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S E M I C O N D U C T O R , I N C .
1
PRELIMINARY DATA SHEET
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TELECOM
PRODUCTS
The TQ8105/TQ8106 are SONET/SDH transceivers that integrate
multiplexing, demultiplexing, SONET/SDH framing, clock-synthesis PLL, and
enhanced line and clock diagnostic functions into a single monolithic device.
The TQ8106 is a pin-compatible upgrade of the TQ8105 that includes a
Clock and Data Recovery (CDR) function. The TQ8105 and TQ8106 allow
maximum flexibility in the selection of internal/external Clock and Data
Recovery, Opto-Electronic (O/E) Module, and Reference Clock Sources.
On-chip PLLs use external RC-based loop filters to allow custom tailoring of
loop response and support the wide range of reference clock frequencies
found in SONET/SDH/ATM systems. For transmit clock synthesis or for CDR,
the PLLs exceed ANSI, Bellcore, and ITU jitter specifications for systems
when combined with industry-typical O/E devices such as Sumitomo, AT&T,
HP, and AMP. The TQ8105/TQ8106 PLLs provide byte clocks and constant-
rate 38.88 MHz and 51.84 MHz, synthesized clock outputs, providing
clocking for UTOPIA and other system busses. Transmit data may also be
clocked into the devices with respect to the reference clock.
Operating from a single +5V supply, the TQ8105/TQ8106 provides fully
compliant functionality and performance, utilizing direct-connected PECL
levels (differential or single-ended) for high-speed I/O. As compared to AC-
coupled schemes, the direct-coupled connections reduce jitter and
switching-level offsets due to data patterns. The TQ8105/TQ8106 can also
provide direct connection to high-speed I/O utilizing ECL levels with a 5V
supply. Low-speed bus, control, and clock I/O utilize TTL levels. (An ECL/
PECL reference clock input is also provided; at 155.52 MHz the input should
be only PECL/ECL.) Output TTL pins can be tristated and may also be
configured for V
OH
with a 3.3V supply connection.
TQ8105/8106
SONET/SDH
Overhead
Processor
TQ8105
or
TQ8106
SONET/SDH
Transceiver
Tx O/E
Rx O/E
with
CDR
SONET/SDH
Overhead
Processor
TQ8106
SONET/SDH
Transceiver
with CDR
Tx O/E
Rx O/E
Reference
Clock
SONET/SDH
Transceivers
Features
Single-chip, byte-wide Mux,
Demux, Framer, and Tx clock-
synthesis PLL with enhanced
diagnostics
TQ8106 includes monolithic
Clock and Data Recovery
SONET/SDH/ATM compliant for
STS-12/STM-4 (622 Mb/s) or
STS-3/STM-1 (155 Mb/s) rates
155.52, 77.76, 51.84, 38.88, or
19.44 MHz reference clock inputs
with TTL, PECL, or ECL level
38.88 MHz and 51.84 MHz clock
outputs for UTOPIA as well as
byte clock rate (77.76 or 19.44 MHz)
External RC-based loop filters
Integrated loopbacks with
enhanced line and reference
clock diagnostics
Direct-coupled standard, PECL,
high-speed I/O with ECL option
Clean TTL interface to
PMC-Sierra devices
100-pin 14x14 mm JEDEC
plastic package
+5V-only supply for PECL I/O
(5.2V required for ECL I/O option)
40 to +125
C case operating
temperature
2
TQ8105/TQ8106
PRELIMINARY DATA SHEET
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Figure 1. TQ8105 Block Diagram
The combination of a thermally enhanced, 100-pin
JEDEC, metric, plastic package, the low-power
dissipation of the device, and the wide case-
temperature range permits operation without a heat
sink in most designs.
The TQ8106 uses the same pinout as the TQ8105 and
is compatible with it.
The TQ8105/TQ8106 provides comprehensive,
integrated, loopback functionality and enhanced line
and reference clock diagnostics required of SONET/
SDH systems, minimizing additional external circuitry.
TQ8105/TQ8106 diagnostics include:
Loss of Reference clock detector (LOR) output to
indicate that the PLL Reference Clock is not toggling
Lock Indicator (RLOCK), which permits monitoring
of the receiver clock frequency, flagging when the
frequency drifts beyond approximately 500 ppm
Loss of Signal (LOS) detector output to indicate that
the incoming data stream has no data transitions in
128-bit periods
ECL/PECL input (NSOL) to allow LOS from an O/E
module to force the data stream to all zeroes,
eliminating the need for external glue logic.
CKSRC(2:0)
MXD(7:0)
TXD
TXCK
RXD
RXCK
2
2
2
2
ECL/
PECL
I/O
Block
DVPP
8
Parallel
to
Serial
DXD(7:0)
8
LBM(1:0)
2
PH(1:0)
2
Loop
Back &
Retime
Block
LOS
Detect
VPP
VNN
FP1
REFCKE
2
REFCKT
B
Y
A
B
Y
A
MMS
Clock
Data
Clock
Data
Clock
Data
Clock
Data
/8
Ext. Clk
OC3
11
Hold
Register
NOE
LOS
DXSYNC
OOF
8
Serial
to
Parallel
Clock
Phase
TxBC
RxBC
Framer
Clock/8
LOR
NRESET
SDHCK
3
PLL Clock
Synthesizer
FP2
NSOL
SONETC
K
CLRLOS
Freq.
Lock
Detect
RLOCK
FRPWR
TQ8105
TQ8105/TQ8106
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TELECOM
PRODUCTS
Figure 2. TQ8106 Block Diagram
CKSRC(2:0)
MXD(7:0)
TXD
TXCK
RXD
RXCK
2
2
2
2
ECL/
PECL
I/O
Block
DVPP
8
Parallel
To
Serial
DXD(7:0)
8
LBM(1:0)
2
PH(1:0)
2
Loopback
& Retime
Block
LOS
Detect
VPP
VNN
FP1
REFCKE
2
REFCKT
B
Y
A
MMS
Clock
Data
Clock
Data
Clock
Data
Clock
Data
/8
Ext. Clk
OC3
11
Hold
Register
NOE
LOS
DXSYNC
OOF
8
Serial
To
Parallel
Clock
Phase
TxBC
RxBC
Framer
Clock/8
LOR
NRESET
SDHCK
3
PLL Clock
Synthesizer
FP2
NSOL
SONETCK
CLRLOS
Freq.
