TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
1
25
26
27
28
29
30
31
32
33
34
35
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Frequency (GHz)
Output P
o
wer (dB
m
)
2.5GHz WiMAX Driver / Power Amplifier TGA2702-SM
Key Features
2.3-2.8 GHz Bandwidth
2.5% EVM @ 23 dBm Pout (2.6GHz
802.11g OFDM waveform)
39 dBc IMD3 @ 21 dBm Pout/tone
28 dB Nominal Gain
29.8 dBm Nominal P1dB
16 dB step attenuator function
Power sample port
Bias: +6 V (Single Bias)
Package Dimensions:
5.0 x 5.0 x 0.9 mm QFN
Primary Applications
Fixed Broadband Wireless
2.5GHz WiMAX
WiBro
Preliminary Measured Data
Bias Conditions: Vd = +6 V Self Bias
P2dB
P1dB
-30
-20
-10
0
10
20
30
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Frequency (GHz)
S-Par
a
meter
(d
B
)
S21
S11
S22
General Description
TGA2702-SM is a linear amplifier
operating for 802.16 fixed broadband
wireless applications across the 2.3 to
2.8 GHz frequency band. Application
include WiMAX, 802.11g and WiBro.
The PA delivers 28 dB of small-signal
gain and Pout of 23dBm @ 2.5% EVM
(2.6GHz 802.11g OFDM waveform)
from a single +6V power supply. The
TGA2702 incorporates an 16 dB step
attenuator function and a power sample
port. The 50 ohm device requires
minimum external components for
operation, and is packaged in a low-
cost, surface mount 5x5 QFN style
package.
Lead-Free & RoHS compliant
Demo boards are available.
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to
change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
2
TGA2702-SM
TABLE I
MAXIMUM RATINGS 1/
SYMBOL
PARAMETER
VALUE
NOTES
Vd
Drain Voltage
7 V
2/
Vctrl
Gain Control Voltage
7 V
Id
Drain Current
1.1 A
2/ 3/
Ig
Gate Current
6 mA
3/
P
IN
Input Continuous Wave Power
25 dBm
P
D
Power Dissipation
4.68W
2/ 4/
T
CH
Operating Channel Temperature
150
0
C
5/
T
M
Mounting Temperature (30 Seconds)
260
0
C
T
STG
Storage Temperature
-65 to 150
0
C
1/
These ratings represent the maximum operable values for this device.
2/
Combinations of supply voltage, supply current, input power, and output power shall not exceed P
D
.
3/
Total current for the device.
4/
When operated at this bias condition with a base plate temperature of 85
0
C, the median life is reduced
5/
Junction operating temperature will directly affect the device median time to failure (MTTF). For
maximum life, it is recommended that junction temperatures be maintained at the lowest possible
levels.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
3
TABLE II
ELECTRICAL CHARACTERISTICS
(Ta = 25
0
C Nominal)
Response
Units
Typical
Notes
Frequency Band
GHz
2.3 - 2.8
Drain Operating Voltage
V
6
Small Signal Gain
dB
28
Input Return Loss
dB
12
Output Return Loss
dB
14
Control Gain Step
dB
16
Psat
dBm
31.5
Pin at 11 dBm
P1dB
dBm
30
EVM
%
2.5
at 2.6GHz, 23 dBm Pout
Gain variation over temperature
dB/
o
C
0.03
IMD3
dBc
38
at 21 dBm Pout/tone
TOI
dBm
40
at 21 dBm Pout/tone
TABLE III
THERMAL INFORMATION
Parameter
Test Conditions
T
CH
(
o
C)
R
T
JC
(
q
C/W)
T
M
(HRS)
R
JC
Thermal
Resistance
(channel to backside
of package)
Vd = 6V
I
D
= 0.77 A
Pdiss = 4.62 W
145.5
13.1
3.8E+6
Note: Package backside soldered to carrier at 85
C baseplate temperature.
