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CC1070
SWRS043 Page 1 of 58
CC1070
Single Chip Low Power RF Transmitter for Narrowband Systems
Applications
Narrowband low power UHF wireless
data transmitters
402 / 424 / 426 / 429 / 433 / 447 / 449 /
469 / 868 and 915 MHz ISM/SRD
band systems
TPMS Tire Pressure Monitoring
Systems
AMR Automatic Meter Reading
Wireless alarm and security systems
Home automation
Low power telemetry
Product Description
CC1070 is a true single-chip UHF
transmitter designed for very low power
and very low voltage wireless applications.
The circuit is mainly intended for the ISM
(Industrial, Scientific and Medical) and
SRD (Short Range Device) frequency
bands at 402, 424, 426, 429, 433, 447,
449, 469, 868 and 915 MHz, but can
easily be programmed for multi-channel
operation at other frequencies in the 402 -
470 and 804 - 940 MHz range.
The
CC1070 is especially suited for narrow-
band systems with channel spacings of
12.5 or 25 kHz complying with ARIB STD
T-67 and EN 300 220.
The
CC1070 main operating parameters
can be programmed via a serial bus, thus
making
CC1070 a very flexible and easy to
use transmitter. In a typical application
CC1070 will be used together with a
microcontroller and a few external passive
components.
CC1070 is based on Chipcon's SmartRF
-
02 technology in 0.35
m CMOS.
Features
True single chip UHF RF transmitter
Frequency range 402 - 470 MHz and
804 - 940 MHz
Programmable output power
Low supply voltage (2.3 to 3.6 V)
Very few external components required
Small size (QFN 20 package)
Pb-free
package
Data rate up to 153.6 kBaud
OOK, FSK and GFSK data modulation
Fully on-chip VCO
Programmable frequency makes
crystal temperature drift compensation
possible without TCXO
Suitable for frequency hopping systems
Suited for systems targeting
compliance with EN 300 220, FCC
CFR47 part 15 and ARIB STD T-67
Development kit available
Easy-to-use software for generating the
CC1070 configuration data
CC1070
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Table of Contents
1
Abbreviations................................................................................................................ 4
2
Absolute Maximum Ratings ........................................................................................ 5
3
Operating Conditions ................................................................................................... 5
4
Electrical Specifications .............................................................................................. 5
4.1
RF Transmit Section ............................................................................................ 6
4.2
Crystal Oscillator Section..................................................................................... 8
4.3
Frequency Synthesizer Section........................................................................... 9
4.4
Digital Inputs / Outputs ...................................................................................... 10
4.5
Current Consumption......................................................................................... 11
5
Pin Assignment........................................................................................................... 12
6
Circuit Description...................................................................................................... 13
7
Application Circuit...................................................................................................... 13
8
Configuration Overview ............................................................................................. 16
8.1
Configuration Software ...................................................................................... 16
9
Microcontroller Interface ........................................................................................... 17
9.1
4-wire Serial Configuration Interface ................................................................. 18
9.2
Signal Interface .................................................................................................. 20
10
Data Rate Programming............................................................................................. 22
11
Frequency Programming ........................................................................................... 23
11.1
Dithering ......................................................................................................... 24
12
Transmitter .................................................................................................................. 24
12.1
FSK Modulation Formats ............................................................................... 24
12.2
OOK Modulation............................................................................................. 24
12.3
Output Power Programming........................................................................... 25
12.4
TX Data Latency............................................................................................. 26
12.5
Reducing Spurious Emission and Modulation Bandwidth ............................. 26
13
Output Matching and Filtering .................................................................................. 26
14
Frequency Synthesizer .............................................................................................. 29
14.1
VCO, Charge Pump and PLL Loop Filter....................................................... 29
14.2
VCO and PLL Self-Calibration ....................................................................... 30
14.3
PLL Turn-on Time versus Loop Filter Bandwidth .......................................... 31
14.4