Lock
Detect
RLOCK
FRPWR
B
Y
A
B
Y
A
B
Y
A
Clock
& Data
Recovery
Data
Clock
NCDREN
CDRFP2
CDRFP1
CDRGND
CDRAVDD
Clock
Data
TQ8106
4
TQ8105/TQ8106
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Figure 3. 100-Pin Enhanced Plastic 14x14 mm Package Pinout
Table 1. Signal Descriptions (continues on next page)
Pin
Signal
Function
Description
1
VNN
5.2V/Ground
ECL/PECL section power
2
NC
No Connect
Do not connect
3
VPP
Ground/+5V
ECL/PECL Positive Supply (see Table 6B)
4
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
5
REFCKEN
ECL/PECL Input
Tx Ref. Clock or Bypass Clock, Complement
6
REFCKEP
ECL/PECL Input
Tx Ref. Clock or Bypass Clock, True
7
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
8
TXCKN
ECL/PECL Out
Transmit Clock, Complement
9
TXCKP
ECL/PECL Out
Transmit Clock, True
10
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
11
TXDN
ECL/PECL Out
Transmit Data, Complement
12
TXDP
ECL/PECL Out
Transmit Data, True
13
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
14
RXDN
ECL/PECL Input
Receive Data, Complement
15
RXDP
ECL/PECL Input
Receive Data, True
Note:
*TQ8106-specific signal
Note: *TQ8106-specific signal
13
TXDP
14
15
12
TXDN
11
DVPP
18
RXDP
19
DVPP
20
RXCKP
17
RXDN
16
DVPP
23
NSOL
24
VNN
25
GND
22
DVPP
21
RXCKN
8
DVPP
9
TXCKN
10
TXCKP
7
6
3
REFCKEP
4
VPP
5
REFCKEN
2
1
NC
38
DXD2
39
DGND
40
DXD3
37
VCC
36
DXD1
43
DGND
44
DXD5
45
VCC
42
DXD4
41
VCC
48
DXD7
49
SVDD
50
VDD
47
DGND
46
DXD6
33
VCC
34
DXD0
35
DGND
32
DXSYNC
31
DGND
28
NC/CDRA
VDD*
29
VCC
30
RXBC
27
VDD
26
SVDD
63
VDD
62
LBM0
61
GND
64
NOE
65
GND
58
RLOCK
57
56
CLRLOS
59
CDRGND*/NC
60
LBM1
53
VCC
52
OOF
51
GND
54
LOS
55
DGND
68
MMS
67
OC3
66
NRESET
69
CKSRC2
70
CKSRC1
73
PH0
72
PH1
71
CKSRC0
74
VDD
75
SVDD
88
DGND
87
TXBC
86
VCC
89
SONETCK
90
VCC
83
MXD5
82
MXD4
81
MXD3
84
MXD6
85
MXD7
78
MXD0
77
76
79
MXD1
80
MXD2
93
LOR
92
DGND
91
SDHCK
94
AGND
95
FP2
98
VDD
97
A
VDD
96
FP1
99
REFCKT
100
GND
DVPP
NC/CDRFP2*
NC/CDRFP1*
VPP
GND
VNN
FRPWR
NCDREN*/NC
TQ8105/TQ8106
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TELECOM
PRODUCTS
Table 1. Signal Descriptions (continued)
Pin
Signal
Function
Description
16
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
17
RXCKP
ECL/PECL Input
Receive Clock, True (Ignored when CDR used)
18
RXCKN
ECL/PECL Input
Receive Clock, Complement (Ignored when CDR used)
19
DVPP
Ground/+5V
ECL/PECL Driver Return (see Table 6B)
20
VPP
Ground/+5V
ECL/PECL Positive Supply (see Table 6B)
21
NSOL
ECL/PECL Input
Loss of Signal -- zeroes serial data in when low; RXBC=TXCK/8
22
VNN
5.2V/Ground
ECL/PECL section power (see Table 6B)
23
NC/CDRFP1*
Analog Output
CDR Loop Filter Pin 1 -- Charge Pump Out (ignored by TQ8105)
24
NC/CDRFP2*
Analog Input
CDR Loop Filter Pin 2 -- VCO Tune (ignored by TQ8105)
25
GND
GND
Core Ground
26
SVDD
+5V
Output Driver Internal Positive Supply
27
VDD
+5V
Core Positive Supply
28
CDRAVDD*
Analog +5V
TQ8106 CDR Analog +5V Supply
(not connected if CDR not used; ignored by TQ8105)
29
VCC
+5V/+3.3V
TTL Driver Positive Supply
30
RxBC
Tristate TTL Out
Demultiplexer Byte Clock
31
DGND
GND
TTL Driver Ground
32
DXSYNC
Tristate TTL Out
Frame Synchronization Signal
33
VCC
+5V/+3.3V
TTL Driver Positive Supply
34
DXD0
Tristate TTL Out
Demultiplexer Data Bit 0 (LSB)
35
DGND
GND
TTL Driver Ground
36
DXD1
Tristate TTL Out
Demultiplexer Data Bit 1
37
VCC
+5V/+3.3V
TTL Driver Positive Supply
38
DXD2
Tristate TTL Out
Demultiplexer Data Bit 2
39
DGND
GND
TTL Driver Ground
40
DXD3
Tristate TTL Out
Demultiplexer Data Bit 3
41
VCC
+5V/+3.3V
TTL Driver Positive Supply
42
DXD4
Tristate TTL Out
Demultiplexer Data Bit 4
43
DGND
GND
TTL Driver Ground
44
DXD5
Tristate TTL Out
Demultiplexer Data Bit 5
45
VCC
+5V/+3.3V
TTL Driver Positive Supply
46
DXD6
Tristate TTL Out
Demultiplexer Data Bit 6
47
DGND
GND
TTL Driver Ground
48
DXD7
Tristate TTL Out
Demultiplexer Data Bit 7 (MSB)
49
SVDD
+5V
Output Driver Internal Positive Supply
50
VDD
+5V
Core Positive Supply
51
NC/CDRGND*
GND
GND for TQ8106 to powerup CDR (ignored by TQ8105)
52
GND
GND
Core Ground
53
FRPWR
TTL Input
Framer Power Control (power on when high)
54
OOF
TTL Input
Out-of-Frame: Initiates Frame Search/Bit Alignment
55
VCC
+5V/+3.3V
TTL Driver Positive Supply
56
LOS
Tristate TTL Output
Loss of Signal (high when > 128 bit periods without transitions)
57
DGND
GND
TTL Driver Ground
Note:
*TQ8106-specific signal
6
TQ8105/TQ8106
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Table 1. Signal Descriptions (continued)
Pin
Signal
Function
Description
58
CLRLOS
TTL Input
Active-high Clear LOS output
59
RLOCK
Tristate TTL Output
Receive Clock meets lock criteria when high
60
LBM1
TTL Input
Loopback Mode Control (see Table 3)
61
GND
GND
Core Ground
62
LBM0
TTL Input
Loopback Mode Control (see Table 3)
63
VDD
+5V
Core Positive Supply
64
NOE
TTL Input
TTL tristate control (active low to enable)
65
GND
GND
Core Ground
66
NRESET
TTL Input
Global Reset (active low)
67
OC3
TTL Input
OC3/OC12 Mode Select
68
MMS
TTL Input
Master/Slave Mode Control
69
CKSRC2
TTL Input
Clock Source Select (see Table 3)
70
CKSRC1
TTL Input
