TPS819
2002-02-28
1
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS819
Mobile Phones, PHS, Pagers
Notebook PCs, PDAs
Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS819 is a linear-output photo-IC which incorporates a
photodiode and a current amp circuit in a single chip. This photo-IC also
incorporates a luminous-efficiency correction filter, so output value is
close to luminosity characteristics.
High sensitivity : I
L
= 50~100 A
@E
V
= 100 lx
p
= 522 nm LED
Luminous efficiency correction filter mounted on detector
:
p
= 550 nm (typ.)
Open-emitter output
Compact and light surface-mount package
Maximum Ratings
(Ta
=
=
=
=
25C)
Characteristics Symbol
Rating
Unit
Supply voltage
V
CC
-
0.5~7 V
Output voltage
V
OUT
<
=
V
CC
V
Light current
I
L
10
mA
Permissible power dissipation
P
70
mW
Operating temperature range
T
opr
-
25~85 C
Storage temperature range
T
stg
-
40~100
C
Soldering temperature range
(Note 1)
T
sol
260
C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
Unit: mm
TOSHIBA
Weight: 0.017 g (typ.)
TPS819
2002-02-28
2
Recommended Operating Conditions
Characteristics Symbol
Min
Typ.
Max
Unit
Supply voltage
V
CC
2.2
5.5 V
Lead resistance
R
L
510
W
Electrical and Optical Characteristics
(Ta
=
=
=
=
25C)
Characteristics Symbol
Test
Condition
Min
Typ.
Max
Unit
Supply current
I
CC
V
CC
=
3 V, E
V
=
1000 lx,
R
L
=
1 k
W
(Note
2)
2
mA
Light current (1)
I
L
(1)
V
CC
=
3 V, E
V
=
10 lx
(Note
2,
5)
20
Light current (2)
I
L
(2)
V
CC
=
3 V, E
V
=
100 lx
(Note
2,
5)
200
Light current (3)
I
L
(3)
V
CC
=
3 V,
l
p
=
522 nm,
E
V
=
100 lx
(Note 3, 5)
50
100
m
A
Light current ratio
)
3
(
L
)
IR
(
L
I
I
(Note 4, 5)
0.03 0.10
Dark current
I
LEAK
V
CC
=
3.3 V, E
V
=
0
0.5
m
A
Saturation output voltage
Vo
V
CC
=
3 V, R
L
=
75 k
W,
E
V
=
100 lx
(Note 3)
2.2 2.35
V
Peak sensitivity wavelength
l
p
550
nm
t
r
0.2
t
f
1
t
d
0.3
Switching time
t
s
V
CC
=
3 V, R
L
=
5 k
W
,
l
p
=
522 nm
(Note 6)
0.02
ms
Note 2: CIE standard A light source is used (color temperature
=
2856K)
Note 3: Green LED (
l
p
=
522 nm) is used as light source and set an illuminance meter for 100 lx.
Light current classification: A Rank: 50~83.5
m
A, B Rank: 60~100
m
A
Note 4: Infrared LED (
l
p
=
870 nm) is used as light source for I
L
(IR) and light current is set to obtain V
CC
=
3 V and
E
=
0.01 mW/cm
2
.
Note 5: Light current measurement circuit
Note 6: Rise time/fall time measurement method
TPS819
V
CC
OUT
R
L
Pulse drive
l
p
=
522 nm
LED
t
f
t
r
t
s
t
d
I
F
1.5 V
V
OUT
GND
90%
10%
A
OUT
V
CC
LED
I
L
I
F
TPS819
TPS819
2002-02-28
3
Package Dimensions
Weight: 0.017 g (typ.)
Pin Connection
Current
amp
3 V
CC
4 OUT
1 GND
2 GND
TPS819
2002-02-28
4
Handling Precautions
At power-on in darkness the internal circuit takes about 50 ms to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel.
(2) The optical characteristics of the devices may be affected by exposure to moisture in the air before
soldering and they should therefore be stored after opening the moisture proof bag under the following
conditions:
Temperature: 5C~30C, Humidity: 60% (max), Storage time: 168 h (max)
(3) Please perform baking when the storage time is expired. Expiration date for an unopened moisture proof
bag is six month and 168 h for an opened moisture proof bag. This device is a tape packed product; hence,
do not bake the product at high temperature:
Recommended baking condition: Baking Temperature = 60C, Baking Hours = 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into contact
with other components.
Mounting Methods
(1) Reflow
soldering
Package surface temperature: 260C (max)
Please perform reflow soldering using the following reference temperature profile. Perform reflow
soldering no more than twice.
Please perform the first reflow soldering with reference to the above temperature profile and within
168 h of opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the
above conditions.
Storage conditions before the second reflow soldering: 30C, 60% RH max
Do not perform flow soldering.
Make any necessary soldering corrections manually.
(only once at each soldering point)
Temperature:
350C or less
Time: within 5 s
Time
(
s
)
Tem
perat
ure (
C)
60
~
120 s
260C max
30
~
50 s
230C
190C
180C
Preheat
TPS819
2002-02-28
5
(2) Recommended
soldering
pattern
(3) Cleaning
conditions
When cleaning is required after soldering
Chemicals:
AK225
alcohol
Temperature and time: 50C 30 s or : 30C 3 min
Ultrasonic cleaning: 300 W or less
Packing Display
(1) Packing
quantity
Reel (minimum packing quantity)
3000 pcs
Carton
5 reels (15000 pcs)
(2) Packing
form
To avoid moisture absorption by the resin, the devices are sealed in an aluminum package with silica gel.