TGA2702-SM
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
4
-40
-30
-20
-10
0
10
20
30
40
1
1.5
2
2.5
3
3.5
4
Frequency (GHz)
S-Par
ameter
(d
B
)
25
26
27
28
29
30
31
32
33
34
35
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Frequency (GHz)
O
u
tput Pow
er (dB
m
)
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id =750 mA Self Bias
S21
S11
S22
P2dB
P1dB
TGA2702-SM
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
5
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id =750 mA Self Bias
TGA2702-SM
10
15
20
25
30
35
-15
-10
-5
0
5
10
15
Pin (dBm)
Pout (dB
m
)
2.3GHz
2.4GHz
2.5GHz
2.6GHz
2.7GHz
2.8GHz
-60
-50
-40
-30
-20
-10
0
15
17
19
21
23
25
27
Output Power per tone (dBm)
I
M
R3 (
d
Bc)
2.4GHz
2.5GHz
2.6GHz
2.7GHz
2.8GHz
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
6
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id =750 mA Self Bias
802.11g, OFDM, 64QAM
0
1
2
3
4
5
6
7
13
15
17
19
21
23
25
Output Power (dBm)
EVM
(%)
2.5GHz
2.6GHz
2.7GHz
TGA2702-SM
0.6
0.7
0.8
0.9
1
1.1
-15
-10
-5
0
5
10
15
Pin (dBm)
Id (A)
2.3GHz
2.4GHz
2.5GHz
2.6GHz
2.7GHz
2.8GHz
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
7
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id =750 mA Self Bias
TGA2702-SM
20
21
22
23
24
25
26
27
28
29
30
31
32
33
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Frequency (GHz)
S21 (
d
B
)
25 degC
-40 degC
70 degC
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
8
Package Layout
Top View
Bottom View
TGA2702-SM
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
9
Package Pinout Diagram
Top Side
Dot indicates Pin 1
Bottom Side
Pin
Description
Pin
Description
1,2,3
NC
14
Power
Sample
4
RF Input
18
RF Output
5,6,7,8,9
NC 19,20,21
NC
10
Gain Control
22
Vd2
11,13
NC
23,24,25
NC
12
Gate Acess
26
Vd1
15,16,17
NC
27,28
NC
1
7
8
14
15
21
22
28
TGA2702-SM
GND
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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February 21, 2005
10
Mechanical Drawing
(Bottom Side)
Units: mm [Inch]
Package tolerance: +/- 0.05
TGA2702-SM
5.00 [0.197]
3.50 [0.138]
5.00 [0.197]
3.50 [0.138]
0.50 [0.02]
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
11
Recommended Board Layout Assembly
The evaluation board material is 20 mil thick RO4003
100 pF and 0.01 uF are required de-coupling capacitor
TGA2702-SM
0.01uF
100pF
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
12
TGA2702 Bias Connection
TGA2702-SM
Self-biased mode
Connect gain control and Vg to ground.
Apply +6V to Vd. Current will be ~750mA
4 inch or longer jumper
or 10nH inductor
6V
Gate control mode
6V
Vg
Connect gain control to ground. Apply negative voltage Vg.
Apply +6V to Vd. Current will be ~750mA
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
13
-40
-30
-20
-10
0
10
20
2
2.2
2.4
2.6
2.8
3
3.2
3.4
Frequency (GHz)
S Par
ameter
(d
B
)
6V
6V
For 16 dB attenuation testing:
Connect gain control to +6V and Vg to ground.
Apply +6V to Vd. Current will be ~750mA
4 inch or longer jumper
or 10nH inductor
TGA2702 Bias Connection
TGA2702-SM
Gain control mode
S21
S11
S22
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 21, 2005
14
TGA2702-SM
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3
C/sec
3
C/sec
Activation Time and
Temperature
60 120 sec @ 140 160
C
60 180 sec @ 150 200
C
Time above Melting Point
60 150 sec
60 150 sec
Max Peak Temperature
240
C
260
C
Time within 5
C of Peak
Temperature
10 20 sec
10 20 sec
Ramp-down Rate
4 6
C/sec
4 6
C/sec
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