I Q

S E M I C O N D U C T O R , I N C .

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

The TQ8223 is a multi-configuration SONET/SDH OC48/STM16 CDR/
DEMUX that regenerates and re-times serial 2.48832 Gb/s data. It
recovers the 2.48832 GHz clock from the data stream and frequency
divides it to generate control signals and clocks used to perform the
demultiplexing function.

The TQ8223 is extremely flexible for telecom, ATM and networking
applications. The serial 2.48832 Gb/s data stream is demultiplexed into a
32-bit wide 77.76 MHz TTL data bus. Internal data inversion is also

available. The device generates byte-wise parity check bits for the
demultiplexed data and provides associated clock outputs for the different
modes. Parity checking is not required for normal device operation.

The TQ8223 provides added flexibility through a selectable internal/external
Voltage Controlled Oscillator(VCO) as well as a selectable internal Phase
Locked Loop (PLL). If an external high frequency clock is utilized a single-
ended or differential AC coupled clock may be used.

The internal PLL contains a NRZ phase detector which enables it to adjust

the phase of the internal clock such that sampling of the incoming data

stream occurs in the middle of the the data eye. An offset control allows
adjustment

125 pS around this nominal position.

Operating from a single +5V supply, the TQ8223 provides fully compliant
functionality and performance.

The TQ8223 is fully compliant with SONET/SDH jitter tolerance and

transfer specifications. A TTL level LOCK signal is supplied to indicate

when the frequency difference between the internal 38.88 MHz clock and

the external 38.88 MHz clock is less than 488 ppm.

OC48/STM16
DEMUX/CDR
with Differential Input

Features

· Single-chip 1:32 Demultiplexer

with integrated clock and data
recovery

· Differential Analog Data Input

· SONET/SDH compliant for

2.48832 Gb/s jitter tolerance &
transfer

· Internal PLL with NRZ phase

detector ensures sampling of
incoming data stream occurs in
center of data eye

· Static phase adjustment on

recovered clock position

· High speed input data bit slipper

for use in framing

· External RC-based loop filter

· Four output clock rates at

311.04, 155.52, 77.76, and 38.88
MHz.

· Internal byte-wise even/odd

parity bit generator (mode
programable)

· Direct-coupled TTL low-speed

outputs

· 23mm 208-pin BGA package

· 5V single supply

· 40 to +125

C case operating

temperature.

TQ8223

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Function Description

Data Regeneration

The TQ8223 recovers and regenerates serial 2.48832
Gb/s data received at DIN and NDIN. The data recovery
can be optimized by adjusting the input data re-timing
clock phase at PHADJ. The PHADJ range is 2.5 +/-
0.5V. This corresponds to a centered sampling point
when PHADJ is 2.5V and a -128 pS or +128 pS offset
for 3V and 2V repectively. PHADJ must be externally
supplied. See the figure below.

The regenerated data is then re-synchronized by re-
timing it with the active 2.48832 GHz clock. (Negative
edge triggered sampling is used.)

The regenerated data can be inverted by tying the
DATINV pin to VEE.

Bit Slipper

The TQ8223 can slip a bit on the incoming data stream.
An active low PECL pin, SLIP, causes the TQ8223 to
skip over one incoming data bit. This can be done for
framing purposes.

Timing Generation

The TQ8223 can receive an external 2.48832 GHz
(nominal) reference clock or generate a 2.48832 GHz
clock through an internal VCO. The output of the active

clock can be monitored at HKCOUT which provides a
30mV

output.

Internal Clock VCO and PLL

Figure 8 contains a reference diagram of operation with

the internal clock and PLL. The internal clock is
selected if the CLKSEL is tied to VDD and the external

LOCK Signal Hysteresis

Clock Freq. Difference

LOCK

HIGH

LOW

488ppm

30ppm

122ppm

2.5V

0pS

2.0V

128pS

3.0V

-128pS

Time

PHADJ

PHADJ Operation

power supply pin, VOSC, is tied to VDD. CLKIN must be
tied to VEE through a 10k

resistor when the internal

clock is used.

