0.25-m MMW pHEMT 2MI
Process Data Sheet
Semiconductors for Communications, Space and Military
www.TriQuint.com
500 West Renner Road
Richardson, Texas 75080
Phone: 972-994-3600
Foundry: 972-994-4545
Email: info@triquint.com
Page 1 of 2; Rev New 8/16/02
Specifications are subject to change.
Features
0.25-m amplifier transistor
0.25-m switch transistor
0.25-m diodes
Device passivation
High-Q passives
MIM capacitors
TaN resistors
GaAs resistors
2 metal layers
Air bridges
Substrate vias
Operation up to V
d
= 7 V
Applications
Up to 50 GHz
Communications
Space
Military
Power amplifiers
Driver amplifiers
Low-noise amplifiers
AGC amplifiers
Limiting amplifiers
Transimpedance amplifiers
Differential amplifiers
Digital and analog phase shifters
Digital and analog attenuators
Mixers (up and down converters)
Multipliers
Switches
Oscillators
General Description
The 0.25-m mmw pHEMT combines high power
density and gain per stage performance. The
proc-
ess is optimized for high-power and low-noise op-
eration through 50 GHz. Passives include 2 thick-
metal interconnect layers, precision TaN resistors,
GaAs resistors, MIM capacitors and through-
substrate vias. The via-under-cap process offers
excellent grounds at higher frequencies. Our
air
bridges produce minimal interconnect capacitance.
This process has a successful history of commer-
cial, military and space applications.
Air bridge
Plating, 4.6
m
Nitride for
capacitor
Cap top-plate
First metal,
0.75
m
Semi-insulating GaAs substrate
Active region
Via under cap
GaAs resistor
Nitride
0.25-m 2MI Cross Section
0.25-m MMW pHEMT 2MI
Process Data Sheet
Semiconductors for Communications, Space and Military
www.TriQuint.com
500 West Renner Road
Richardson, Texas 75080
Phone: 972-994-3600
Foundry: 972-994-4545
Email: info@triquint.com
Page 2 of 2; Rev New 8/16/02
Specifications are subject to change.
Prototyping and Development
Prototype Chip Option (PCO)
Shared mask set
Run often
Backside via included
PCM (process control monitor) qualified
wafers
For PCO schedules, please visit
http://
www.triquint.com/prodserv/divisions/foundry/
new/proto_sched_pco.cfm
Prototype Wafer Option (PWO)
Customer-specific masks,
Customer schedule
2 wafers delivered
Backside vias included
PCM (process control monitor) qualified
wafers
Process Status
0.25-m mmw pHEMT is fully released and
qualified.
Contact TriQuint or visit
http://www.triquint.com/company/quality/
for more information on quality and reliability.
Manufacturing Services
Mask making
100-mm wafer fab
Wafer thinning
Wafer dicing
Substrate vias
DC die-sort testing
RF die-sort testing
Design Tools
Device libraries of circuit elements:
FETs
Diodes
Thin-film and implanted resistors
Capacitors
Inductors
Agilent ADS design kit
MASC Library
AWR Microwave Office Library
Training
GaAs design classes:
Half-day introduction upon request
3-day technical training upon request at
the TriQuint Texas facility
Applications Services
Tiling of GDSII stream files including PCM
(process control monitor)
Design rule checking
Layout versus schematic checking
Engineering:
On-wafer DC test
On-wafer RF test
Thermal analysis
Yield enhancement
Part qualification
Failure analysis
Space qualification
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