UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
15 V PROGRAMMABLE
HOT SWAP POWER MANAGER
1
www.ti.com
FEATURES
D
Integrated 0.15-
Power MOSFET
D
7-V to 15-V Operation
D
Digital Programmable Current Limit
from 0 A to 3 A
D
Programmable On-Time
D
Programmable Start Delay
D
Fixed 2% Duty Cycle
D
Thermal Shutdown
D
Fault Output Indicator
D
Power SOIC and TSSOP, Low Thermal-
Resistance Packaging
DESCRIPTION
The UCC39151 programmable hot swap power
manager provides complete power management,
hot swap capability, and circuit breaker functions.
The only external component required to operate
the device, other than power supply bypassing, is
the fault timing capacitor, C
T
. All control and
housekeeping functions are integrated, and
externally programmable. These include the fault
current level, maximum output sourcing current,
maximum fault time, and start-up delay. In the
event of a constant fault, the internal fixed 2% duty
cycle ratio limits average output power.
The internal 4-bit DAC allows programming of the
fault level current from 0 A to 3 A with 0.25 A
resolution. The IMAX control pin sets the
maximum sourcing current to 1 A above the trip
level or to a full 4 A of output current for fast output
capacitor charging.
TYPICAL APPLICATION
SHTDWN
14
15
10
1
2
16
11
VOUT
CT
VIN
FAULT
B0
GND
RL
CIN
5
13
12
4
GND
GND
GND
COUT
CSD
RSD
VIN
S6
6
7
8
9
VIN
S4
S3
S2
S5
B1
B2
B3
IMAX
S1
CT
3
VIN
VIN
HEATSINK GROUND PINS
DIP SWITCH
}
D1
VOUT
+5V
LED
R1
UDG98176
UCC39151 (16-Pin Package)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2001, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
2
www.ti.com
description (continued)
When the output current is below the fault level, the output MOSFET is switched on with a nominal on-resistance
of 0.15
. When the output current exceeds the fault level, but is less than the maximum sourcing level, the
output remains switched on but the fault timer starts, charging C
T
. Once C
T
charges to a preset threshold, the
switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches
the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.
absolute maximum ratings
Input voltage, VIN
15.5 V
. . . . . . . . . . . . . . . . . . . .
(VOUT VIN)
0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . .
FAULT sink current
50 mA
. . . . . . . . . . . . . . . . . . .
FAULT voltage
0.3 to 8 V
. . . . . . . . . . . . . . . . . . .
Output current, VOUT
Self limiting
. . . . . . . . . . . .
TTL input voltage
0.3 to V
IN
. . . . . . . . . . . . . . . .
Storage temperature
65
C to 150
C
. . . . . . . . .
Junction temperature
55
C to 150
C
. . . . . . . .
Lead temperature (soldering 10 seconds) 300
C
Stresses beyond those listed under "absolute maximum ratings"
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any
other conditions beyond those indicated under "recommended
operating conditions" is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may
affect device reliability. Currents are positive into, negative out of the
specified terminal.
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SHTDWN
VIN
VIN
NC
GND*
GND*
GND*
GND*
EGND*
B3
B2
B1
FAULT
VOUT
VOUT
NC
GND*
GND*
GND*
GND*
NC
CT
IMAX
B0
PWP PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SHTDWN
VIN
VIN
GND*
EGND*
B3
B2
B1
FAULT
VOUT
VOUT
GND*
GND*
CT
IMAX
B0
DIL (N) or SOIC (DP)
PACKAGE
(TOP VIEW)
NC = no connection
* Pin 5 on the N and DP packages (and pin 9 on the PWP package)
serves as the lowest impedance to the electrical ground. Pins 4, 12
and 13 on the DP package (and pins 5, 6, 7, 8, 17, 18, 19, and 20 on
the PWP package) serve as heatsink/ground. These pins should be
connected to large etch areas to help dissipate heat. On the N
package, pins 4, 12 and 13 are not connected.
AVAILABLE OPTIONS
TA
PACKAGES
TA
SOIC (DP)
{
DIL (N)
TSSOP (PWP)
{
0
C to 70
C
UCC39151DP
UCC39151N
UCC39151PWP
The DP and PWP packages are available taped and reeled. Add TR suffix to
device type (e.g. UCC39151DPTR) to order quantities of 2500 (DP) or 2000
(PWP) devices per reel.