The internal PLL is comprised of a NRZ phase detector,

a charge pump, and the internal VCO. This NRZ phase

detector's phase error signals are integrated by the

Charge Pump block which then provides a VCO tune

voltage at VTUNEO. See Table 5 for loop filter values.

The internal PLL is completed by connecting VTUNEO

to VTUNE. The purpose of the internal PLL is to adjust

the phase of the internal VCO such that the negative

edge of the internal sampling clock is in the center of

the data eye. A phase offset can be added by adjusting

the PHADJ input voltage. A 38.88 MHz PECL clock

must be provided at HINTCLK to aid PLL acquisition.

The internal PLL provides an active high LOCK signal if

the frequency difference between the internal VCO and

the 38.88 MHz hint clock remains less than 488 ppm. If

the frequency difference becomes greater than 488

ppm then the LOCK signal deasserts low. The LOCK

signal will assert high when the frequency difference is

less then 122 ppm or 30 ppm. This hysteresis set point

is programmable and is determined by PPMSEL. When

PPMSEL is tied to VEE the LOCK set point is 30 ppm,

when PPMSEL is tied to VDD the LOCK set point is 122

ppm.

TQ8223

PRELIMINARY DATA SHEET

External Clock VCO and PLL

The received clock can be either single-ended or
differential and is an AC coupled input on CKIN and
NCKIN. The external clock is selected as the active
clock if CLKSEL is tied to VEE. VOSC and VTUNE must
be tied to VEE when using an external VCO. If the
external clock is single ended the unused input must be
externally terminated through a capacitor to an AC
ground. The internal NRZ phase detector generates

Figure 2. PLL and Lock Detector Block Diagram

PLLVDD

VTUNE

VTUNEO

VCO

VOSC

HCKOUT

CLOCK

DIVIDER

LOCK

DETECT

CK38

HINTCLK

(N)DIN

LOCK

DOWN

CHARGE

PUMP

PHASE

DETECT

PHASE

FREQ

DETECT

LOCKREF

2 : 1

PHREF and DCREF which, when connected to an
external integrator, may be used to tune the external
VCO.

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Internal Clock VCO and External PLL

See Figure 9 for a reference diagram of operation with

the internal clock and external PLL. PHREF and DCREF
must be connected to an external integrator. The output
of the integrator is then connected to VTUNE,
completing the PLL.

Output Clocks

The TQ8223 provides an internal Clock Divider which

frequency divides the active 2.48832 GHz clock

(internal or external source as selected by CLKSEL).

The output of the Clock Divider supplies the internal

clock signals necessary for the re-timing function and

demultiplexing function. Clock Divider block also

outputs four external clocks: a differential 311.04 MHz

PECL clock at CK311 and NCK311, a 155.52MHz PECL

clock at CK155, a 77.76 MHz TTL clock at CK78T, and a

38.88 MHz PECL clock at CK39. Note that the clock

frequencies given above are dependant upon using the

part at 2.48832 GHz.

Data Demultiplexer and Parity Generator

The TQ8223 can be configured to run in one of two

modes. The demultiplexing modes are set by fixing the

MODE1 and MODE0 package pins according to the

following table.

MODE1

MODE0

Demultiplexing Mode

VEE

N.C.

1:32

VEE

ALL 1's OUTPUTS

For all modes the first high speed input bit in time

appears on RQ11, which is the most significant bit.

Subsequent input data is output sequentially to RQ12-

RQ48. Byte #1, RQ11-RQ18, is the most significant

byte. Odd or even parity selection is programmable by

PARSEL. If PARSEL is left open (N.C.) the parity is

even. If PARSEL is tied to VEE the parity is odd.

In a 1:32 demultiplexing application, the TQ8223

regenerates the serial 2.48832 Gb/s data stream and

re-times it with the negative edge of the active 2.48832

GHz clock. The re-timed serial data stream is then 1:32

demultiplexed by the DEMUX block into an 32-bit wide

77.76 MHz data bus at RQ11-RQ48. A parity bit is

generated for each byte, and transmitted in parallel to

the data at RQPAR(1:4). The 32-bit wide data plus four

parity bits are then clocked out on the falling edge of

the internally generated 77.76 MHz clock. See Figure 6.