Buffer materials are enclosed with carton.
Carton appearance
Carton dimensions
(W)
81
mm
(L) 280 mm (H) 280 mm
1.6 1.6
1.3
0.
95
0.
95 0.
6
Unit: mm
Label position
TPS819
2002-02-28
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4.0
0.1
f
1.5
+
0.1
0
2.0
0.05
A
A'
Feed direction
Device Orientation
4.0
0.1
0.2
0.05
1.3
0.1
A-A'
B-B'
max 6
2.8
0.1
max 6
3.
6
0.
1
8.
0
0.
2
1.
75
0.
1
ma
x
6
ma
x
6
3.
5
0.
1
(2.
75)
B
B'
Tape Packing Specifications
(1) Reel
dimensions
(2) Tape
dimensions
2
0.5
f
180
+
0
-
4
f
21
0.3
f
13
0.5
Label
f
60
9
0.3
11.4
1
TPS819
2002-02-28
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Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Ambient temperature Ta (C)
P Ta
P
o
w
e
r
di
ssi
p
a
ti
on
P
(
m
W
)
Ambient temperature Ta (C)
I
LEAK
Ta
(typ.)
Dar
k
cur
r
e
n
t I
L
EAK
(
m
A)
Illuminance E
V
(lx)
I
L
E
V
(typ.)
Li
ght
cu
rr
ent
I L
(
m
A)
Ambient temperature Ta (C)
I
L
Ta
(typ.)
Supply voltage VCC (V)
I
L
V
CC
(typ.)
Illuminance E
V
(lx)
Vo E
V
(typ.)
Outp
ut
vol
t
ag
e V
o
(V
)
0
50
60
80
0
70
20
40
60
80
100
20
30
40
10
0.001
20
10
100
1
60
VCC
=
3 V
VCC
=
5 V
0.1
0.01
40
80
Please refer to Figure 2
0.6
-
40
40
0.8
1.0
1.4
-
20
100
1.2
0
80
20
60
E
=
10 lx (A light source)
E
=
100 lx (Fluorescent light)
E
=
100 lx (A light source)
VCC
=
3 V
Using the A light source
Please refer to Figure 1
0
2
1.6
7
0.8
5
3
Ta
=
25C
Please refer to Figure 1
0.4
1.2
4
6
0.001
1
10
100000
1
1000
100
0.1
0.01
10
10000
Fluorescent light 7.5 k
W
Fluorescent light 1 k
W
A light source 7.5 k
W
A light source 1 k
W
VCC
=
3 V
Ta
=
25C
Please refer to Figure 4
1
1
10000
100000
1000
1000
100
100
10
10
10000
A light source VCC
=
3 V
Fluorescent
light
VCC
=
3 V
A light source VCC
=
5 V
Fluorescent
light
VCC
=
5 V
Ta
=
25C
Please refer to Figure 1
TPS819
2002-02-28
8
1
1
10000
1000
1000
100
100
10
10
VCC
=
3 V
Ta
=
25C
Using the A light source
RL
=
1 k
W
Please refer to Figure 3
Illuminance E
V
(lx)
I
CC
E
V
(typ.)
C
ons
um
pti
o
n
cu
rr
ent
I
CC
(
m
A)
Load resistance RL (k
W
)
Switching characteristics
(Non-saturating
operation)
(typ.)
Switch
in
g
ti
m
e
(
m
s)
Switch
in
g
ti
m
e
(
m
s)
Load resistance RL (k
W
)
Switching characteristics
(Saturating
operation)
(typ.)
1
0.1
10000
10
1000
100
10
Ta
=
25C
VCC
=
3 V
VOUT
>
=
2 V
l
p
=
522 nm
Please refer to Figure 5
1
t
r
t
f
t
d
t
s
Ta
=
25C
VCC
=
3 V
VOUT
=
1.5 V
l
p
=
522 nm
Please refer to Figure 5
tf
td
tr
ts
1
1
0.1
10
10000
1000
100
10
TPS819
2002-02-28
9
Measurement Circuits
Spectral response
(typ.)
Re
la
tiv
e
s
e
n
s
itivi
t
y
Relative sensitivity
Radiation
pattern
(typ.)
Wavelength
l
(nm)
Ta
=
25C
Luminosity angle
30
0
60
90
90
30
60
1.0
0.8
0.6
0.4
0.2
0
80
70
50
40
20
10
70
80
50
40
20
10
TPS819
V
CC
Figure 4 Output voltage measurement circuit
R
L
V Vo
Light
TPS819
V
CC
OUT
Icc
A
Figure 3 Consumption current measurement circuit
R
L
Light
Pulse drive
TPS819
l
p
=
522 nm
LED
V
CC
OUT
R
L
Figure 5 Switching measurement circuit
Figure 1 Light current measurement circuit
TPS819
V
CC
OUT
IL
A
Light
Figure 2 Dark current measurement circuit
TPS819
V
CC
OUT
I
LEAK
A
0
200
1.0
1200
400 600 800
0.2
0.4
0.6
0.8
Ta
=
25C
1000
TPS819
2002-02-28
10
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EBA
RESTRICTIONS ON PRODUCT USE
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