MR Pulse Width
t
w
-
6
25
-
31
-
38
-
ns
Setup Time, Data to Clock
t
SU
-
4.5
16
-
20
-
24
-
ns
Hold Time, Data to Clock
t
H
-
6
5
-
5
-
5
-
ns
Removal Time, MR to Clock
t
REM
-
4.5
12
-
15
-
18
-
ns
Clock Frequency
f
MAX
-
6
25
-
20
-
17
-
MHz
Switching Specifications
Input t
r
, t
f
= 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
TYP
MAX
MAX
MAX
HC TYPES
Propagation Delay, Clock to Q
t
PLH
, t
PHL
C
L
= 50pF
2
-
165
205
250
ns
4.5
-
33
41
50
ns
6
-
28
35
43
ns
C
L
= 15pF
5
13
-
-
-
ns
Propagation Delay, MR to Q
t
PLH
, t
PHL
C
L
= 50pF
2
-
150
190
225
ns
4.5
-
30
38
45
ns
6
-
26
33
38
ns
C
L
= 15pF
5
12
-
-
-
ns
Output Transition Times
t
TLH
, t
THL
C
L
= 50pF
2
-
75
95
110
ns
4.5
-
15
19
22
ns
6
-
13
16
19
ns
Input Capacitance
C
IN
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
(Notes 3, 4)
C
PD
-
5
38
-
-
-
pF
Prerequisite For Switching Function
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
MIN
MAX
MIN
MAX
MIN
MAX
CD54HC174, CD74HC174, CD54HCT174, CD74HCT174
6
HCT TYPES
Propagation Delay, Clock to Q
t
PLH
, t
PHL
C
L
= 50pF
4.5
-
40
50
60
ns
C
L
= 15pF
5
17
-
-
-
ns
Propagation Delay, MR to Q
t
PLH
, t
PHL
C
L
= 50pF
4.5
-
44
55
66
ns
C
L
= 15pF
5
18
-
-
-
ns
Output Transition Times
t
TLH
, t
THL
C
L
= 50pF
4.5
-
15
19
22
ns
Input Capacitance
C
IN
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
(Notes 3, 4)
C
PD
-
5
44
-
-
-
pF
NOTES:
3. C
PD
is used to determine the dynamic power consumption, per flip-flop.
4. P
D
= V
CC
2
f
i
+
(C
L
V
CC
2
+ f
O
) where f
i
= Input Frequency, f
O
= Input Frequency, C
L
= Output Load Capacitance, V
CC
= Supply Voltage.
Switching Specifications
Input t
r
, t
f
= 6ns (Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
TYP
MAX
MAX
MAX
Test Circuits and Waveforms
FIGURE 1. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 2. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
t
r
C
L
t
f
C
L
GND
V
CC
GND
V
CC
50%
90%
10%
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
V
CC
50%
50%
90%
10%
50%
90%
t
REM
t
PLH
t
SU(H)
t
TLH
t
THL
t
H(L)
t
PHL
IC
C
L
50pF
t
SU(L)
t
H(H)
t
r
C
L
t
f
C
L
GND
3V
GND
3V
1.3V
2.7V
0.3V
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
3V
1.3V
1.3V
1.3V
90%
10%
1.3V
90%
t
REM
t
PLH
t
SU(H)
t
TLH
t
THL
t
H(L)
t
PHL
IC
C
L
50pF
t
SU(L)
1.3V
t
H(H)
1.3V
CD54HC174, CD74HC174, CD54HCT174, CD74HCT174
MECHANICAL
MPDI002C JANUARY 1995 REVISED DECEMBER 20002
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
BB
AC
AD
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
Gauge Plane
0.015 (0,38)
0.430 (10,92) MAX
20
1.060
(26,92)
0.940
(23,88)
18
0.920
0.850
14
0.775
0.745
(19,69)
(18,92)
16
0.775
(19,69)
(18,92)
0.745
A MIN
DIM
A MAX
PINS **
(23,37)
(21,59)
Seating Plane
14/18 PIN ONLY
20 pin vendor option
4040049/E 12/2002
9
8
0.070 (1,78)
A
0.045 (1,14)
0.020 (0,51) MIN
16
1
0.015 (0,38)
0.021 (0,53)
0.200 (5,08) MAX
0.125 (3,18) MIN
0.240 (6,10)
0.260 (6,60)
M
0.010 (0,25)
0.100 (2,54)
16 PINS SHOWN
MS-100
VARIATION
AA
C
D
D
D
0.030 (0,76)
0.045 (1,14)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A).
D. The 20 pin end lead shoulder width is a vendor option, either half or full width.
MECHANICAL DATA
MSOI002B JANUARY 1995 REVISED SEPTEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
8
0.197
(5,00)
A MAX
A MIN
(4,80)
0.189
0.337
(8,55)
(8,75)
0.344
14
0.386
(9,80)
(10,00)
0.394
16
DIM
PINS **
4040047/E 09/01
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.010 (0,25)
0.016 (0,40)
0.044 (1,12)
0.244 (6,20)
0.228 (5,80)
0.020 (0,51)
0.014 (0,35)
1
4
8
5
0.150 (3,81)
0.157 (4,00)
0.008 (0,20) NOM
0
8
Gage Plane
A
0.004 (0,10)
0.010 (0,25)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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Post Office Box 655303 Dallas, Texas 75265
Copyright
2003, Texas Instruments Incorporated
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