TQ8223

PRELIMINARY DATA SHEET

208-pin BGA

Top View

A
B
C
D
E
F
G
H
J
K

L
M
N
P
R
T
U

(Do Not Connect)

RQ12

RQ13

RQ14

RQ18

RQ17

RQ16

RQ15

RQPAR1

NCK311

CK311

DIN

NDIN

PPMSEL

A
B
C
D
E
F
G
H
J
K

L
M
N
P
R
T
U

RQ28

RQ24

RQ22

RQ21

RQ23

RQ27

RQ26

RQ25

RQPAR2

RQ31

RQ32

RQ33

RQ34

RQ35

RQ36

RQ37

RQ38

RQPAR3

RQ41

RQ42

RQ43

RQ44

RQ45

RQ46

RQ47

RQ48

RQPAR4

CK155

CK78T

SLIP

PHREF

VDT1

VDT2

VOSC

VTUNE

MODE0

MODE1

CK39

HCKOUT

CLKSEL

HINTCLK

PARSEL

TB_UPDN

TESTMODE

VTUNEO

LOCK

RESET

PLLVDD

PLLVEE

DATINV

RQ11

CKIN

NCKIN

DCREF

PHADJ

LOCKREF

RSTN

CVDD

VDD

IOVDD

VDD

IOVDD

VDD

IOVDD

VDD

VEE

CVEE

IOVEE

VEE

IOVEE

VEE

IOVEE

VEE

IOVEE

VEE

IOVEE

VEE

IOVEE

VEE

IOVEE

VEE

IOVDD

CVEE

IOVEE

VEE

TQ8223

Figure 3. TQ8223 Pinout - Top View

Note: Heat Spreader is at VDD volts.

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Table 1. Signal Description

Pin No.

Grid Ref. Signal

Type & Freq/Bit Rate Description

Data Demultiplexing Configuration

MODE0

Input DC

(MODE1 = N.C., MODE0 = N.C.) = Do Not Use;

MODE1

Input DC

(MODE1 = N.C., MODE0 = VEE) = 1:16 demultiplexing;
(MODE1 = VEE, MODE0 = N.C.) = 1:32 demultiplexing;
(MODE1 = VEE, MODE0 = VEE) = all 1's output.

2.5Gb/s Input Interface

DIN

Input AC 2.48832 Gb/s

High speed differential data input. Must be AC coupled.

NDIN

The input is internally terminated by R

to V

TD1,2

26,27,28 B9,C9,D9 VTD2

Input Analog DC

Input signal termination voltage, nominally at V

-2.8V.

31,32,33 B8,C8,D8 VTD1

Input Analog DC

DATINV

Input Analog DC

DIN complement select signal.
N.C. = true; VEE =complement

77.76Mb/s Interface

142

U12

RQ11

Output TTL

Byte #1. Most significant Byte (MSB).

77.76 MHz

Parallel data bit. RQ11 is the most significant bit.

141

P11

RQ12

Output TTL

Parallel data bit

140

R11

RQ13

Output TTL

Parallel data bit

139

T11

RQ14

Output TTL

Parallel data bit

136

P10

RQ15

Output TTL

Parallel data bit

135

R10

RQ16

Output TTL

Parallel data bit

134

U10

RQ17

Output TTL

Parallel data bit

133

RQ18

Output TTL

RQ18 is the least significant bit of the MSB (Byte #1)

131

RQPAR1

Output TTL

Parity bit signal for the 8-bit wide data at RQ11 to RQ18. The
parity bit is simultaneous with the byte wide data
at RQ11-RQ18 from which it was calculated.

125

RQ21

Output TTL

Byte #2

77.76 MHz

RQ21 is the most significant bit.