Clock Source Select (see Table 3)
71
CKSRC0
TTL Input
Clock Source Select (see Table 3)
72
PH1
TTL Input
TxBC Phase Select (see Table 3)
73
PH0
TTL Input
TxBC Phase Select (see Table 3)
74
VDD
+5V
Core Positive Supply
75
SVDD
+5V
Output Driver Internal Positive Supply
76
GND
GND
Core Ground
77
MXD0
TTL Input
Multiplexer Data Bit 0 (LSB)
78
MXD1
TTL Input
Multiplexer Data Bit 1
79
MXD2
TTL Input
Multiplexer Data Bit 2
80
MXD3
TTL Input
Multiplexer Data Bit 3
81
MXD4
TTL Input
Multiplexer Data Bit 4
82
MXD5
TTL Input
Multiplexer Data Bit 5
83
MXD6
TTL Input
Multiplexer Data Bit 6
84
MXD7
TTL Input
Multiplexer Data Bit 7 (MSB)
85
VCC
+5V/+3.3V
TTL Driver Positive Supply
86
TxBC
Tristate TTL Out
Transmit Byte Clock
87
DGND
GND
TTL Driver Ground
88
SONETCK
Tristate TTL Out
51.84 MHz Clock Output
89
VCC
+5V/+3.3V
TTL Driver Positive Supply
90
SDHCK
Tristate TTL Out
38.88 MHz Clock Output
91
DGND
GND
TTL Driver Ground
92
LOR
Tristate TTL Out
Indicates Reference Clock is Absent
93
AGND
Analog Ground
VCO Analog Ground
94
FP2
Analog Output
Transmit PLL Loop Filter, Charge Pump Out
95
FP1
Analog Input
Transmit PLL Loop Filter, VCO Tune
96
AVDD
Analog +5V
VCO & Filter Analog VDD Supply
97
VDD
+5V
Core Positive Supply
98
REFCKT
TTL Input
Tx Reference Clock or Bypass Clock
99
GND
GND
Core Ground
100
NC/NCDREN*
TTL Input
Internal Pull-up, Low = CDR receiver clock; Float = Pin 17/18 Rx Clk
(ignored by TQ8105)
Note:*TQ8106-specific signal
TQ8105/TQ8106
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TELECOM
PRODUCTS
Function Description
PLL
The TQ8105 & TQ8106 incorporate high-stability, low-
jitter Phase Locked Loops (PLLs) running at 2488.32
MHz. The PLLs use external surface mounted loop filters
consisting of an RC network as shown in the diagrams
that accompany the values shown in Table 2. Analog
design principles should be applied to the loop filter
portions of the circuit to ensure optimal jitter generation
performance. To reduce cross-coupling of clocks, both
CDR clocks and analog pins should be isolated from the
transmit PLL clock and analog pins. An analog ground
plane under the two capacitors and the resistor, along
with guards around the filter pins is excellent practice, as
is a well-filtered analog supply (AVDD) and a clean
analog ground (AGND). The loop filter values specified in
this preliminary data sheet may change.
Reference clock sourcing can be through a variety of
mechanisms. As shown in Table 3, the MMS pin
determines whether the device operates in Master
mode (where the PLL reference comes in on either a
TTL or PECL/ECL pin), or a Slave mode (where the PLL
reference is derived from the DEMUX high-speed line
clock input). If the external reference clock pins are
used, note that they are logical ORs and that the
unused pin should be tied to (a) GND for unused
REFCKT, or (b) REFCKEN should be tied to VPP for TTL
reference operation. The reference clock frequency can
be selected from any number of values, as indicated in
Table 3. Note that the PLL may be bypassed, allowing
use of an external clock reference.
Internal dividers determine the operating line rate, as
shown in Table 3. The device is capable of operating at
STM1/STS-3 or STM4/STS-12 rates. The transmit PLL
provides high performance and compliance with ITU/
Bellcore requirements found in the first-generation
TQ8101. The TQ8106 receiver's CDR can be disabled
for backwards pin-compatibility with the TQ8105. For
circuits not requiring the TQ8106's CDR, the CDR is
disabled by floating NCDREN (pin 100). Further, the CDR
section of the TQ8106 can be powered down by
disconnecting the CDRGND and CDRAVDD pins, thereby
reducing power consumption. If the TQ8106 CDR is not
used, the CDR filter pins may be left unconnected.
The transmit PLL also provides constant-rate 38.88 MHz
and 51.84 MHz TTL outputs which may be tristated. The
38.88 MHz & 51.84 MHz output may also be achieved by
using high-speed receiver timing in Clock Source Mode
011 (see Table 3).
Framer
The TQ8105 and TQ8106 provide a clean interface to
devices from PMC-Sierra and others. The Out-of-Frame
(OOF) input is a state (level)-initiated event, rather than
the edge-triggered event found on TriQuint's first-
generation TQ8101 transceiver. When OOF is high, the
TQ8105/TQ8106 initiates a frame search for a serial bit
pattern of twelve A1s (three A1s in OC3 mode) followed
by three A2s. If a match occurs, the device realigns
byte boundaries and issues a logic high on the DXSYNC
pin during the third A2. In the absence of OOF, the
device will not realign byte boundaries, but will report
any bit-level matching of twelve A1s (three A1s in OC3
mode) followed by three A2s as a DXSYNC pulse.
Framer circuit power may be switched off by a TTL low on
the FRPWR pin, saving approximately 0.25W. No further
DXSYNC pulses will be issued, though bit alignment is
preserved in the demux. Note that the OOF and FRPWR
pins may be tied together, powering the framer only when
bit realignment is required (this is not recommended
practice, however, due to the inrush currents that may
result).
