1
Data sheet acquired from Harris Semiconductor
SCHS189C
Features
'HC540, CD74HCT540 . . . . . . . . . . . . . . . . . . . Inverting
'HC541, 'HCT541 . . . . . . . . . . . . . . . . . . . . . . Non-Inverting
Buffered Inputs
Three-State Outputs
Bus Line Driving Capability
Typical Propagation Delay = 9ns at V
CC
= 5V,
C
L
= 15pF, T
A
= 25
o
C
Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30% of V
CC
at V
CC
= 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
IL
= 0.8V (Max), V
IH
= 2V (Min)
- CMOS Input Compatibility, I
l
1
A at V
OL
, V
OH
Description
The 'HC540 and CD74HCT540 are Inverting Octal Buffers
and Line Drivers with Three-State Outputs and the capability
to drive 15 LSTTL loads. The 'HC541 and 'HCT541 are Non-
Inverting Octal Buffers and Line Drivers with Three-State Out-
puts that can drive 15 LSTTL loads. The Output Enables
(OE1) and (OE2) control the Three-State Outputs. If either
OE1 or OE2 is HIGH the outputs will be in the high imped-
ance state. For data output OE1 and OE2 both must be LOW.
Ordering Information
PART NUMBER
TEMP. RANGE
(
o
C)
PACKAGE
CD54HC540F3A
-55 to 125
20 Ld CERDIP
CD54HC541F3A
-55 to 125
20 Ld CERDIP
CD54HCT541F3A
-55 to 125
20 Ld CERDIP
CD74HC540E
-55 to 125
20 Ld PDIP
CD74HC540M
-55 to 125
20 Ld SOIC
CD74HC540M96
-55 to 125
20 Ld SOIC
CD74HC541E
-55 to 125
20 Ld PDIP
CD74HC541M
-55 to 125
20 Ld SOIC
CD74HC541M96
-55 to 125
20 Ld SOIC
CD74HC541PW
-55 to 125
20 Ld TSSOP
CD74HC541PWR
-55 to 125
20 Ld TSSOP
CD74HCT540E
-55 to 125
20 Ld PDIP
CD74HCT540M
-55 to 125
20 Ld SOIC
CD74HCT540M96
-55 to 125
20 Ld SOIC
CD74HCT541E
-55 to 125
20 Ld PDIP
CD74HCT541M
-55 to 125
20 Ld SOIC
CD74HCT541M96
-55 to 125
20 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel.
January 1998 - Revised July 2004
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
2004, Texas Instruments Incorporated
CD54/74HC540, CD74HCT540,
CD54/74HC541, CD54/74HCT541
High-Speed CMOS Logic
Octal Buffer and Line Drivers, Three-State
[ /Title
(CD74
HC540
,
CD74
HCT54
0,
CD74
HC541
,
CD74
HCT54
2
Functional Diagram
Pinouts
CD54HC540
(CERDIP)
CD74HC540, CD74HCT540
(PDIP, SOIC)
TOP VIEW
CD54HC541, CD54HCT541
(CERDIP)
CD74HC541
(PDIP, SOIC, TSSOP)
CD74HCT541
(PDIP, SOIC)
TOP VIEW
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE
A0
A1
A2
A3
A4
A6
A5
A7
GND
V
CC
Y0
Y1
Y2
OE2
Y3
Y4
Y5
Y6
Y7
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE1
A0
A1
A2
A3
A4
A6
A5
A7
GND
V
CC
Y0
Y1
Y2
OE2
Y3
Y4
Y5
Y6
Y7
D
0
Y
0
D
2
D
4
D
6
Y
2
Y
4
Y
6
D
1
D
3
D
5
D
7
Y
1
Y
3
Y
5
Y
7
OE
A
OE
B
540
541
Y
0
Y
2
Y
4
Y
6
Y
1
Y
3
Y
5
Y
7
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
3
TRUTH TABLE
INPUTS
OUTPUTS
OE1
OE2
An
540
541
L
L
H
L
H
H
X
X
Z
Z
X
H
X
Z
Z
L
L
L
H
L
H = HIGH Voltage Level
L = LOW Voltage Level
X= Don't Care
Z = High Impedance
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
4
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . .
20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
20mA
DC Drain Current, per Output, I
O
For -0.5V < V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . .
35mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
25mA
DC V
CC
or Ground Current, I
CC
. . . . . . . . . . . . . . . . . . . . . . . . .
50mA
Operating Conditions
Temperature Range, T
A
. . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
58
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
83
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
High Level Input
Voltage
V
IH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
Low Level Input
Voltage
V
IL
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-
-
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
or
GND
-
6
-
-
0.1
-
1
-
1
A
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
5
Quiescent Device
Current
I
CC
V
CC
or
GND
0
6
-
-
8
-
80
-
160
A
Three- State Leakage
Current
I
OZ
V
IL
or V
IH
V
O
=
V
CC
or
GND
6
-
-
0.5
-
5.0
-
10
A
HCT TYPES
High Level Input
Voltage
V
IH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
V
IL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
High Level Output
Voltage
TTL Loads
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
6
4.5
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
and
GND
0
5.5
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
5.5
-
-
8
-
80
-
160
A
Three- State Leakage
Current
I
OZ
V
IL
or V
IH
V
O
=
V
CC
or
GND
5.5
-
-
0.5
-
5.0
-
10
A
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
I
CC
(Note 2)
V
CC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
A
NOTE:
2. For dual-supply systems theoretical worst case (V
I
= 2.4V, V
CC
= 5.5V) specification is 1.8mA.
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HCT Input Loading Table
INPUT
UNIT LOADS
HCT540
HCT541
A0 - A7
1
0.4
OE2
0.75
0.75
OE1
1.15
1.15
NOTE: Unit Load is
I
CC
limit specific in DC Electrical Specifications
Table, e.g., 360
A max. at 25
o
C.
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
6
Switching Specifications
C
L
= 50pF, Input t
r
, t
f
= 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO
85
o
C
-55
o
C TO
125
o
C
UNITS
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
Propagation Delay
t
PLH
, t
PHL
C
L
= 50pF
Data to Outputs (540)
2
-
-
110
-
140
-
165
ns
4.5
-
-
22
-
28
-
33
ns
C
L
= 15pF
5
-
9
-
-
-
-
-
ns
C
L
= 50pF
6
-
-
19
-
24
-
28
ns
Data to Outputs (541)
t
PLZ
, t
PHZ
C
L
= 50pF
2
-
-
115
-
145
-
175
ns
4.5
-
-
23
-
29
-
35
ns
C
L
= 15pF
5
-
9
-
-
-
-
-
ns
C
L
= 50pF
6
-
-
20
-
25
-
30
ns
Output Enable and Disable
to Outputs (540)
t
PLZ
, t
PHZ
C
L
= 50pF
2
-
-
160
-
200
-
240
ns
4.5
-
-
32
-
40
-
48
ns
C
L
= 15pF
5
-
13
-
-
-
-
-
ns
C
L
= 50pF
6
-
-
27
-
34
-
41
ns
Output Enable and Disable
to Outputs (541)
t
PLZ
, t
PHZ
C
L
= 50pF
2
-
-
160
-
200
-
240
ns
4.5
-
-
32
-
40
-
48
ns
C
L
= 15pF
5
-
14
-
-
-
-
-
ns
C
L
= 50pF
6
-
-
23
-
29
-
35
ns
Output Transition Time
t
THL
, t
TLH
C
L
= 50pF
2
-
-
60
-
75
-
90
ns
4.5
-
-
12
-
15
-
18
ns
6
-
-
10
-
13
-
15
ns
Input Capacitance
C
I
C
L
= 50pF
-
10
-
10
-
10
-
10
pF
Three-State Output
Capacitance
C
O
-
-
20
-
20
-
20
-
20
pF
Power Dissipation Capacitance
(Notes 3, 4) (540)
C
PD
C
L
= 15pF
5
-
50
-
-
-
-
-
pF
Power Dissipation Capacitance
(Notes 3, 4) (541)
C
PD
C
L
= 15pF
5
-
48
-
-
-
-
-
pF
HCT TYPES
Propagation Delay
t
PHL,
t
PLH
Data to Outputs (540)
C
L
= 50pF
4.5
-
-
24
-
30
-
36
ns
C
L
= 15pF
5
-
9
-
-
-
-
-
ns
Data to Outputs (541)
t
PHL,
t
PLH
C
L
= 50pF
4.5
-
-
28
-
35
-
42
ns
C
L
= 15pF
5
-
11
-
-
-
-
-
ns
Output Enable and Disable
to Outputs (540, 541)
t
PLZ
, t
PHZ
C
L
= 50pF
4.5
-
-
35
-
44
-
53
ns
C
L
= 15pF
5
-
14
-
-
-
-