124

RQ22

Output TTL

Parallel data bit

123

RQ23

Output TTL

Parallel data bit

122

RQ24

Output TTL

Parallel data bit

119

RQ25

Output TTL

Parallel data bit

118

RQ26

Output TTL

Parallel data bit

117

RQ27

Output TTL

Parallel data bit

116

RQ28

Output TTL

RQ28 is the least significant bit of Byte#2

TQ8223

PRELIMINARY DATA SHEET

Table 1. Signal Description (continued)

Pin No.

Grid Ref. Signal

Type and Freq. or Bit Rate

Description

130

RQPAR2

Output TTL

Parity bit signal for the 8-bit wide data at RQ21 to RQ28. The
parity bit is simultaneous with the byte wide data
at RQ21-RQ28 from which it was calculated.

RQ31

Output TTL

Byte #3

77.76 Mb/s

RQ31 is the most significant bit.

RQ32

Output TTL

Parallel data bit

RQ33

Output TTLL

Parallel data bit

RQ34

Output TTL

Parallel data bit

RQ35

Output TTL

Parallel data bit

RQ36

Output TTL

Parallel data bit

RQ37

Output TTL

Parallel data bit

RQ38

Output TTL

RQ38 is the least significant bit of Byte #3

RQPAR3

Output TTL

Parity bit signal for the 8-bit wide data at RQ31 to RQ38. The
parity bit is simultaneous with the byte wide data at
RQ31-RQ38 from which it was calculated.

RQ41

Output TTL

Byte #4

77.76 Mb/s

RQ41 is the most significant bit.

RQ42

Output TTL

Parallel data bit

RQ43

Output TTL

Parallel data bit

RQ44

Output TTL

Parallel data bit

RQ45

Output TTL

Parallel data bit

RQ46

Output TTL

Parallel data bit

RQ47

Output TTL

Parallel data bit

RQ48

Output TTL

RQ48 is the least significant bit of the LSB (Byte #4)

RQPAR4

Output TTL

Parity bit signal for the 8-bit wide data at RQ41 to RQ48. The
parity bit is defined to be in parallel with the byte wide data at
RQ41-RQ48 from which it was calculated.

170

P17

CK311

Output PECL 311.04 MHz

311.04 MHz differential clock output. Must be externally
terminated by R

to V

TTe

171

N17

NCK311

Output PECL 311.04 MHz

Complement of CK311 Must be externally
terminated by R

to V

TTe

169

N16

CK155

Output PECL 155.52 MHz

155.52 MHz clock output.

168

M15

CK78T

Output TTL 77.76 MHz

77.76 MHz clock output.

167

N15

CK39

Output PECL 38.88 MHz

38.88 MHz clock output.

Phase-locked Loops Elements

182

J14

VOSC

Analog Power Supply

Analog power supply for the internal VCO.
VEE = VCO OFF; VDD = VCO ON

181

K17

VTUNE

Input Analog

Frequency tune voltage for internal VCO. Negative tune slope.
Must be tied to VEE when using an external VCO.

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Table 1. Signal Description (continued)

Pin No.

Grid Ref. Signal

Type and Freq. or Bit Rate

Description

C13

CKIN

Input AC

2.48832 GHz

High frequency clock input. The differential inputs must be
AC coupled and externally terminated by R

to V

TTe

. Must

be externally terminated by 10k

to VEE when internal

VCO is used.

B15

NCKIN

Input AC

2.48832 GHz

Complement of CKIN. Must be left open when internal VCO
is used.

164

T17

HINTCLK Input PECL

38.88 MHz PECL hint clock to aid PLL acquistion.

176

M17

HCKOUT

Output AC 2.48832 GHz

High speed clock monitor. 30mVpp with a 50

load.

199

F17

CLKSEL

Input

Clock select signal for choosing between external or internal
clock source as the active clock. NC =Internal VCO;
V

= External VCO. When external VCO is chosen, the

internal VCO is forced to a fixed logic state even if powered.