Loopbacks
As part of the TQ8105 and TQ8106 on-chip diagnostics,
four loopback modes are supported. These are selected
by the dedicated pins LBM0 and LBM1, as shown in
Table 3. The loopback modes are shown in Figure 5.
8
TQ8105/TQ8106
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Functional Description (continued)
Enhanced Diagnostics
The TQ8105 and TQ8106 incorporate on-chip clock
diagnostics, allowing fast, efficient fault detection and
isolation at the systems level.
The LOR (Loss Of Reference) output goes high when the
reference clock is absent. Note that this signal is not
latched and is only high when the reference clock is
missing. A reference clock is required for the TQ8106
CDR to function correctly.
The NSOL (Loss-of-signal input, active low, PECL/ECL
level) input allows the receiver to force zeroes onto the
demux outputs. A TTL-level signal may also be used for
NSOL if the resistor network, shown in the applications
section of this data sheet, is used. NSOL is useful when a
Loss Of Signal occurs on the receive optics, and a
quieting of invalid data is desired. The receiver is clocked
from the transmit clock when NSOL is active, and the
output RXBC clock is obtained from the transmit portion
of the TQ8105/TQ8106. This ensures compatibility with
devices, such as the PMC-Sierra S/UNI-622 and STTX
components, which may contain dynamic registers that
lose contents if clocks are removed. NSOL forces the
CDR to lock on REFCLK, except when in slave mode.
The LOS (Loss Of Signal) output goes high whenever
128-bit periods occur without transitions on the data
input to the demux. CLRLOS forces LOS low.
The RLOCK (Receiver LOCK) output goes low whenever the
signal on RXCK or the recovered clock drifts more than
500 ppm from the reference frequency. This output returns
high whenever the frequency accuracy is within 100 ppm.
Demux
The TQ8105/TQ8106 demultiplexer converts an NRZ
PECL/ECL data input, at either 155 Mb/s or 622 Mb/s,
and its corresponding PECL/ECL clock into a byte-parallel
78 MHz or 19 MHz tristatable TTL data bus. The timing is
shown in Figures 6 through 8. See the previous "Framer"
description for bit alignment details. The TQ8106 can
recover both clock and data from a NRZ data stream,
whereas the TQ8105 requires NRZ data and a recovered
clock.
Mux
The TQ8105/TQ8106 multiplexer converts a 78 MHz or
19 MHz byte-wide bus to a serial NRZ PECL/ECL data
stream. The bytes are clocked into the device with the
TXBC byte clock output. The timing is shown in Figures
6 through 8. Note that the TXBC output can be adjusted
in 90-degree phase increments to accommodate
variations in interface requirements. See Table 3 for
settings on the PH0 and PH1 pins controlling this
function. Data may also be clocked into the TQ8105/
TQ8106 by a 77 MHz reference, oscillator-clock source,
provided the data is within the timing limits shown in the
timing diagram labelled "Reference Clock Based
Transmit Timing." The TQ8105 and TQ8106 do not
require the transmit latch found on earlier TQ8101
reference designs and are backwards compatible with
designs that have the latch incorporated.
High-Speed I/O and TTL Interfaces
The TQ8105/06P will operate with either PECL or ECL
operation on the high-speed I/O. With a single +5V
supply, the part interfaces directly with TTL and PECL
(Positive Emitter Coupled Logic). By providing an
additional -5.2V supply, the device's high-speed I/O
becomes ECL, instead of PECL. The TQ8105/06S is
designed only for PECL high-speed I/0 operation with a
single +5V supply. The power supply connections for
PECL and ECL are shown in Table 6B.
The TTL outputs (Vcc) may be connected to either +5V or
+3.3V supplies. True TTL may be obtained with the +5V
connection; clamped operation, when connected to +3.3V,
ensures that maximum Voh levels do not exceed +3.3V.
TQ8105/TQ8106
9
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TELECOM
PRODUCTS
TQ8105/TQ8106 Design Notes
These design notes are provided to assist the circuit
designer in achieving the highest possible performance
while reducing design time. Unless noted otherwise,
references to the TQ8105 apply equally to the TQ8106.
Interfacing to PMC-Sierra Devices
The transmit timing of the TQ8105 is such that the
PMC-Sierra byte outputs (POUT(0:7)) may be directly
connected to the TQ8105 mux inputs (MXD(0:7)). The
TQ8105 uses an Out-Of-Frame (OOF) input as a signal
to reframe while high, allowing direct connection of the
PM5355's OOF output to the TQ8105 OOF input. The
following summarizes connectivity between the devices.
PM5355
TQ8105/TQ8106
POUT(0:7)
MXD(0:7)
PIN(0:7)
DXD(0:7)
OOF
OOF
PICLK
RXBC
FPIN
DXSYNC
TCLK
TXBC
POP(0:5)
Any TQ8105 modes to be programmable
PIP(0:3)
Any TQ8105 diag outputs to be readable
Reference Design
A reference design (see Figure 4) and evaluation board
are available from TriQuint. They incorporate a 1x9 or
2x9 fiber optic transceiver (with the option of clock
recovery), the PM5355 PMC Sierra framer device, and
a TQ8105 or TQ8106.
Thermal Considerations
Figure 9 shows the region where the use of a heatsink is
not required. For example, the TQ8105 does not require
a heatsink for ambient temperatures up to 55
C in still
air. An airflow of 100 LFPM raised this temperature to
approximately 75
C, eliminating heatsink requirements.
In applications requiring a heatsink, a standard pin-fin
heat-sink is appropriate. To attach the sink, use spring
clips soldered to the board to cross and hold the
heatsink. The clip holes in the board are at the corners of
a 1.275" x 1.5" rectangle. Another alternative is the
circular heatsink, #2288B from Thermalloy attached with
their Thermattach #19686-3.
Power Supplies
Good decoupling practices should be observed, with a
0.1 uF decoupling capacitor at each supply pin, ideally
on the component side of the board. Keep the analog
supplies (Vdd and AVdd) pristine. Proper design will
isolate the supply groups using point grounding to tie
supplies together (
all
grounds at a single point having
multiple vias).
For the analog supply, flood copper under the loop filter
on the component side of the board, tying the flood to
the analog ground pin, with the point ground away from
the filter and analog pin, so that any switching currents
are kept away from these areas. If any switching,
power-supply frequencies below 500 kHz are used in
the system, use a supply filter on the analog supply pin.