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
3
www.ti.com
electrical characteristics over recommended operating virtual junction temperature range,
T
A
= 0
C to 70
C, VIN
= 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, T
A
= T
J
(unless otherwise noted)
supply
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input voltage range
7.0
15.0
V
Supply current
1.0
2.0
mA
Sleep mode current
SHTDWN = 0.2 V, No load
100
150
A
Output leakage
SHTDWN = 0.2 V
20
mA
output
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
IOUT = 1 A,
10 V
VIN
12 V
0.15
0.3
IOUT = 2 A,
10 V
VIN
12 V
0.3
0.6
Voltage drop
IOUT = 3 A,
10 V
VIN
12 V
0.45
0.9
V
Voltage drop
IOUT = 1 A,
7 V
VIN
15 V
0.2
0.4
V
IOUT = 2 A,,
7 V
VIN
15 V
0.4
0.8
IOUT = 3 A, ,
7 V
VIN
12 V(max)
0.6
1.2
Initial startup time
See Note 1
100
s
Short circuit response time
See Note 1
100
ns
Thermal shutdown temperature
See Note 1
165
C
Thermal hysteresis
See Note 1
10
C
DAC
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Code = 0000 to 0011,
(device off)
Code = 0100
0.07
0.25
0.45
Code = 0101
0.32
0.50
0.7
Code = 0110
0.50
0.75
0.98
Code = 0111
0.75
1.00
1.3
Code = 1000
1.0
1.25
1.6
Trip current
Code = 1001
1.25
1.50
1.85
Tri current
Code = 1010
1.5
1.75
2.15
A
Code = 1011
1.70
2.00
2.4
A
Code = 1100
1.90
2.25
2.7
Code = 1101
2.1
2.50
2.95
Code = 1110
2.30
2.75
3.25
Code = 1111
2.50
3.0
3.5
Maximum output current over trip level
(current source mode)
Code = 0100 to 1111,
IMAX = 0 V
0.35
1.0
1.65
Maximum output current (current source mode)
Code = 0100 to 1111,
IMAX = 2.4 V
3.0
4.0
5.2
open drain output (FAULT)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
High-level output current
FAULT = 5 V
250
A
Low-level output voltage
IOUT = 5 mA
0.2
0.8
V
NOTE 1: Ensured by design. Not production tested.
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
4
www.ti.com
electrical characteristics over recommended operating virtual junction temperature range,
T
A
= 0
C to 70
C, V
IN
= 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, T
A
= T
J
(unless otherwise noted)
fault timer
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CT charge current
VCT = 1.0 V
83
62
47
A
CT discharge current
VCT = 1.0 V
0.8
1.2
1.8
A
Output duty cycle
VOUT = 0 V
1.0%
1.9%
3.3%
CT fault threshold voltage
1.2
1.5
1.7
V
CT reset threshold voltage
0.4
0.5
0.6
V
SHTDWN
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Shutdown threshold voltage
1.1
1.5
1.9
V
Shutdown hysteresis
150
mV
Input current
100
500
nA
TTL input dc characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TTL high-level input voltage
2.0
V
TTL low-level input voltage
0.8
V
TTL high-level input current
VIH = 2.4 V
3
10
A
TTL low-level input current
VIL = 0.4 V
1
A
block diagram (16pin package)
UDG01044
Pin numbers refer to N and DP packages.
10
IMAX
4 A
H = 4 A
4
0A
TO 3 A
0.25
RES
6
7
8
9
+
1 A ABOVE
FAULT
MAXIMUM
CURRENT
LEVEL
+
CURRENT FAULT LEVEL
0A TO 3 A
OVERCURRENT
COMPARATOR
ONTIME
CONTROL
2% DUTY
CYCLE
13
12
B3
B2
B1
B0
EGND
4BIT DAC
11
CHARGE PUMP
REVERSE
VOLTAGE
COMPARATOR
+
+
LINEAR CURRENT
AMPLIFIER
VOUT
30 mV
THERMAL
SHUTDOWN
INTERNAL
BIAS
16
CT
FAULT
+
1
SHTDWN
1.5 V
5
2
3
14
15
POWER
FET
VIN
VIN
VOUT
VOUT
CURRENT
SENSE
HEATSINK/GROUND
GND GND GND
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
5
www.ti.com
Terminal Functions
TERMINAL
NAME
PACKAGE
I/O
DESCRIPTION
DP
N
PWP
I/O
DESCRIPTION
B0
9
9
13
I
B1
8
8
12
I
Provides digital input to the DAC, which sets the fault current threshold. These
B2
7
7
11
I
Provides digital in ut to the DAC, which sets the fault current threshold. These
can be used to provide a digital soft-start and adaptive current limiting.