B12

PHREF

Output Analog

Phase detector output. Requires external pull-up resistor to
V

B13

DCREF

Output Analog

Phase detector reference output. Requires external pull-up
resistor to V

183

J15

PHADJ

Input Analog

Phase detector static offset. Nominally at 2.1V. The full range
of 2.1 +/- 0.625 V produces a -/+125 ps offset between the
center of the data eye and the falling edge of the sampling
clock. PHADJ has an internal default of 2.1V.

180

L17

VTUNEO

Output Analog

Internal PLL charge pump output.

194

F16

LOCK

Output TTL

Internal PLL lock detector. Remains high when frequency
difference between internal and external reference clocks is
less than 488 ppm. Accuracy of LOCK detect circuitry is
related to the accuracy of the external HINTCLK. Can be tied
to LOCKREF.

195

G17

LOCKREF Input TTL

Forces internal PLL to lock to external reference clock when
LOCKREF is low.

200

E15

PPMSEL

Input TTL

LOCK signal lower hysterisis level. When PPMSEL=VDD the
LOCK signal will return to a high state when the frequency
difference between the internal and external reference clocks
is less than 122 ppm from HINTCLK. When PPMSEL=VEE the
LOCK will return to a high state when the frequency
difference is less than 30 ppm from HINTCLK.

Power Pins and Test Pins

202

D17

RSTN

Input PECL

Chip reset (active low) Normally tied to RESET. When not
used must be tied to VDD through R

201

E17

SLIP

PECL

Slips demultiplexer 1 Bit at each negative edge, can be used
once every 3ns. When not used must be tied to VTT.

162

R16

PARSEL

TTL

When PARSEL=N.C. parity bits generated are even. When
PARSEL=VEE parity bits generated are odd.

TQ8223

PRELIMINARY DATA SHEET

Table 1. Signal Description (continued)

Pin No.

Grid Ref. Signal

Type and Freq. or Bit Rate

Description

C11

RESET

Input PECL

High speed reset allows for multiple demux
synchronization. Normally tied to RSTN. When not used
must be tied to VDD through R

159

U17

Output Analog

Part level identification. Voltage at ID indicates device type.
ID=##.

197

F14

TB_UPDN Factory Test

For testing purposes only. Must be tied to VEE.

198

E16

TESTMODE Factory Test

For testing purposes only. Must be tied to VEE.

24,25

A10,B10

CVDD

Analog Power Supply

Differential Data Input positive supply voltage

35,36

B7,C7

CVEE

Analog Power Supply

Differential Data Input supply return

187

H14

PLLVDD

Analog Power Supply

PLL positive supply voltage

188

H15

PLLVEE

Analog Power Supply

PLL supply return.

Signal

Description

Pin Number,Grid Reference

VDD

Positive rail supply voltage

6,C14

9,D12

42,C6

48,D5

54,C3

55,D3

53,D4

74,H4

94,M4

109,P5

113,R5

114,P6

126,P8

158,R15

157,P14

161,N14

172,L14

173,L15

178,K15

192,G14

206,D14

207,C15

208,C16

IOVDD

I/O Positive

5,D13

10,B14

13,C12

21,C10

20,D10

62,F4

68,G4

supply voltage

91,L4

80,J4

132,T9

104,P3

120,P7

143,T12

146,P12

166,M14 177,K14

191,G15

203,E14

204,D15

103,P4

147,R12

VEE

Negative rail supply voltage

105,R3

106,T2

112,U3

115,T4

128,T8

153,P13

154,R14

155,T15

156,T16

163,P16

174,M16 184,J16

102,P2

193,G16

205,D16

1,B16

2,C17

43,D6

51,A2

52,B2

61,E3

76,H2

137,T10

IOVEE

I/O Negative

101,N3

93,M3

129,U8

138,U11

150,R13

175,L16

15,D11

supply voltage

63,C1

60,D2

77,H1

85,K4

DO NOT CONNECT

3,B17

16,A15

17,A14

18,A13

19,A12

22,B11

23,A11

40,B6

41,B5

56,A1

57,E4

58,B1

59,C2

69,G3

75,H3

86,L1

92,L3

95,R1

96,M2

97,T1

98,N2

99,R2

100,N4

107,U1

108,U2

110,R4

111,T3

121,T6

127,R8

148,T13

149,T14

151,U15

152,U16

165,R17

196,F15

47,C4

160,P15

34,A7

144,U13

145,U14

186,H17

185,J17

39,A5

38,D7

4,A16

44,C5

45,A4

37,A6

189,H16

179,K16

190,A17

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Table 2. Absolute Maximum Ratings