These practices help minimize the generation of jitter.
High-Speed Connections
Connections to E/O modules (and clock reference, if
used) are direct-coupled PECL and need to be terminated
with decoupled 50 ohms to 3V at the receiving end of the 50
ohm transmission line. Ensure that each 50 ohm resistor
(or Thevenin equivalent) has its own decoupling
capacitor. Place the resistor at the end of a 50 ohm
transmission line (use a controlled impedance layer),
ideally with a minimal-length stub attached to either the
resistor or the receiving device.
If there is no room for the resistor, use a minimal-
length stub to drop the signal at the receiving device
pins, continue the 50 ohm transmission line to an area
where the termination resistors can be placed, and
terminate at the endpoint of that line. If in doubt,
contact factory applications for assistance.
10
TQ8105/TQ8106
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
10
0.1u
gnd_s
330
220
VDD
gnd_s
VDD
gnd_s
330
220
PIN0
148
PIN1
147
PIN2
146
PIN3
145
PIN4
144
PIN5
143
PIN6
142
PIN7
141
FPIN
149
FPOS
150
PICLK
137
TLAIS
88
TSD
103
TSOW
94
TSUC
93
TLRDI
89
TLD
91
TLOW
92
TTOH1
86
TTOH2
85
TTOH3
84
TTOH4
83
TTOHEN
101
TPOH
82
TPOHEN
77
TPAIS
73
TPRDI
72
RSICLK
139
RSIN
140
TSICLK
104
TFCLK
65
XOFF
63
TSOC
60
TXPRTY0
58
TXPRTY1
59
TWRENB
61
TDAT0
42
TDAT1
43
TDAT2
44
TDAT3
45
TDAT4
46
TDAT5
47
TDAT6
48
TDAT7
49
TDAT8
50
TDAT9
51
TDAT10
52
TDAT11
53
TDAT12
54
TDAT13
55
TDAT14
56
TDAT15
57
RRDENB
186
RFCLK
190
TSEN
192
TGFC
62
D0
23
D1
24
D2
25
D3
26
D4
31
D5
32
D6
33
D7
34
A0
15
A1
16
A2
17
A3
18
A4
19
A5
20
A6
21
A7
22
ALE
14
CSB
36
WRB
37
RDB
38
RSTB
35
TCK
70
TMS
126
TDI
127
TDO
71
TRSTB
125
FPOUT
123
POUT0
122
POUT1
121
POUT2
116
POUT3
115
POUT4
114
POUT5
113
POUT6
112
POUT7
111
OOF
164
LOF
163
LOS
169
TSDCLK
102
TOWCLK
95
RSDCLK
159
RSD
160
ROWCLK
168
RSOW
162
RSUC
161
OHFP
175
LAIS
171
LRDI
170
RLDCLK
173
RLD
172
RLOW
167
TLDCLK
90
RTOH1
156
RTOH2
155
RTOH3
154
RTOH4
153
RTOHCLK
157
RTOHFP
158
TTOHCLK
99
TTOHFP
100
RPOH
181
RPOHCLK
176
RPOHFP
177
TPOHCLK
75
TPOHFP
76
LOP
178
PAIS
182
PRDI
185
TSOUT
124
GTOCLK
87
GROCLK
174
LCD
188
RSOC
195
RXPRTY0
196
RXPRTY1
197
RDAT0
198
RDAT1
199
RDAT2
200
RDAT3
201
RDAT4
202
RDAT5
203
RDAT6
204
RDAT7
1
RDAT8
2
RDAT9
3
RDAT10
4
RDAT11
5
RDAT12
6
RDAT13
7
RDAT14
8
RDAT15
9
RCA
194
TCA
67
RCP
187
RGFC
193
TCP
68
POP0
135
POP1
134
POP2
133
POP3
132
POP4
131
POP5
130
PIP0
108
PIP1
107
PIP2
106
PIP3
105
INTB
39
V
D
D
_
A
C
1
1
0
V
D
D
_
A
C
2
2
7
V
D
D
_
A
C
3
8
1
V
D
D
_
A
C
4
1
2
0
V
D
D
_
A
C
5
1
5
2
V
D
D
_
A
C
6
1
8
3
V
D
D
_
A
C
7
2
0
5
V
D
D
_
D
C
1
1
1
V
D
D
_
D
C
2
2
8
V
D
D
_
D
C
3
4
0
V
D
D
_
D
C
4
6
6
V
D
D
_
D
C
5
8
0
V
D
D
_
D
C
6
9
8
V
D
D
_
D
C
7
1
1
0
V
D
D
_
D
C
8
1
1
9
V
D
D
_
D
C
9
1
2
9
V
D
D
_
D
C
1
0
1
3
8
V
D
D
_
D
C
1
1
1
6
5
V
D
D
_
D
C
1
2
1
7
9
V
D
D
_
D
C
1
3
1
8
9
V
D
D
_
D
C
1
4
2
0
6
T
C
L
K
9
7
T
F
P
7
4
V
S
S
_
A
C
1
1
3
V
S
S
_
A
C
2
3
0
V
S
S
_
A
C
3
7
8
V
S
S
_
A
C
4
1
1
7
V
S
S
_
A
C
5
1
5
1
V
S
S
_
A
C
6
1
8
4
V
S
S
_
A
C
7
2
0
8
V
S
S
_
D
C
1
1
2
V
S
S
_
D
C
2
2
9
V
S
S
_
D
C
3
4
1
V
S
S
_
D
C
4
6
4
V
S
S
_
D
C
5
7
9
V
S
S
_
D
C
6
9
6
V
S
S
_
D
C
7
1
0
9
V
S
S
_
D
C
8
1
1
8
V
S
S
_
D
C
9
1
2
8
V
S
S
_
D
C
1
0
1
3
6
V
S
S
_
D
C
1
1
1
6
6
V
S
S
_
D
C
1
2
1
8
0
V
S
S
_
D
C
1
3
1
9
1
V
S
S
_
D
C
1
4
2
0
7
N
C
6
9
6
9
U?
S/UNI 622
VDD
gnd_s
VDD
8
1
4
1
7
U?
