TPS851
2002-04-17
1
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS851
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS851 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
Ultra-compact and light surface-mount package suitable for lead-free
soldering and reflow soldering: 2.0 2.1 0.7 mm
Excellent output linearity of illuminance
Little fluctuation in light current and high level of sensitivity
:
I
L
= 37 A to 74 A @E
V
= 100 lx using fluorescent light
: Light current variation width: 1.67
(when light current classification is specified.)
: Little temperature fluctuation
Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
:
I
L
(using incandescent light)/I
L
(using fluorescent light) = 1.2 (typ.)
Low supply voltage, making device suitable for battery-powered equipment: V
CC
= 2.7 V to 5.5 V
Maximum Ratings
(Ta
=
=
=
=
25C)
Characteristics Symbol
Rating
Unit
Supply voltage
V
CC
-0.5 to 7
V
Output voltage
V
OUT
<
= V
CC
V
Light current
I
L
5
mA
Permissible power dissipation
P
35
mW
Operating temperature range
T
opr
-30 to 85
C
Storage temperature range
T
stg
-40 to 100
C
Soldering temperature range
(Note 1)
T
sol
260
C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
JEDEC
JEITA
TOSHIBA
Weight: 0.0054 g (typ.)
TPS851
2002-04-17
2
Recommended Operating Conditions
Characteristics Symbol
Min
Typ.
Max
Unit
Supply voltage
V
CC
2.2
5.5 V
Electrical and Optical Characteristics
(Ta
=
=
=
=
25C)
Characteristics Symbol Test
Condition Min
Typ.
Max
Unit
Supply current
I
CC
V
CC
= 3 V, E
V
= 1000 lx
R
L
= 1 kW (Note
2)
620
mA
Light current (1)
I
L
(1)
V
CC
= 3 V, E
V
= 100 lx
(Note 2), (Note 4)
62
mA
Light current (2)
I
L
(2)
V
CC
= 3 V, E
V
= 10 lx
(Note 3), (Note 4)
3.7
7.4 mA
Light current (3)
I
L
(3)
V
CC
= 3 V, E
V
= 100 lx
(Note 3), (Note 4)
37
74 mA
Light current ratio
(3)
L
I
(1)
L
I
1.2
1.7
Dark current
I
LEAK
V
CC
= 3.3 V, E
V
= 0
0.17
mA
Saturation output voltage
V
O
V
CC
= 3 V, R
L
= 150 kW, E
V
= 100 lx
(Note 3)
2.2 2.35
V
Peak sensitivity wavelength
lp
600 nm
Rise time
t
r
0.07 1
Switching time
Fall time
t
f
V
CC
= 3 V, R
L
= 5 kW
(Note 5)
0.4 2
ms
Note 2: CIE standard A light source is used (color temperature
= 2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
I
L
classification I
L
(3)
A: 37 mA to 62 mA, B: 44 mA to 74 mA
Note 4: Light current measurement circuit
Note 5: Rise time/fall time time measurement method
A
OUT
V
CC
I
L
TPS851
Light
source
OUT
V
CC
White LED
Pulse drive
TPS851
R
L
t
f
t
r
I
F
1.5 V
V
OUT
GND
90%
10%
TPS851
2002-04-17
3
Package Dimensions
Weight: 0.0054 g (typ.)
Block Diagram
1. V
CC
5. OUT
2. GND
3. NC
Current
amp
4. NC
: Light-receiving area
Size of light-receiving area:
(0.35 mm)
Unit: mm
Tolerance:
0.1
( ): Reference value
Pin connection
1. V
CC
2. GND
3. NC
4. NC
5. OUT
Center of
sensitive area
TPS851
2002-04-17
4
Handling Precautions
At power-on in darkness, the internal circuit takes about 100 ms to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5C to 30C, Relative humidity: 60% (max), Time: 168 h (max)
(3) Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60C for 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(1) Reflow
soldering
Package surface temperature: 260C (max)
Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30C, 60% RH or lower
Do not perform flow soldering.
Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350C (25 W for soldering iron)
Time: within 5 s
30 s to 50 s Heating part
Time (s)
60 s to 120 s
Tem
perat
ure (
C)
260C max
230C
190C
180C
Preheating part
TPS851
2002-04-17
5
(2) Recommended
soldering
pattern
(3) Cleaning
conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50C 30 s or 30C 3 mins
Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing
quantity
Reel (minimum packing quantity)
3,000 devices
Carton
5 reels (15,000 devices)
(2) Packing
format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Carton
dimensions
(W)
81
mm
(L) 280 mm (H) 280 mm
Label
0.65
1.
9
0.65
0.4
0.