Parameter

Symbol

Min

Max

Unit

Supply voltage

VDD-VEE

GND

7.0

Internal VCO Supply voltage

VOSC

VEE-0.5

VDD+0.5

DIN,NDIN termination voltage

VTD

VEE-0.5

VDD+0.5

Inputs/Outputs

VEE-0.5

VDD+0.5

Storage Temperature

Tstg

-55

150

Maximum Case Operating Temperature, Tc

125

Maximum junction temperature Tj

150

Electrostatic Discharge (100 pF, 1.5 k

)

1000

Signal

Symbol

Parameter

Min

Typ

Max

Units

VDD-VEE

-V

Supply voltage range

4.75

5.00

5.25

(Note 1)
VOSC

osc

Internal VCO supply

VDD

(Note 1)

osc

Supply current for internal VCO

PLLVDD-PLLVEE

VDD

-P

VEE

PLL supply voltage

VDD

(Note 1)

PLL

Supply current for internal VCO

VTD

supply voltage range

VDD-2.8

(Note 1)

termination supply current (Note 2)

DIN/NDIN Termination resistance

CVDD-CVEE

VDD

-C

VEE

Input Comparator supply voltage

VDD

(Note 1)

PLL

Supply current for internal VCO

Case temperature

-40

125

Notes:

No special power up sequence is required.

VEE ,VTD at operating range.

Table 3. DC Operating Ranges

Low Speed Outputs

VDD (V)

Typ Power (W)

Max Power (W)

Open

5.0

3.12

3.48

Open

5.25

3.80

4.24

Fully Loaded

5.0

3.22

3.59

Table 4. Power Dissipation

TQ8223

PRELIMINARY DATA SHEET

Table 5. Recommended External Loop Filter Values

REFCLK

Resistor

Capacitor

Frequency

Value R1

Value C1

Value C2

(MHz)

(

)

(

(pF)

38.88

0.33

133

VTUNEO

PLLVDD

Table 6. VCO Control Signal Specifications

Signal

Symbol

Parameter

Min

Typ

Max

Units

VTUNEO

range

VTUNEO voltage range (Note 1)

2.5

KVCO

VCO VTUNE voltage gain

500

MHz/V

range

VCO frequency range when using internal PLL

1950 - 2700

MHz

Notes:

1. A VTUNEO voltage of 2.5V corresponds to approximatey a 2.5GHz center frequency.

Table 7. High Speed Signal Specification

Signal

Symbol

Description

Min Nom (Note 1) Max

Units

CLKIN

cki

Input clock period

370.4 ps

401.88 ps 250 ns

NCLKIN

ckdc

Input clock duty cycle

amp

Input clock differential peak to peak voltage

1000

1200

1400

HCKOUT

cko

High speed output clock period

401.88

amp

High speed output clock peak-to-peak voltage

High speed output clock output impedance

Note 1:

All NOM specifications apply under the following conditions.

Input data pattern:

-1 PRBS

Input data rate:

2.48832 Gbps

Input clock frequency:

2.48832 GHz

Input data rise/fall time (20 %/80 %) >100 p

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Table 8. Jitter Generation Performance

Signal

Jitter Generation

Nom

Max

Units

CK155

6.2

RMS

0.84

Note: The method used is outlined in a Jitter Bench
Application Note available upon request. The values
listed as nominal were performed under the following
conditions: Data Rate = 2.48832 Gb/s

VDD = 5 V
Tcase = 60 C

Figure 4. Jitter Tolerence

Frequency (Hz)

SONET/SDH

Template

1.5

0.3

0.15

3.0

100

600

100k

TQ8223 CDR

Table 9. Jitter Tolerence Performance

Symbol

Description

tolerence

The TQ8223 CDR exceeds the SONET/SDH Jitter Tolerence Template
according to the figure below.