77.76M Osc
gnd_s
0.1u
MXD0
77
MXD1
78
MXD2
79
MXD3
80
MXD4
81
MXD5
82
MXD6
83
MXD7
84
OOF
54
DXD0
34
DXD1
36
DXD2
38
DXD3
40
DXD4
42
DXD5
44
DXD6
46
DXD7
48
DXSYNC
32
RXBC
30
TXBC
86
REFCKT
98
REFCKEP
6
REFCKEN
5
RXDP
15
RXDN
14
RXCKP
17
RXCKN
18
NSOL
21
PH0
73
PH1
72
CKSRC0
71
CKSRC1
70
CKSRC2
69
LBM0
62
LBM1
60
MMS
68
OC3
67
CLRLOS
58
FRPWR
53
NOE
64
NRESET
66
LOR
92
FP1
95
FP2
94
AVDD
96
AGND
93
NCI_1
100
NCI_5
51
NCI_4
28
NCI_3
24
NCI_2
23
LOS
56
RLOCK
59
G
N
D
_
1
2
5
G
N
D
_
2
5
2
G
N
D
_
3
6
1
G
N
D
_
4
6
5
G
N
D
_
5
7
6
G
N
D
_
6
9
9
D
G
N
D
_
1
3
1
D
G
N
D
_
2
3
5
D
G
N
D
_
3
3
9
D
G
N
D
_
4
4
3
D
G
N
D
_
5
4
7
D
G
N
D
_
6
5
7
D
G
N
D
_
7
8
7
D
G
N
D
_
8
9
1
V
D
D
_
1
2
7
V
D
D
_
2
5
0
V
D
D
_
3
6
3
V
D
D
_
4
7
4
V
D
D
_
5
9
7
S
V
D
D
_
1
2
6
S
V
D
D
_
2
4
9
S
V
D
D
_
3
7
5
V
C
C
_
1
2
9
V
C
C
_
2
3
3
V
C
C
_
3
3
7
V
C
C
_
4
4
1
V
C
C
_
5
4
5
V
C
C
_
6
5
5
V
C
C
_
7
8
5
V
C
C
_
8
8
9
V
N
N
_
1
1
V
N
N
_
2
2
2
SDHCK
90
SONETCK
88
V
P
P
_
1
3
V
P
P
_
2
2
0
DVPP_1
4
DVPP_2
7
DVPP_3
10
DVPP_4
13
DVPP_5
16
DVPP_6
19
TXDP
12
TXDN
11
TXCKP
9
TXCKN
8
U?
TQ8105
VDD
1uH
1uH
gnd_s
gnd_s
gnd_s
VDD
0.1u
0.1u
10u
0.1u
0.1u
VDD
gnd_s
REFCLK
1
LCKREFN
2
T
X
V
C
C
1
3
R
X
V
C
C
1
4
R
X
V
E
E
1
8
T
X
V
E
E
1
0
TD
11
TDN
12
SD
15
CLKN
3
CLK
4
RDN
16
RD
17
U?
HFBR5207
82
130
82
0.1u
gnd_s
VDD
*Note 1
130
UTOPIA
*Note 4
VDD
330
330
330
gnd_s
VDD
VDD
*Note 2
*330
*330
*330
*330
gnd_s
*Note 3
330
VDD
VDD
gnd_s
VDD
4.7K
*0
gnd_s
0.1u
R1
10u
C1
C2
gnd_s
gnd_s
1uH
gnd_s
VDD
0.1u
VDD
1uH
0.1u
R2
C4
10u
10u
0.1u
C3
Note: See Tables 2A & 2B
for loop filter values.
gnd_s
VDD
2K
2K
82
82
82
82
VDD
20K
*Note 1
470
470
470
gnd_s
Notes:
1) Place termination networks as close to
their respective input pins as possible.
2) Setting of PH(0:1) is board-layout dependent.
These 4 resistors are used as placeholders
for the appropriate strapped settings that
are determined at initial board evaluation.
(See Table 3 and associated text.)
3) Install 0-ohm resistor for TQ8106 operation.
4) May use SONETCK (51.84MHz) for
UTOPIA bus clock.
gnd_s
VDD
NLOCKED
LOS
LOR
130
130
0.1u
130
130
gnd_s
gnd_s
10u
VDD
TQ8105 Decoupling
0.1u
gnd_s
(Decoupling not shown for PM5355)
*Only connections pertinent to the TQ8105/06
to S/UNI overhead processor chip are shown.*
10u
0.1u
0.1u
10u
0.1u
0.1u
0.1u
0.1u
VDD
VDD
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
gnd_s
gnd_s
gnd_s
Reset
gnd_s
47u
gnd_s
10K
VDD
330
Figure 4. Reference Design Schematic
TQ8105/TQ8106
11
PRODUCTS
PRELIMINARY DATA SHEET
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TELECOM
PRODUCTS
Table 2B. TQ8106 Recommended CDR Loop Filter Values
(Preliminary)
Incoming
Resistor
Capacitor
Capacitor
NRZ Data Rate
Value R2
Value C3
Value C4
(Mbs)
(ohms)
(
F)
(pF)
155.52
470
1.0
39
622.08
680
4.7
39
RXD
DXD
TXD
TXCK
RXBC
MXD
Normal
Equipment
RXD
DXD
RXBC
MXD
RXCK
TXCK
TXCK
TXCK
TXD
TXD
TXD
MXD
DXD
RXD
RXD
DXD
RXCK
RXCK
Split
Facility
MXD
RXBC
RXCK
Figure 5. Loopback Modes
Table 2A. TQ8105/TQ8106 Recommended Transmit Loop Filter Values (Preliminary)
Reference
Resistor
Capacitor
Capacitor
Frequency
Divide
Value R1
Value C1
Value C2
(MHz)
Ratio
(ohms)
(
F)
(pF)
19.44
32
1200
0.082
82
38.88
16
620
0.15
150
51.84
12
470
0.22
220
77.76
8
300
0.33
330
155.52*
4
300
0.33
330
Note: *Internal divide by two on Reference
CDRFP2
CDRFP1
CDRAVDD
AVDD
FP2
FP1
C2
C1
R1
C3
R2
C4
12
TQ8105/TQ8106
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
Table 3. Mode Selection
Signals
Mode
LBM(1:0)
Loopback: 00 = Normal, 01 = Equipment, 10 = Facility, 11 = Split
