SN54HC365, SN74HC365
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
SCLS308D - JANUARY 1996 - REVISED OCTOBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
Wide Operating Voltage Range of 2 V to 6 V
D
High-Current 3-State Outputs Drive Bus
Lines, Buffer-Memory Address Registers,
or Drive Up To 15 LSTTL Loads
D
True Outputs
D
Low Power Consumption, 80-
A Max I
CC
D
Typical t
pd
= 10 ns
D
6-mA Output Drive at 5 V
D
Low Input Current of 1
A Max
description/ordering information
These hex buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. The 'HC365 devices contain six
independent buffers/drivers with dual-gated
output-enable (OE1 and OE2) inputs. When OE1
and OE2 are both low, the devices pass
noninverted data from the A inputs to the
Y
outputs. If either (or both) output-enable
terminal(s) is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP - N
Tube of 25
SN74HC365N
SN74HC365N
Tube of 40
SN74HC365D
SOIC - D
Reel of 2500
SN74HC365DR
HC365
-40
C to 85
C
SOIC - D
Reel of 250
SN74HC365DT
HC365
-40
C to 85
C
SOP - NS
Reel of 2000
SN74HC365NSR
HC365
Reel of 90
SN74HC365PW
TSSOP - PW
Reel of 2000
SN74HC365PWR
HC365
TSSOP - PW
Reel of 250
SN74HC365PWT
HC365
CDIP - J
Tube of 25
SNJ54HC365J
SNJ54HC365J
-55
C to 125
C
CFP - W
Tube of 150
SNJ54HC365W
SNJ54HC365W
-55 C to 125 C
LCCC - FK
Tube of 55
SNJ54HC365FK
SNJ54HC365FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
3
2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
A6
Y6
NC
A5
Y5
Y1
A2
NC
Y2
A3
A1
OE1
NC
Y4
A4
V
OE2
Y3
GND
NC
SN54HC365 . . . FK PACKAGE
(TOP VIEW)
CC
NC - No internal connection
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OE1
A1
Y1
A2
Y2
A3
Y3
GND
V
CC
OE2
A6
Y6
A5
Y5
A4
Y4
SN54HC365 . . . J OR W PACKAGE
SN74HC365 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
Copyright
2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL PRF 38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC365, SN74HC365
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
SCLS308D - JANUARY 1996 - REVISED OCTOBER 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
OE1
OE2
A
OUTPUT
Y
H
X
X
Z
X
H
X
Z
L
L
H
H
L
L
L
L
logic diagram (positive logic)
OE1
OE2
To Five Other Channels
A1
Y1
1
15
2
3
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
-0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 1)
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 1)
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
(V
O
= 0 to V
CC
)
35 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
CC
or GND
70 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 2): D package
73
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
67
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package
64
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
108
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
-65
C to 150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC365, SN74HC365
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
SCLS308D - JANUARY 1996 - REVISED OCTOBER 2003
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC365
SN74HC365
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
2
5
6
V
VCC = 2 V
1.5
1.5
VIH
High-level input voltage
VCC = 4.5 V
3.15
3.15
V
VIH
High-level input voltage
VCC = 6 V
4.2
4.2
V
VCC = 2 V
0.5
0.5
VIL
Low-level input voltage
VCC = 4.5 V
1.35
1.35
V
VIL
Low-level input voltage
VCC = 6 V
1.8
1.8
V
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
VCC = 2 V
1000
1000
t/
v
Input transition rise/fall time
VCC = 4.5 V
500
500
ns
t/
v
Input transition rise/fall time
VCC = 6 V
400
400
ns
TA
Operating free-air temperature
-55
125
-40
85
C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25
C
SN54HC365
SN74HC365
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
2 V
1.9
1.998
1.9
1.9
IOH = -20
A
4.5 V
4.4
4.499
4.4
4.4
VOH
VI = VIH or VIL
IOH = -20
A
6 V