Note: The method used to measure Jitter
Tolerence is outlined in a Jitter Bench
application note available upon request.

TQ8223

PRELIMINARY DATA SHEET

Figure 5. Typical Jitter Transfer Curve

Gain (dB)

Frequency (Hz)

Table 10. Jitter Transfer Performance

Symbol

Description

Nom

Max

Units

peaking

Peak Gain in Transfer Curve

0.05

0.1

Corner Frequency Transfer Curve

1.76

2.0

MHz

Note: Jitter Transfer measurments were
performed with the PLL loop filter values
specified in Table 5. The method used is
outlined in a Jitter Bench application note
available upon request. The values listed as
nominal were performed under the following
conditions: VDD = 5 V

Tcase = 60 C

-40

-35

-30

-25

-20

-15

-10

-5

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

SONET/SDH Template

Transfer, 5.0V, 50C

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Signal

Symbol

Description

Min

Nom

Max

Units

DIN

dp-p

(N)DIN outer eye differential pk-pk amplitude

1000

1600

NDIN

(N)DIN data rate

2.48832

Gb/s

sens

Data channel sensitivity (Note 1)

off

(N)DIN differential offset voltage

-25

+25

dead

Data channel dead band (Note 2)

125

hys

Data channel hysteresis (Note 3)

Note 1:

Measured as the minimum inner eye amplitude of the data signal at DIN that can be correctly regenerated. Input clock/data phase
and Data decision threshold optimized for sensitivity.
All specifications apply under the following conditions.

Input data pattern:

-1 PRBS

Input data rate:

2.48832 Gbps

Input clock frequency:

2.48832 GHz

Input data rise/fall time (20 %/80 %) >100 ps

Note 2:

Measured as the input clock/data phase range over which errors can be detected at RQ11-18 in 1:8 mode. Specification
applies under the following conditions:

- input data amplitude: < 375mV mean

-mean

- Input data rise/fall time (20 %/80 %) >100 ps

Note 3:

Hysteresis is the difference in the decision threshold that results in error free operation of the channel when the decision threshold is
first increased and then decreased and vice versa starting from a level that results in error free operation of the channel. The
hysteresis specification applies for both the `1' and `0' signal levels. The DIN input conditions are the same as those listed in note 1
above.

Note 4:

All amplitudes are differential peak-peak voltage

Table 11. Data Channel Specifications (Note 4)

TQ8223

PRELIMINARY DATA SHEET

Signal

Symbol

Description

Min

Nom

Max

Units

CK78T

tckdc

Output clock duty cycle (Note 3)

tckr

Output clock rise time (20% to 80%)

2000

tckf

Output clock fall time (20% to 80%)

2000

Voh

Output clock high level

2.4

Vol

Output clock low level

0.4

Cload

Output load capacitance

RQ11-18 Tpd1

Output data delay 1 (Note 1)

1.8

RQ21-28 Tpd2

Output data hold time (Note 1)

RQ31-38 Voh

Output high voltage (Note 2)

2.4

RQ41-48 Vol

Output low voltage (Note 2)

0.4

RQPAR1

Ioh

Output high-level output current

RQPAR2

Iol

Output low-level output current

-20

RQPAR3

Cload

Output load capacitance

RQPAR4
LOCK

LOCKREF Vih

Input high level

2.0

PPMSEL

Vil

Inputt low level

0.8

MODE(0:1)
PARSEL

Notes:

1.See Figure 6. Tpd1 and Tpd2 are specified relative to the falling edge of the CK78T signal. Output data edge jitter is not included in
the specifications. The output data streams are assumed to be free of any skewing in time. The specifications apply under the
following conditions:

Output data rise/fall time:

<= 2000ps (20% to 80%)

Output data:

-1 PRBS, 32x78Mb/s

Output clock frequency:

77.76MHz

2.Output data level requirements apply under the following conditions:

Output data:

-1 PRBS, 32x78Mbit/s

Output clock frequency:

77.76MHz

3.Output clock duty cycle is measured at the mean voltage of the signal and nominal input clock frequency of 2.48832GHz.