PH(1:0)
00 = 0 degrees delay, 01 = 90 degrees delay, 10 = 180 degrees delay, 11 = 270 degrees delay
MMS
1 = Master (use REFCKT/E as reference), 0 = Slave (use receive clock as reference)
CKSRC(2:0)
Clock Source:
000 = PLL bypass
001 = 51.84 MHz PLL reference, SONETCK & SDHCK tristate
010 = 155.52 MHz PLL reference
011 = 51.84 MHz PLL reference, SONETCK=8, SDHCK derived from receiver timing
100 = 77.76 MHz PLL reference
101 = 51.84 MHz PLL reference
110 = 38.88 MHz PLL reference
111 = 19.44 MHz PLL reference
OOF
1 = Initiate frame search, 0 = Do not permit reframing (see FRPWR pin in Table 1)
NSOL
1 = Pass receive data, 0 = Force receive data to 0
OC3
1 = Operate at STM1/STS-3 (or PLL bypass divided by 4), 0 = Operate at STM4/STS-12/PLL bypass
NRESET
1 = Normal operation, 0 = Reset internal counters
NCDREN
1 = TQ8105/CDR Off mode, 0 = Enable CDR (TQ8106 only)
Table 4. Absolute Maximum Ratings
Parameter
Symbol
Level
Minimum
Maximum
Unit
Positive supply
V
CC,
V
PP
, V
DD,
AV
DD
GND
7
V
Negative supply (V
PP
= 0 V)
V
NN
7
GND
V
Output voltage
V
O
ECL/PECL
V
NN
0.5
V
PP
+0.5
V
Output current
I
O
ECL/PECL
--
40
mA
Input voltage
V
I
ECL/PECL
V
NN
0.5
V
PP
+0.5
V
Input current
I
I
ECL/PECL
1
1
mA
Output voltage
V
O
TTL
0.5
V
CC
+0.5
V
Output current
I
O
TTL
--
100
mA
Input voltage
V
I
TTL
0.5
V
CC
+0.5
V
Input current
I
I
TTL
1
1
mA
Biased junction temperature
T
J
--
55
+150
C
Storage temperature
T
S
--
65
+150
C
TQ8105/TQ8106
13
PRODUCTS
PRELIMINARY DATA SHEET
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TELECOM
PRODUCTS
Table 6A. Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Positive supply
V
PP
4.75
5.0
5.25
V
Output driver positive supply
V
CC
3.0
5.25
V
Negative supply (ECL mode only)
V
NN
5.5
5.2
4.75
V
Operating case temperature (see Figure 9)
40
125
C
Table 6B. Power Supply Connections
Pin
+5V TTL/PECL I/O
+3.3V TTL/PECL I/O
+5V TTL/ECL I/O
+3.3V TTL/ECL I/O
VDD
+5V
+5V
+5V
+5V
SVDD
+5V
+5V
+5V
+5V
VCC
+5V
+3.3V
+5V
+3.3V
AVDD
Filtered +5V
Filtered +5V
Filtered +5V
Filtered +5V
CDRAVDD
Filtered +5V
Filtered +5V
Filtered +5V
Filtered +5V
GND
0V (ground)
0V (ground)
0V (ground)
0V (ground)
AGND
0V (ground)
0V (ground)
0V (ground)
0V (ground)
CDRGND
0V (ground)
0V (ground)
0V (ground)
0V (ground)
VPP/DVPP
+5V
+5V
0V (ground)
0V (ground)
VNN
0V (ground)
0V (ground)
-5.2V
-5.2V
Table 5. Power Consumption
Symbol
Function
Minimum
Typical
Maximum
Unit
I
DD
+5V supply
--
0.323
TBD
I
I
CC
+5V / +3V supply
--
0.016
TBD
I
I
PP
+5V / 0V supply
--
0.055
TBD
I
I
ADD
+5V supply
--
0.018
TBD
I
P
DF
Power dissipation, Framer on, TQ8106 CDR off
--
1.9
2.3
W
P
D
Power dissipation, Framer off, TQ8106 CDR off
--
1.7
2.1
W
P
Power dissipation, Framer on, TQ8106 CDR on
2.75
W
14
TQ8105/TQ8106
PRELIMINARY DATA SHEET
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Table 8. DC Characteristics--TTL I/O
(Specifications apply over recommended operating ranges)
Parameter
Condition
Symbol
Minimum
Nominal
Maximum
Unit
Input HIGH voltage
V
IH
2.0
--
V
CC
V
Input LOW voltage
V
IL
0
--
0.8
V
Input HIGH current
V
IH(MAX)
I
IH
--
--
200
uA
Input LOW current
V
IL(MIN)
I
IL
400
200
--
uA
Output HIGH voltage
I
OH
= 50 mA
V
OH
2.4
--
V
CC
V
Output LOW voltage
I
OL
= 20 mA
V
OL
0
--
0.4
V
Tristate current
I
OZ
100
--
100
uA
Input capacitance
C
IN
--
--
TBD
pF
Output capacitance
C
OUT
--
--
TBD
pF
ESD breakdown rating
(Design objective)
V
ESD
Class I
--
--
Table 7. DC Characteristics--ECL/PECL I/O
(Specifications apply over recommended operating ranges).
