TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
March 21, 2000
1
27 - 32 GHz 1W Power Amplifier TGA1172
Primary Applications
Point-to-Point Radio
Point-to-Multipoint Communications
Ka Band Sat-Com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
Key Features
0.25 um pHEMT Technology
18 dB Gain at 28 GHz
29 dBm Nominal P1dB
37dBm OTOI typical at 28GHz
Input/Output RL < -10 dB
Bias 6 - 7V @ 630 mA
Chip Dimensions 2.69 mm x 1.37 mm
600
m
1200
m
2400
m
Vd1
Vg1
Vd2
Vg2
Vd3
Vg3
Vd1
Vd2
Vg2
Vd3
Vg3
RF
IN
RF
OUT
30
31
32
33
34
35
36
37
38
39
40
26
27
28
29
30
31
32
33
()
-20
-15
-10
-5
0
5
10
15
10
15
20
25
30
35
40
g(
)
-45
-35
-25
-15
-5
5
15
25
S22
S11
S21
Ret
u
rn Lo
ss (d
B)
Ga
i
n
(d
B
)
Frequency (GHz)
6V, 630 mA
25
26
27
28
29
30
31
32
26
27
28
29
30
31
32
P1
d
B
(
d
Bm
)
Frequency (GHz)
6V, 630 mA
O
u
tp
u
t
TO
I (d
B
m
)
Frequency (GHz)
6V, 630 mA
Small Signal Gain
Output Power at P1dB
Output Third Order Intercept
Amplifier Topology
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
March 21, 2000
2
TGA1172
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TGA1172 Single tone pout and IMD3 vs Pin
Frequency = 28GHz, 6V, 630 mA
0
5
10
15
20
25
-5
-4
-3
-2
-1
0
1
2
3
4
5
Pin (dBm)
P
out
(
d
Bm
)
-40
-30
-20
-10
0
10
IMD3
(dBm
)
SCL Power
IMD3
TGA1172 Single tone pout and IMD3 vs Pin
Frequency = 31GHz, 6V, 630 mA
0
5
10
15
20
25
-5
-4
-3
-2
-1
0
1
2
3
4
5
Pin (dBm)
P
out
(
d
Bm
)
-40
-30
-20
-10
0
10
IMD3
(dBm
)
SCL Power
IMD3
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
March 21, 2000
3
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TGA1172
5mil
Ribbon
100pF
100pF
0.01
F
0.01
F
5mil
Ribbon
Vg
Vd
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
March 21, 2000
4
Reflow process assembly notes:
= AuSn (80/20) solder with limited exposure to temperatures at or above 300C
= alloy station or conveyor furnace with reducing atmosphere
= no fluxes should be utilized
= coefficient of thermal expansion matching is critical for long-term reliability
= storage in dry nitrogen atmosphere
Component placement and adhesive attachment assembly notes:
= vacuum pencils and/or vacuum collets preferred method of pick up
= avoidance of air bridges during placement
= force impact critical during auto placement
= organic attachment can be used in low-power applications
= curing should be done in a convection oven; proper exhaust is a safety concern
= microwave or radiant curing should not be used because of differential heating
= coefficient of thermal expansion matching is critical
Interconnect process assembly notes:
= thermosonic ball bonding is the preferred interconnect technique
= force, time, and ultrasonics are critical parameters
= aluminum wire should not be used
= discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
= maximum stage temperature: 200C
Assembly Process Notes
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TGA1172
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