TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
September 9, 2001
1
Not Recommended for New Designs
TriQuint Recommends the TGA4509-EPU be used for New Designs
27- 32 GHz Ka Band HPA TGA1193-EPU
Key Features
0.25 um pHEMT Technology
15dB Nominal Gain at 30GHz
31.5dBm Psat @ 30GHz Typical
37dBm OTOI Typical at 30GHz
Bias 7 V @ 1.26A
Chip Dimensions 3.14 mm x 2.63 mm
Primary Applications
Ka Band Sat-Com Ground Terminals
Point-to-Point Radio
Point-to-Multipoint Hubs
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
Preliminary Measured Results
TGA1193 Small Signal Gain
0
2
4
6
8
10
12
14
16
18
20
24
25
26
27
28
29
30
31
32
33
34
Frequency (GHz)
G
a
in (
d
B)
TGA1193 P1dB
25
27
29
31
33
35
27
28
29
30
31
32
Frequency (GHz)
P1dB (
d
Bm)
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
September 9, 2001
2
Not Recommended for New Designs
TriQuint Recommends the TGA4509-EPU be used for New Designs
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TGA1193-EPU
TGA1193Typical S-Parameters
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
September 9, 2001
3
Not Recommended for New Designs
TriQuint Recommends the TGA4509-EPU be used for New Designs
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TGA1193-EPU
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
September 9, 2001
4
Not Recommended for New Designs
TriQuint Recommends the TGA4509-EPU be used for New Designs
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TGA1193-EPU
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
September 9, 2001
5
Not Recommended for New Designs
TriQuint Recommends the TGA4509-EPU be used for New Designs
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
Reflow process assembly notes:
AuSn (80/20) solder with limited exposure to temperatures at or above 300C
alloy station or conveyor furnace with reducing atmosphere
no fluxes should be utilized
coefficient of thermal expansion matching is critical for long-term reliability
storage in dry nitrogen atmosphere
Component placement and adhesive attachment assembly notes:
vacuum pencils and/or vacuum collets preferred method of pick up
avoidance of air bridges during placement
force impact critical during auto placement
organic attachment can be used in low-power applications
curing should be done in a convection oven; proper exhaust is a safety concern
microwave or radiant curing should not be used because of differential heating
coefficient of thermal expansion matching is critical
Interconnect process assembly notes:
thermosonic ball bonding is the preferred interconnect technique
force, time, and ultrasonics are critical parameters
aluminum wire should not be used
discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
maximum stage temperature: 200C
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TGA1193-EPU
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
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