Table 12. TTL Interface Specifications

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

pd2

pd1

Valid

Data

Valid

Data

Figure 6 AC Timing: 77.76 Mb/s TTL Interface

CK78T

RQ11-18
RQ21-28
RQ31-38
RQ41-48

Signal

Symbol

Description

Min Nom

(Note 4)

Max

Units

CK311

tckdc

Output clock duty cycle (Note 2)

NCK311

tckr

Output clock rise time (20% to 80%)

750

CK155

tckf

Output clock fall time (20% to 80%)

750

CK39

Voh

Output clock high level

-1.0

-0.6

(Note 1)

Vol

Output clock low level

TTe

-1.6

Vamp

Output clock amplitude (Note 3)

+/-350

SLIP

Vih

Input high level

-1.05

-0.4

RESET

Vil

Input low level

TTe

-1.55 V

RSNT

tif

Input fall time (20% to 80%)

750

HINTCLK tif

Input fall time (20% to 80%)

750

Notes:

1.All specifications apply with signals terminated with R

to V

TTe

2.Output clock duty cycle is measured at the mean voltage of the signal and nominal input clock frequency of 2.48832 GHz.
3.The CK155 and CK39 clock output amplitude is measured with respect to the mean voltage of the signal.
4.All NOM specifications apply under the following conditions.

Input data pattern:

-1 PRBS

Input data rate:

2.48832 Gbps

Input clock frequency:

2.48832 GHz

Input data rise/fall time (20 %/80 %) >100 p

Table 13. PECL Interface Specifications

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

VEE

+2.2V

+5.0V

2.5GHz clock monitor

38.88MHz PECL clock

2.48832Gb/s from AGC

A.C.
Terminated

N.C. or VEE (GND)

38.88MHz clock

CLKSEL

LOCK

CK39

HCKOUT

MODE0

MODE1

N.C.

VOSC

VTUNE

VTUNE0

DATINV

DIN

VTD1

VTD2

NCKIN

HINTCLK

CKIN

VDD

Figure 8. 1:32 Demultiplexing with Internal PLL

Typical Application

PHADJ

Phase control from DAC

VEE

VDD

NDIN

VEE
N.C.

RQ1(1:8)

RQ4(1:8)

RQ2(1:8)

RQPAR1

RQ3(1:8)

RQPAR4

RQPAR2

CK78T(0:3)

RQPAR3

77.76Mb/s TTL Inter

face

TQ8223

SONET/SDH/A

PRODUCTS

PRELIMINARY DATA SHEET

TELECOM

PRODUCTS

Top view

Bottom view

Side View Section

A1 Ball I.D. Mark

0.5mm Chamfer

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

A1 Ball
Corner

aaa

Figure 10. 208-pin BGA Mechanical Dimensions

Symbol

Parameter

Min

Nom

Max

Overall Thickness

1.45

1.55

1.65

Ball Height

0.60

0.65

0.70

Body Size

22.80

23.00

23.20

Ball Footprint

20.32 (BSC.)

Body Size

22.80

23.00

23.20

Ball Footprint

20.32 (BSC.)

Ball Diameter

0.65

0.75

0.85

Body Thickness

0.85

0.90

0.95

aaa

Seating Plane Clearance

0.15

Ball Pitch

1.27 TYP.

Encapsulation Clearance

0.15

Table 15. 208-pin BGA Dimensions

Note: Heat Spreader is at VDD volts.

Note: All dimensions in millimeters (mm)

TQ8223

PRELIMINARY DATA SHEET

The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or
omissions. TriQuint assumes no responsibility for the use of this information, and all such information
shall be entirely at the user's own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.

Revision 0.2.A

August 1999

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TQ8223CDR

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TQ8223CDR