D-8
DGN-8
D-16
www.ti.com
FEATURES
APPLICATIONS
TPS2062/TPS2066
D AND DGN PACKAGE
(TOP VIEW)
All Enable Inputs Are Active High For TPS2065, TPS2066, and TPS2067
1
GND
TPS2063/TPS2067
D PACKAGE
(TOP VIEW)
TPS2061/TPS2065
D AND DGN PACKAGE
(TOP VIEW)
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IN1
EN1
EN2
GND
IN2
EN3
NC
OC1
OUT1
OUT2
OUT3
NC
NC
GND
IN
IN
EN
OUT
OUT
OUT
GND
IN
EN2
OC1
OUT1
OUT2
EN1
OC2
OC3
OC2
OC
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
DESCRIPTION
TPS201xA
TPS202x
TPS203x
33 m
, single
0.2 A - 2 A
0.2 A - 2 A
0.2 A - 2 A
TPS2014
TPS2015
TPS2041B
TPS2051B
TPS2045
TPS2055
TPS2061
TPS2065
80 m
, single
600 mA
1 A
500 mA
500 mA
250 mA
250 mA
1 A
1 A
GENERAL SWITCH CATALOG
TPS2042B
TPS2052B
TPS2046
TPS2056
TPS2062
TPS2066
80 m
, dual
500 mA
500 mA
250 mA
250 mA
1 A
1 A
TPS2100/1
260 m
IN1 500 mA
IN2 10 mA
OUT
IN1
IN2
TPS2102/3/4/5
IN1 500 mA
IN2 100 mA
1.3
TPS2043
TPS2053B
TPS2047
TPS2057
TPS2063
TPS2067
80 m
, triple
500 mA
500 mA
250 mA
250 mA
1 A
1 A
TPS2044B
TPS2054B
TPS2048
TPS2058
80 m
, quad
500 mA
500 mA
250 mA
250 mA
80 m
, dual
TPS2080
TPS2081
TPS2082
TPS2090
500 mA
500 mA
500 mA
250 mA
TPS2091
TPS2092
250 mA
250 mA
80 m
, quad
TPS2085
TPS2086
TPS2087
TPS2095
500 mA
500 mA
500 mA
250 mA
TPS2096
TPS2097
250 mA
250 mA
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490B DECEMBER 2003 REVISED DECEMBER 2004
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
Heavy Capacitive Loads
70-m
High-Side MOSFET
Short-Circuit Protections
1-A Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit (1.1 A min, 2.1 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
No OC Glitch During Power Up
1-A Maximum Standby Supply Current
Bidirectional Switch
Ambient Temperature Range: -40
C to 85
C
ESD Protection
UL Listed - File No. E169910
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-m
N-channel MOSFET power switches
for power-distribution systems that require multiple power switches in a single package. Each switch is controlled
by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch
rise times and fall times to minimize current surges during switching. The charge pump requires no external
components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1.5 A
typically.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright 20032004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
www.ti.com
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490B DECEMBER 2003 REVISED DECEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED
TYPICAL
PACKAGED
MAXIMUM
SHORT-CIRCUIT
NUMBER OF
DEVICES
(1)
T
A
ENABLE
CONTINUOUS
CURRENT LIMIT
SWITCHES
MSOP (DGN)
SOIC(D)
LOAD CURRENT
AT 25
C
Active low
TPS2061DGN
TPS2061D
Single
Active high
TPS2065DGN
TPS2065D
Active low
TPS2062DGN
TPS2062D
-40
C to 85
C
1 A
1.5 A
Dual
Active high
TPS2066DGN
TPS2066D
Active low
-
TPS2063D
Triple
Active high
-
TPS2067D
(1)
The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2062DR).
LEAD (PB-FREE) ORDERING INFORMATION
T
A
SOIC(D)
STATUS
(1)
ECO-STATUS
(2)
MSOP (DGN)
STATUS
(1)
ECO-STATUS
(2)
TPS2061DG4
Active
TPS2061DGNG4
Active
TPS2062DG4
Active
TPS2062DGNG4
Active
-40
C to 85
C
Green
Green
TPS2065DG4
Active
TPS2065DGNG4
Active
TPS2066DG4
Active
TPS2066DGNG4
Active
(1)
The marketing status values are defined as follows:
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued production of the device.