Parameter
Condition
Symbol
Minimum
Nominal
Maximum
Unit
Internal ECL reference
Single-ended inputs
V
REF
--
0.26 V
NN
+ 0.74 V
PP
mV
Common mode voltage
Differential inputs
V
COM
V
PP
1500
--
V
PP
1100
mV
Differential voltage
Differential inputs
V
DIFF
200
--
1200
mV
Input HIGH voltage
V
REF
= 1300 mV
V
IH
V
PP
1050
--
V
PP
400
mV
Input LOW voltage
V
IL
V
TT
--
V
PP
1550
mV
Output HIGH voltage
R
LOAD
= 50 ohms
V
OH
V
PP
1000
V
PP
600
mV
to V
TT
= V
PP
2.0V
Output LOW voltage
R
LOAD
= 50 ohms
V
OL
V
TT
--
V
PP
1600
mV
to V
TT
= V
PP
2.0V
Input HIGH current
V
IH(MAX)
I
IH
--
+130
335
uA
Input LOW current
V
IL(MIN)
I
IL
265
130
--
uA
Output HIGH current
(Not tested; consistent
I
OH
20
23
30
mA
with V
OH
and V
OL
tests)
Output LOW current
(Not tested; consistent
I
OL
0
5
8
mA
with V
OH
and V
OL
tests)
Input capacitance
C
IN
--
--
TBD
pF
Output capacitance
C
OUT
--
--
TBD
pF
ESD breakdown rating
(Design objective)
V
ESD
Class I
--
--
Note: V
TT
= V
PP
-2.0V
TQ8105/TQ8106
15
PRODUCTS
PRELIMINARY DATA SHEET
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TELECOM
PRODUCTS
Table 9. AC Characteristics
(Specifications apply over recommended operating ranges)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RXCK clock period
T
C(RXCK)
1.6
--
--
ns
REFCKE clock period
T
C(REFCKE)
1.6
--
--
ns
TXCK clock period
T
C(TXCK)
1.6
--
--
ns
REFCKT clock period
T
C(REFCKT)
12.8
--
--
ns
TXBC clock period
T
C(TXBC)
12.8
--
--
ns
RXBC clock period
T
C(RXBC)
12.8
--
--
ns
REFCKT/REFCKE clock duty cycle
T
C(REF)
40
--
60
%
REFCKT to TXBC skew
2,3,5
T
SK(TXBC)
TBD
TBD
SONETCK clock period
T
C(SONETCK)
--
19.29
--
ns
RXBC clock duty cycle
3,5
T
DC(RXBC)
40
50
60
%
TXBC clock duty cycle
3,5
T
DC(TXBC)
40
50
60
%
TXCK clock duty cycle
6
T
DC(TXCK)
40
50
60
%
SONETCK clock duty cycle
3,5
T
DC(SONETCK)
40
50
60
%
SDHCK clock duty cycle
3,5
T
DC(SDHCK)
40
50
60
%
RXCK clock duty cycle
6
T
DC(RXCK)
40
50
60
High-speed rise/fall time
4
(> 79 MHz), Data
T
H(R/F)
--
--
500
ps
High-speed rise/fall time
4
(>79 MHz), Clock
T
H(R/F)
--
--
320
ps
Low-speed rise/fall time
1,3,5
(< 79 MHz)
T
L(R/F)
--
--
3
ns
RXD setup time to RXCK
6
(see Figure 6)
T
S(RXD)
240
--
--
ps
RXD hold time to RXCK
6
(see Figure 6)
T
H(RXD)
20
--
--
ps
OOF rising edge before A1 changes to A2
7
T
(OOFH)
51.44
--
--
ns
(see Figure 8)
DXSYNC rising edge from parallel data output
T
(DSYNC)
--
25.72
--
ns
change from A1 to A2
7
DXSYNC pulse width
3,5,7
(see Figure 8)
T
(DXSYNCPW)
11.0
--
--
ns
RXBC falling edge to valid parallel data output
3
T
P(DXD)
0.5
1.0
ns
(see Figure 7)
MXD(0:7) setup time to TXBC
2,3,5
(see Figure 6)
T
S(MXD)
600
--
--
ps
MXD(0:7) hold time to TXBC
2,3,5
(see Figure 6)
T
H(MXD)
600
--
--
ps
TXCK falling edge to TXD
6
(see Figure 7)
T
P(TXD)
200
--
400
ps
220
330
18pF
Vcc
Notes: 1. At 0.8V/2.0V
levels
2. With PH(1:0) set to 00, 18pF total loading
3. TTL outputs test load (V
CC
= +5V):
4. 20%/80%
levels
5. At 1.4V logic threshold level
6. Differential measurement
7. OC12 mode
16
TQ8105/TQ8106
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
TXCK
TXD
T
P(TXD)
RXBC
DXD(7:0)
T
P(DXD)
DXSYNC
T
P(DXSYNC)
Figure 7. Output Timing
Figure 6. Input Timing
RXCKP
RXD
T
S(RXD)
T
H(RXD)
TXBC
MXD(7:0)
T
S(MXD)
T
H(MXD)
TQ8105/TQ8106
17
PRODUCTS
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
TELECOM
PRODUCTS
Figure 8. Demultiplexer Timing
OOF
DXSYNC
RXD
RXBC
DXD(7:0)
RXCK
RXBC Resync
T
(DXSYNCPW)
T
(OOFH)
A1
#1
A1
#2
A1
#
n
A2
#1
A2
#2
A2
#3
A1
#
n
-2
A1
#
n
-1
A1
#
n
A2
#1
A2
#2
A2
#3
Figure 9. Required Airflow for Operation without Heatsink
100
90
80
70
60
50
40
30
0
100
200
300
400
500
600
TQ8105
TQ8106
Required airflow (LFPM)
Maximum ambient air temperature (C)
18
TQ8105/TQ8106
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
.25
2
1
N
1
1
1
L
A
D
D
E
E
A
A
A
e
b
A1
Standoff
.17 max.
A
B
D
S
D
S
A-B
C
M
ddd
Lead Coplanarity
Exposed Heatsink
6.86
.50 dia.
Heatsink Intrusion
.0127 max.
C
Seating
Plane
C
ccc
Figure 10. Mechanical Package (100 pins, 14 x 14 mm)
Package
Package "P"
1
Package "S"
Dimension
Value
2
Value
2
A
2.35
1.7 max
A
1
0.25 max
0.10
A
2
2.00
1.40
D
17.20
0.25
16.00
0.4
D
1
14.00
14.00
E
17.20
0.25
16.00
0.4
E
1
14.00
14.00
L
0.88 +0.15/0.10
0.50
0.20
b
0.22
0.18
e
0.50
0.50
N
100 pins
100 pins
Notes: 1. Not recommended for new designs.
2. All dimensions in millimeters (mm).
TQ8105/TQ8106
19
PRODUCTS
PRELIMINARY DATA SHEET
For additional information and latest specifications, see our website: www.triquint.com
TELECOM
PRODUCTS
Ordering Information
TQ8105P
SONET/SDH Transceiver, PECL/ECL I/O
TQ8106P
SONET/SDH Transceiver w/CDR, PECL/ECL I/O
TQ8105S
SONET/SDH Transceiver, PECL I/O
TQ8106S
SONET/SDH Transceiver w/CDR, PECL I/O
Reference Designs
The following products are available for 14-day loan to qualified customers:
ATM SONET/SDH Line Interface Module (SLIM)
Supports OC12c/STM-4 (622.08 Mbps) and OC-3c/STM-1 (155.52 Mbps)
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or
omissions. TriQuint assumes no responsibility for the use of this information, and all such information
shall be entirely at the user's own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright 1998 TriQuint Semiconductor, Inc. All rights reserved.
Revision 0.3.A
July 1998
Additional Information
For latest specifications, additional product information,
worldwide sales and distribution locations, and information about TriQuint:
Web: www.triquint.com
Tel: (503) 615-9000
Email: sales@tqs.com
Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: applications@tqs.com
SLIM Documentation Package
Functional Partition Drawing Set, including
block, state machine, and timing diagrams
Schematics
Programmable Logic Listings
User's Manual / Product Specification
PCB Artwork (all layers)
Component Placement Drawing