8
Unit: mm
TPS851
2002-04-17
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Tape Packing Specifications
(1) Reel
dimensions
Reel material: Plastic
f
180
f
60
11.4
9.0
Unit: mm
5.0
Enlarged view of reel center
5.0
120
f13 0.2
2
0.5
f21 0.8
TPS851
2002-04-17
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(2) Tape
dimensions
Tape material: Plastic (anti-electrostatic)
Unit: mm
Tolerance:
0.2
f1.5
+ 0.1
- 0
0.18
4.0
3.
5
0.
1
0.85
0.05
2.
3
0.
05
2.2
0.05
A'
A
B'
2.0
0.1
B
4.0
0.1
(feed hole)
8.
0
1.
75
f1.1
(pocket hole)
Cross-section between A and A'
Cross-section between B and B'
TPS851
2002-04-17
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Reel Label
The label markings may include product number, tape type and quantity.
P/N
TYPE TPS851
ADDC Q'TY
3,000
pcs.
NOTE
Leader and Trailer Sections of Tape
Position of label
Sensor hole
Empty trailer section:
at least 10 empty device slots
Empty leader section:
at least 100 mm of carrier tape
Cover tape: 300 mm (min)
TPS851
2002-04-17
9
Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Ambient temperature Ta (C)
P Ta
P
o
w
e
r
di
ssi
p
a
ti
on
P
(
m
W
)
Ambient temperature Ta (C)
I
LEAK
Ta
(typ.)
Dar
k
cur
r
e
n
t I
LEAK
(
m
A)
Luminance E
V
(lx)
I
L
E
V
(typ.)
Li
ght
cu
rr
ent
I
L
(
m
A)
Ambient temperature Ta (C)
Relative
I
L
Ta
(typ.)
Supply voltage V
CC
(V)
Relative
I
L
V
CC
(typ.)
0
0
40
20
40
60
80
100
30
20
10
5
35
25
15
Ta
= 25C
0
2
1.6
7
3
4
5
6
1.2
0.8
0.4
VCC = 3 V
EV = 100 lx
using fluorescent light
1.40
0.60
-40
1.20
1.00
0.80
-20
0
20
40
60
80
100
1
0.0001
20
VCC = 3 V
0.1
0.01
0.001
40 60 80 100
Luminance E
V
(lx)
V
O
E
V
(typ.)
Outp
ut
vol
t
ag
e V
O
(V
)
Ta
= 25C
VCC = 3 V
Fluorescent
light
RL = 1 kW
Fluorescent
light
RL = 7.5 kW
A light source
RL = 1 kW
A light source
RL = 7.5 kW
0.001
10
1
0.1
0.01
0.0001
1
10
100
1000
10000
Ta
= 25C
VCC = 3 V
A light source
Fluorescent
light
1
10000
1000
100
10
0.1
1
10
100
1000
10000
TPS851
2002-04-17
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Switch
in
g
ti
m
e
(
m
s)
Ambient temperature Ta (C)
Relative
I
CC
Ta
(typ.)
R
e
l
a
ti
v
e
c
ons
um
pti
o
n cu
rr
ent
Load resistance R
L
(k
W)
Switching Characteristics
(non-saturating
operation)
(typ.)
Load resistance R
L
(k
W)
Switching Characteristics
(saturating
operation)
(typ.)
Switch
in
g
ti
m
e
(
m
s)
Ta
= 25C
VCC = 3 V
VOUT = 1.5 V
Using white LED
tf
td
tr
ts
1
0.1
10
1000
100
10
1
300
30
3
0.3 3
VCC = 3 V
EV = 100 lx
using fluorescent light
RL = 1 kW
1.40
0.60
-40
1.20
1.00
0.80
-20 0 20 40 60 80 100
Luminance E
V
(lx)
I
CC
E
V
(typ.)
C
ons
um
pti
o
n
cu
rr
ent
I
CC
(
m
A)
Ta
= 25C
VCC = 3 V
Using the A light source
RL = 250 W
RL = 1000 W
RL = 5000 W
1
10000
1000
100
10
0.1
1
10
100
1000
10000
tf
Ta
= 25C
VCC = 3 V
VOUT >= 2 V
Using white LED
1000
0.1
0.1 10
ts
td
tr
100
10
1
1
300
30
3
0.3
0.3 3
TPS851
2002-04-17
11
Switching Time Measurement Circuit and Waveforms
Wavelength
l (nm)
Spectral
Response
(typ.)
Re
la
tiv
e
s
e
n
s
itivi
t
y
Radiation
Pattern
(typ.)
Luminosity
angle
30
0
60
90
90
30
60
1.0
0.8
0.6
0.4
0.2
0
80
70
50
40
20
10
70
80
50
40
20
10
Ta
= 25C
OUT
V
CC
White LED
Pulse drive
TPS851
R
L
t
f
t
r
I
F
1.5 V
V
OUT
GND
90%
10%
t
s
t
d
60
0
200 400 600
1000
1200
800
20
40
80
100
Ta
= 25C
TPS851
2002-04-17
12
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EBA
RESTRICTIONS ON PRODUCT USE
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