B3
6
6
10
I
g
g
CT
11
11
15
I/O
Capacitor connects to ground and sets the maximum fault time.
EGND
5
5
9
Serves as lowest impedance to the electrical ground.
FAULT
16
16
24
O
Open-drain output, which pulls low upon any fault or interrupt condition, or
thermal shutdown.
GND
4, 12, 13
5, 6, 7, 8,
17, 18, 19,
20
Heat sink/ground pins. These pins should be connected to large etch areas to
help dissipate heat.
IMAX
10
10
14
I
When this pin is set low, the maximum sourcing current is 1 A above the
programmed fault level. When set high, the maximum sourcing current is a
constant 4 A for applications which require fast charging of load capacitance.
SHTDWN
1
1
1
I
When this pin is brought low, the device is put into a sleep mode drawing
typically less than 100
A of ICC (with VOUT unloaded). The input threshold is
hysteretic, allowing the user to program a start-up delay with an external RC
circuit.
VIN
2, 3
2, 3
2, 3
I
Input voltage. The recommended voltage range is 7 V to 15 V. Both VIN pins
should be connected together and connected to power source.
VOUT
14, 15
14, 15
22, 23
O
Output voltage.VOUT must not exceed VIN by more than 0.3 V.
detailed pin descriptions
CT: A capacitor connected to ground sets the maximum fault time. The maximum fault time must be more than
the time required to charge the external capacitance in one cycle. The maximum fault time is defined as:
t
FAULT
+
16.1
103
C
T
Once the fault time is reached the output shuts down for a time given by:
t
SD
+
833
103
C
T
This equates to a 1.9% duty cycle.
VOUT: Output voltage from the UCC39151. Both VOUT pins should be connected together and connected to
the load. When switched:
V
OUT
^
V
IN
*
0.15
W
I
OUT
VOUT must not exceed VIN by more than 0.3V.
(1)
(2)
(3)
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
6
www.ti.com
APPLICATION INFORMATION
protecting the UCC39151 from voltage transients
The parasitic inductance associated with the power distribution can cause a voltage spike at VIN if the load
current is suddenly interrupted by the UCC39151. It is important to limit the peak of this spike to less than 15 V
to prevent damage to the UCC39151. This voltage spike can be minimized by:
Reducing the power distribution inductance (e.g., twist the positive (+) and negative () leads of the
power supply feeding VIN, locate the power supply close to the UCC39151 or use PCB power and
ground planes).
Decoupling VIN with a capacitor, C
IN
(refer to Typical Application diagram), located close to the VIN
pins. This capacitor is typically 1
F or less to limit the inrush current.
Clamping the voltage at VIN below 15 V with a Zener diode, D1 (refer to Typical Application diagram),
located close to the VIN pins.
estimating maximum load capacitance
For hot swap applications, the rate at which the total output capacitance can be charged depends on the
maximum output current available and the nature of the load. For a constant-current, current-limited application,
the output comes up if the load asks for less than the maximum available short-circuit current.
To guarantee recovery of a duty-cycle from a short-circuited load condition, there is a maximum total output
capacitance which can be charged for a given unit on-time (fault-time). The design value of on-time or fault-time
can be adjusted by changing the timing capacitor C
T
.
UDG94138
Figure 1. Output Waveforms Under Fault Conditions
UCC39151
SLUS184A FEBRUARY 1999 REVISED OCTOBER 2001
7
www.ti.com
APPLICATION INFORMATION
For worst-case constant-current load of value just less than the trip limit; C
OUT(max)
can be estimated from:
C
OUT(max)
[
I
MAX
*
I
LOAD
16.1
103
C
T
V
OUT
Where V
OUT
is the output voltage.
For a resistive load of value R
L
, the value of C
OUT(max)
can be estimated from:
C
OUT(max)
[
16.1
103
C
T
R
L
n
1
1
*
V
OUT
I
MAX
R
L
Long C
T
times must consider the maximum temperature. Thermal shutdown protection may be the limiting
fault-time.
safety recommendations
Although the UCC39151 is designed to provide system protection for all fault conditions, all integrated circuits
can ultimately fail short. For this reason, if the UCC39151 is intended for use in safety critical applications where
UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series
with the device. The UCC39151 prevents the fuse from blowing for virtually all fault conditions, increasing
system reliability and reducing maintenance cost, in addition to providing the hot swap benefits of the device.
(4)
(5)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding thirdparty products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright
2001, Texas Instruments Incorporated
PDF 
ZIP