(2)
Eco-Status information - Additional details including specific material content can be accessed at www.ti.com/leadfree
N/A: Not yet available Lead (Pb)-Free, for estimated conversion dates go to www.ti.com/leadfree.
Pb-Free: TI defines "Lead (Pb)-Free" or "Pb-Free" to mean RoHS compatible, including a lead concentration that does not exceed
0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
Green: TI defines "Green" to mean Lead (Pb)-Free and in addition, uses package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight.
2
www.ti.com
ABSOLUTE MAXIMUM RATINGS
DISSIPATING RATING TABLE
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490B DECEMBER 2003 REVISED DECEMBER 2004
over operating free-air temperature range unless otherwise noted
(1)
UNIT
Input voltage range, V
I(IN)
(2)
-0.3 V to 6 V
Output voltage range, V
O(OUT)
(2)
, V
O(OUTx)
-0.3 V to 6 V
Input voltage range, V
I(/EN)
, V
I(EN)
, V
I(/ENx)
, V
I(ENx)
-0.3 V to 6 V
Voltage range, V
I(/OC)
, V
I(/OCx)
-0.3 V to 6 V
Continuous output current, I
O(OUT)
, I
O(OUTx)
Internally limited
Continuous total power dissipation
See Dissipation Rating Table
Operating virtual junction temperature range, T
J
-40
C to 125
C
Storage temperature range, T
stg
-65
C to 150
C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds
260
C
Human body model MIL-STD-883C
2 kV
Electrostatic discharge (ESD) protection
Charge device model (CDM)
500 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to GND.
T
A
25
C
DERATING FACTOR
T
A
= 70
C
T
A
= 85
C
PACKAGE
POWER RATING
ABOVE T
A
= 25
C
POWER RATING
POWER RATING
D-8
585.82 mW
5.8582 mW/
C
322.20 mW
234.32 mW
DGN-8
1712.3 mW
17.123 mW/
C
941.78 mW
684.33 mW
D-16
898.47 mW
8.9847 mW/
C
494.15 mW
359.38 mW
MIN
MAX
UNIT
Input voltage, V
I(IN)
2.7
5.5
V
Input voltage, V
I(/EN)
, V
I(EN)
, V
I(/ENx)
, V
I(ENx)
0
5.5
V
Continuous output current, I
O(OUT)
, I
O(OUTx)
0
1
A
Operating virtual junction temperature, T
J
-40
125
C
over recommended operating junction temperature range, V
I(IN)
= 5.5 V, I
O
= 1 A, V
I(/ENx)
= 0 V, or V
I(ENx)
= 5.5 V (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
POWER SWITCH
Static drain-source on-state
resistance, 5-V operation and
V
I(IN)
= 5 V or 3.3 V,
I
O
= 1 A
-40
C
T
J
125
C
70
135
m
3.3-V operation
r
DS(on)
Static drain-source on-state
resistance, 2.7-V
V
I(IN)
= 2.7 V,
I
O
= 1 A
-40
C
T
J
125
C
75
150
m
operation
(2)
V
I(IN)
= 5.5 V
0.6
1.5
t
r
(2)
Rise time, output
V
I(IN)
= 2.7 V
0.4
1
C
L
= 1 F,
T
J
= 25
C
ms
R
L
= 5
V
I(IN)
= 5.5 V
0.05
0.5
t
f
(2)
Fall time, output
V
I(IN)
= 2.7 V
0.05
0.5
ENABLE INPUT EN OR EN
(1)
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
(2)
Not tested in production, specified by design.