5.9
5.999
5.9
5.9
V
VOH
VI = VIH or VIL
IOH = -6 mA
4.5 V
3.98
4.3
3.7
3.84
V
IOH = -7.8 mA
6 V
5.48
5.8
5.2
5.34
2 V
0.002
0.1
0.1
0.1
IOL = 20
A
4.5 V
0.001
0.1
0.1
0.1
VOL
VI = VIH or VIL
IOL = 20
A
6 V
0.001
0.1
0.1
0.1
V
VOL
VI = VIH or VIL
IOL = 6 mA
4.5 V
0.17
0.26
0.4
0.33
V
IOL = 7.8 mA
6 V
0.15
0.26
0.4
0.33
II
VI = VCC or 0
6 V
0.1
100
1000
1000
nA
IOZ
VO = VCC or 0
6 V
0.01
0.5
10
5
A
ICC
VI = VCC or 0,
IO = 0
6 V
8
160
80
A
Ci
2 V to 6 V
3
10
10
10
pF
SN54HC365, SN74HC365
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
SCLS308D - JANUARY 1996 - REVISED OCTOBER 2003
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, C
L
= 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25
C
SN54HC365
SN74HC365
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
2 V
50
95
145
120
tpd
A
Y
4.5 V
12
19
29
24
ns
tpd
A
Y
6 V
10
16
25
20
ns
2 V
100
190
285
238
ten
OE
Y
4.5 V
26
38
57
48
ns
ten
OE
Y
6 V
21
32
48
41
ns
2 V
50
175
265
240
tdis
OE
Y
4.5 V
21
35
53
48
ns
tdis
OE
Y
6 V
19
30
45
41
ns
2 V
28
60
90
75
tt
Any
4.5 V
8
12
18
15
ns
tt
Any
6 V
6
10
15
13
ns
switching characteristics over recommended operating free-air temperature range, C
L
= 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25
C
SN54HC365
SN74HC365
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
2 V
70
120
180
150
tpd
A
Y
4.5 V
17
24
36
30
ns
tpd
A
Y
6 V
14
20
31
25
ns
2 V
140
230
345
285
ten
OE
Y
4.5 V
30
46
69
57
ns
ten
OE
Y
6 V
28
39
59
48
ns
2 V
45
210
315
265
tt
Any
4.5 V
17
42
63
53
ns
tt
Any
6 V
13
36
53
45
ns
operating characteristics, T
A
= 25
C
PARAMETER
TEST CONDITIONS
TYP
UNIT
Cpd
Power dissipation capacitance per buffer/driver
No load
35
pF
SN54HC365, SN74HC365
HEX BUFFERS AND LINE DRIVERS
WITH 3 STATE OUTPUTS
SCLS308D - JANUARY 1996 - REVISED OCTOBER 2003
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%
50%
10%
10%
90%
90%
VCC
0 V
tr
tf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%
50%
10%
10%
90%
90%
VCC
VOH
VOL
0 V
tr
tf
Input
In-Phase
Output
50%
tPLH
tPHL
50%
50%
10%
10%
90%
90%
VOH
VOL
tr
tf
tPHL
tPLH
Out-of-Phase
Output
50%
10%
90%
VCC
VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
Waveform 1
(See Note B)
50%
tPZL
tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
0 V
50%
50%
tPZH
tPHZ
Output
Waveform 2
(See Note B)
VCC
Test
Point
From Output
Under Test
CL
(see Note A)
RL
VCC
S1
S2
LOAD CIRCUIT
PARAMETER
CL
tPZH
tpd or tt
tdis
ten
tPZL
tPHZ
tPLZ
1 k
1 k
50 pF
or
150 pF
50 pF
Open
Closed
RL
S1
Closed
Open
S2
Open
Closed
Closed
Open
50 pF
or
150 pF
Open
Open
--
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR
1 MHz, ZO = 50
, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
85001012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8500101EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/65706BEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54HC365J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN74HC365D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365DT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74HC365NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC365PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HC365FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54HC365J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B OCTOBER 1996
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
4040140 / D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MIN
MAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)
(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
13
14
15
16
18
17
11
10
8
9
7
5
4
3
2
0.020 (0,51)
0.010 (0,25)
6
1
28
26
27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20
16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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Copyright
2005, Texas Instruments Incorporated
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