-
ns
Output Transition Time
t
TLH
, t
THL
C
L
= 50pF
4.5
-
-
12
-
15
-
18
ns
Input Capacitance
C
I
C
L
= 50pF
-
10
-
10
-
10
-
10
pF
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
7
Three-State Output
Capacitance
C
O
-
-
20
-
20
-
20
-
20
pF
Power Dissipation Capacitance
(Notes 3, 4) (540, 541)
C
PD
C
L
= 15pF
5
-
55
-
-
-
-
-
pF
NOTES:
3. C
PD
is used to determine the dynamic power consumption, per channel.
4. P
D
= V
CC
2
f
i
(C
PD
+ C
L
) where f
i
= Input Frequency, C
L
= Output Load Capacitance, V
CC
= Supply Voltage.
Switching Specifications
C
L
= 50pF, Input t
r
, t
f
= 6ns (Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO
85
o
C
-55
o
C TO
125
o
C
UNITS
MIN
TYP
MAX
MIN
MAX
MIN
MAX
Test Circuits and Waveforms
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 3. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
FIGURE 4. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
t
PHL
t
PLH
t
THL
t
TLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
V
CC
t
r
= 6ns
t
f
= 6ns
90%
t
PHL
t
PLH
t
THL
t
TLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
t
r
= 6ns
t
f
= 6ns
90%
50%
10%
90%
GND
V
CC
10%
90%
50%
50%
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED
OUTPUTS
DISABLED
OUTPUTS
ENABLED
6ns
6ns
t
PZH
t
PHZ
t
PZL
t
PLZ
0.3
2.7
GND
3V
10%
90%
1.3V
1.3V
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED
OUTPUTS
DISABLED
OUTPUTS
ENABLED
t
r
6ns
t
PZH
t
PHZ
t
PZL
t
PLZ
6ns
t
f
1.3
CD54/74HC540, CD74HCT540, CD54/74HC541, CD54/74HCT541
8
NOTE:
Open drain waveforms t
PLZ
and t
PZL
are the same as those for three-state shown on the left. The test circuit is Output R
L
= 1k
to
V
CC
, C
L
= 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
Test Circuits and Waveforms
(Continued)
IC WITH
THREE-
STATE
OUTPUT
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
V
CC
FOR t
PLZ
AND t
PZL
GND FOR t
PHZ
AND t
PZH
OUTPUT
R
L
= 1k
C
L
50pF
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD54HC540F3A
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
CD54HC541F
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
CD54HC541F3A
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
CD54HCT541F
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
CD54HCT541F3A
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
CD74HC540E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC540M
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC540M96
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC541E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC541M
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC541M96
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HC541PW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC541PWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD74HC541SM
OBSOLETE
SSOP
DB
20
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT540E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HCT540M
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT540M96
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT541E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HCT541M
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT541M96
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
Addendum-Page 1
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
Addendum-Page 2
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,90
7,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
20
16
6,50
6,50
14
0,05 MIN
5,90
5,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65
M
0,15
0
8
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20
16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2005, Texas Instruments Incorporated
PDF 
ZIP