3
www.ti.com
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490B DECEMBER 2003 REVISED DECEMBER 2004
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating junction temperature range, V
I(IN)
= 5.5 V, I
O
= 1 A, V
I(/ENx)
= 0 V, or V
I(ENx)
= 5.5 V (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
V
IH
High-level input voltage
2.7 V
V
I(IN)
5.5 V
2
V
V
IL
Low-level input voltage
2.7 V
V
I(IN)
5.5 V
0.8
I
I
Input current
V
I(/ENx)
= 0 V or 5.5 V, V
I(ENx)
= 0 V or 5.5 V
-0.5
0.5
A
t
on
(3)
Turnon time
C
L
= 100 F, R
L
= 5
3
ms
t
off
(3)
Turnoff time
C
L
= 100 F, R
L
= 5
10
CURRENT LIMIT
I
OS
Short-circuit output current
V
I(IN)
= 5 V, OUT connected to GND, device enabled into short-circuit
1.1
1.5
2.1
A
I
OC_TRIP
(3)
Over-current trip threshold
V
I(IN)
= 5 V, current ramp (
100 A/s) on OUT
2.4
3
A
SUPPLY CURRENT (TPS2061, TPS2065)
T
J
= 25
C
0.5
1
No load on OUT, V
I(/ENx)
= 5.5 V,
Supply current, low-level output
A
or V
I(ENx)
= 0 V
-40
C
T
J
125
C
0.5
5
T
J
= 25
C
43
60
No load on OUT, V
I(/ENx)
= 0 V,
Supply current, high-level output
A
or V
I(ENx)
= 5.5 V
-40
C
T
J
125
C
43
70
OUT connected to ground, V
I(/EN)
= 5.5 V,
Leakage current
-40
C
T
J
125
C
1
A
or V
I(EN)
= 0 V
Reverse leakage current
V
I(OUTx)
= 5.5 V, IN = ground
(3)
T
J
= 25
C
0
A
SUPPLY CURRENT (TPS2062, TPS2066)
T
J
= 25
C
0.5
1
No load on OUT, V
I(/ENx)
= 5.5 V,
Supply current, low-level output
A
or V
I(ENx)
= 0 V
-40
C
T
J
125
C
0.5
5
T
J
= 25
C
50
70
No load on OUT, V
I(/ENx)
= 0 V,
Supply current, high-level output
A
or V
I(ENx)
= 5.5 V
-40
C
T
J
125
C
50
90
OUT connected to ground, V
I(/ENx)
= 5.5 V,
Leakage current
-40
C
T
J
125
C
1
A
or V
I(ENx)
= 0 V
Reverse leakage current
V
I(OUTx)
= 5.5 V, IN = ground
(3)
T
J
= 25
C
0.2
A
SUPPLY CURRENT (TPS2063, TPS2067)
T
J
= 25
C
0.5
2
Supply current, low-level output
No load on OUT, V
I(/ENx)
= 0 V
A
-40
C
T
J
125
C
0.5
10
T
J
= 25
C
65
90
Supply current, high-level output
No load on OUT, V
I(/ENx)
= 5.5 V
A
-40
C
T
J
125
C
65
110
OUT connected to ground, V
I(/ENx)
= 5.5 V,
Leakage current
-40
C
T
J
125
C
1
A
or V
I(ENx)
= 0 V
Reverse leakage current
V
I(OUTx)
= 5.5 V, INx = ground
(3)
T
J
= 25
C
0.2
A
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN
2
2.5
V
Hysteresis, IN
T
J
= 25
C
75
mV
OVERCURRENT OC1 and OC2
Output low voltage, V
OL(OCx)
I
O(/OCx)
= 5 mA
0.4
V
Off-state current
(3)
V
O(/OCx)
= 5 V or 3.3 V
1
A
OC deglitch
(3)
OCx assertion or deassertion
4
8
15
ms
THERMAL SHUTDOWN
(4)
Thermal shutdown threshold
(3)
135
C
Recovery from thermal shutdown
(3)
125
C
Hysteresis
(3)
10
C
(3)
Not tested in production, specified by design.
(4)
The thermal shutdown only reacts under overcurrent conditions.
4
www.ti.com
DEVICE INFORMATION
OUT
OC
IN
EN
GND
Current
Limit
Driver
UVLO
Charge
Pump
CS
Thermal
Sense
Deglitch
Note A: Current sense
Note B: Active low (EN) for TPS2061. Active high (EN) for TPS2065.
(See Note A)
(See Note B)
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490B DECEMBER 2003 REVISED DECEMBER 2004
Terminal Functions (TPS2061 and TPS2065)
TERMINAL
I/O
DESCRIPTION
NAME
TPS2061
TPS2065
EN
4
-
I
Enable input, logic low turns on power switch
EN
-
4
I
Enable input, logic high turns on power switch
GND
1
1
Ground
IN
2, 3
2,3
I
Input voltage
OC
5
5
O
Overcurrent, open-drain output, active-low
OUT
6, 7, 8
6, 7, 8
O
Power-switch output
Functional Block Diagram
5
PDF 
ZIP