PLL Lock Time versus Loop Filter Bandwidth ............................................... 32
15
VCO Current Control .................................................................................................. 32
16
Power Management.................................................................................................... 33
17
Crystal Oscillator ........................................................................................................ 34
18
Built-in Test Pattern Generator ................................................................................. 36
CC1070
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19
Interrupt upon PLL Lock............................................................................................ 36
20
PA_EN Digital Output Pin .......................................................................................... 36
20.1
Interfacing an External PA ............................................................................. 36
20.2
General Purpose Output Control Pins ........................................................... 36
20.3
PA_EN Pin Drive ............................................................................................ 37
21
System Considerations and Guidelines................................................................... 37
22
PCB Layout Recommendations ................................................................................ 39
23
Antenna Considerations ............................................................................................ 39
24
Configuration Registers............................................................................................. 40
24.1
CC1070 Register Overview............................................................................ 41
25
Package Description (QFN 20) .................................................................................. 52
25.1
Package Marking ........................................................................................... 53
25.2
Recommended PCB footprint for package (QFN 20) .................................... 54
25.3
Package Thermal Properties ......................................................................... 54
25.4
Soldering Information ..................................................................................... 54
25.5
Tray Specification........................................................................................... 55
25.6
Carrier Tape and Reel Specification .............................................................. 55
26
Ordering Information.................................................................................................. 55
27
General Information.................................................................................................... 56
28
Address Information................................................................................................... 58
CC1070
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1 Abbreviations
ACP
Adjacent
Channel
Power
AMR
Automatic
Meter
Reading
ASK
Amplitude
Shift
Keying
BOM
Bill
Of
Materials
bps
bits
per
second
BT
Bandwidth-Time product (for GFSK)
CW
Continuous
Wave
DNM
Do
Not
Mount
ESR
Equivalent
Series
Resistance
FHSS
Frequency Hopping Spread Spectrum
FM
Frequency
Modulation
FS
Frequency
Synthesizer
FSK
Frequency
Shift
Keying
GFSK
Gaussian Frequency Shift Keying
IC
Integrated
Circuit
ISM
Industrial
Scientific
Medical
kbps
kilo bits per second
MCU
Micro
Controller
Unit
NA
Not
Applicable
NRZ
Non Return to Zero
OOK
On-Off
Keying
PA
Power
Amplifier
PD
Phase Detector / Power Down
PCB
Printed
Circuit
Board
PN9
Pseudo-random Bit Sequence (9-bit)
PLL
Phase
Locked
Loop
PSEL
Program
Select
RF
Radio
Frequency
SPI
Serial
Peripheral
Interface
SRD
Short
Range
Device
TBD
To
Be
Decided/Defined
TX
Transmit
(mode)
UHF
Ultra
High
Frequency
VCO
Voltage
Controlled
Oscillator
XOSC
Crystal
oscillator
XTAL
Crystal
CC1070
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2 Absolute Maximum Ratings
The absolute maximum ratings given Table 1 should under no circumstances be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Parameter
Min
Max
Unit
Condition
Supply voltage, VDD
-0.3
5.0
V
All supply pins must have the
same voltage
Voltage on any pin
-0.3
VDD+0.3, max 5.0
V
Storage temperature range
-50
150
C
Package body temperature
260
C
Norm: IPC/JEDEC J-STD-020C
1
Humidity non-condensing
5
85
%
Table 1. Absolute maximum ratings
1
The reflow peak soldering temperature (body temperature) is specified according to
IPC/JEDEC J-STD-020C "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices".
Caution!
ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
3 Operating
Conditions
The operating conditions for
CC1070 are listed in Table 2.
Parameter
Min
Typ
Max
Unit
Condition / Note
RF Frequency Range
402
804
470
940
MHz
MHz
Programmable in <300 Hz steps
Programmable in <600 Hz steps
Operating ambient temperature range
-40 105
C
Supply voltage
2.3 3.0 3.6 V
The same supply voltage should
be used for digital (DVDD) and
analog (AVDD) power.
A 3.0 0.1 V supply is
recommended to meet the ARIB
STD T-67 output power tolerance
requirement.
Table 2. Operating conditions
4 Electrical
Specifications
Table 3 to Table 7 gives the
CC1070 electrical specifications.
All measurements were
performed using the 2 layer PCB CC1070EM reference design. This is the same test circuit
as shown in Figure 3. Temperature = 25
C, supply voltage = AVDD = DVDD = 3.0 V if
nothing else stated. Crystal frequency = 14.7456 MHz.
The electrical specifications given for 868 MHz are also applicable for the 902 928 MHz
frequency range.
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