ChipFind - документация

Электронный компонент: 8415601SA

Скачать:  PDF   ZIP
SN54LS540, SN54LS541, SN74LS540, SN74LS541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SDLS180 AUGUST 1979 REVISED MARCH 1988
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Copyright
1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54LS540, SN54LS541, SN74LS540, SN74LS541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SDLS180 AUGUST 1979 REVISED MARCH 1988
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
SN54LS540, SN54LS541, SN74LS540, SN74LS541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SDLS180 AUGUST 1979 REVISED MARCH 1988
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
SN54LS540, SN54LS541, SN74LS540, SN74LS541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SDLS180 AUGUST 1979 REVISED MARCH 1988
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
84155012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8415501RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415501RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415501SA
OBSOLETE
20
TBD
Call TI
Call TI
8415501SA
OBSOLETE
20
TBD
Call TI
Call TI
84156012A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
84156012A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
8415601SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
8415601SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32404B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32404B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32404BRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32404BRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405BRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405BRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405BSA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/32405BSA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS540J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS540J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS541J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS541J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN74LS540DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LS540DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS540N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS540N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SN74LS540N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SN74LS540NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS540NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS540NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS540NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS541N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS541N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SN74LS541N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SN74LS541NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS541NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS541NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS541NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS540FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 2
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SNJ54LS540FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS540J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS540J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS540W
OBSOLETE
20
TBD
Call TI
Call TI
SNJ54LS540W
OBSOLETE
20
TBD
Call TI
Call TI
SNJ54LS541FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
SNJ54LS541FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
SNJ54LS541J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS541J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS541W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS541W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 3
MECHANICAL DATA

MLCC006B OCTOBER 1996
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
4040140 / D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MIN
MAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)
(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
13
14
15
16
18
17
11
10
8
9
7
5
4
3
2
0.020 (0,51)
0.010 (0,25)
6
1
28
26
27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,90
7,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
20
16
6,50
6,50
14
0,05 MIN
5,90
5,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65
M
0,15
0
8
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2005, Texas Instruments Incorporated