Production Process
TQHiP
Power MESFET Foundry Service
Features
Power MESFET Process
Interconnects:
2 Global (one airbridge)
1 Local
High-Q Passives
Bulk & Thin Film Resistors
Backside Vias Optional
High Volume Production
Processes
Validated Models and
Design Support
Applications
Power Amplifiers
Switches
Frequencies thru X-Band
Base Station Driver
Amplifiers
CATV Line Amplifiers
Cellular Power Amps, Driv-
ers, Switches
General Description
TriQuint's TQHiP process is our robust, high power density
MESFET process. It provides a straight-forward, low cost
process for a variety of circuits and applications. Its high oper-
ating and breakdown voltages make it ideal for wireless or
wired infrastructure applications. A thick (4 m) gold airbridge
complements the 2 m thick gold global metal and 0.5 m
thick gold surface layer for wiring flexibility and interconnect
density. Precision NiCr resistors and high value MIM capaci-
tors are included.
Semiconductors for Communications
www.triquint.com
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Phone: 503-615-9000
Fax: 503-615-8905
Email: info@triquint.com
Page 1 of 4; Rev 2.1 4/30/02
Isolation Implant
NiCr
N-/P- Channel
N+
N+
Metal 0
Metal 1 2 um
Metal 1
Air Bridge - 4um
MIM Metal
D MESFET
NiCr Resistor
MIM Capacitor
Semi-Insulating GaAs Substrate
Isolation Implant
NiCr
N-/P- Channel
N+
N+
Metal 0
Metal 1 2 um
Metal 1
Air Bridge - 4um
Isolation Implant
NiCr
N-/P- Channel
N+
N+
Metal 0
Metal 1 2 um
Metal 1
Isolation Implant
NiCr
NiCr
N-/P- Channel
N+
N+
N-/P- Channel
N+
N+
Metal 0
Metal 1 2 um
Metal 1
Metal 1 2 um
Metal 1
Metal 1 2 um
Metal 1
Air Bridge - 4um
MIM Metal
D MESFET
NiCr Resistor
MIM Capacitor
Semi-Insulating GaAs Substrate
TQHiP Process Cross-Section
Production Process
TQHiP
Power MESFET Foundry Service
Semiconductors for Communications
www.triquint.com
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Phone: 503-615-9000
Fax: 503-615-8905
Email: info@triquint.com
Page 3 of 4; Rev 2.1 4/30/02
Measured I-V Characteristic Curve
300 um Device; T=27degC
0.000
20.000
40.000
60.000
80.000
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Vd (V)
Id (
m
A)
H1SS_DC
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Vds (volts)
Vgs=-2.0
Vgs=-1.5
Vgs=-1.0
Vgs=-0.5
Vgs=0.0
Measured vs. Modeled DC Characteristics; H1SS - D1010 FET
(Lg = 1.0
m
m, Lgs = Lgd = 1.0
m
m) Model Parameters; @ T=27C.
Production Process
TQHiP
Power MESFET Foundry Service
Semiconductors for Communications
www.triquint.com
TriQuint Semiconductor
2300 NE Brookwood Pkwy
Hillsboro, Oregon 97124
Phone: 503-615-9000
Fax: 503-615-8905
Email: info@triquint.com
Page 4 of 4; Rev 2.1 4/30/02
Applications Support Services
Tiling of GDSII Stream Files including PCM
Design Rule Check Services
Layout versus Schematic Check Services
Packaging Development Engineering
Test Development Engineering:
On-Wafer
Packaged Parts
Thermal Analysis Engineering
Yield Enhancement Engineering
Part Qualification Services
Failure Analysis
Manufacturing Services
Mask Making
Production 150 Wafer Fab
Wafer Thinning
Wafer Sawing
Substrate Vias
DC Die Sort Testing
RF On-Wafer Testing
Plastic Packaging
RF Packaged Part Testing
Please contact your local TriQuint Semiconductor Representative/ Distributor
or Foundry Services Division Marketing for Additional information:
E-mail: sales@triquint.com; Phone: (503) 615-9000 Fax: (503) 615-8905
Design Tools Available
Device Library of Circuit Elements: FET, Diodes, Thin
Film and Implanted Resistors, Capacitors, Inductors
Parameters for "TriQuint's Own Model" (TOM) in
Popular Simulators
Agilent ADS Design Kit Available Now
PSPICE Models Available Now
Layout and Verification Kit for ICEditors Now
Qualified Package Models for Supported Package Styles
Prototyping and Development
Prototype Wafer Option (PWO):
Customer-specific Masks, Customer Schedule
2 wafers delivered
Hot Lot Cycle Time
With thinning and sawing; optional backside
vias
Design Sensitivity Test Run (DST):
Yield Analysis
Design Sensitivity to Process Variation
14 Wafer Start; Spread of Vp and Cgs values
Process Qualification Status
TQHiP is a fully released and qualified process
Reliability Reports
TQHiP Process Qualification
High Power Product Qualification
TQHiP Element Qualification Report
For more information on Quality and Reliability,
contact TriQuint or visit:
www.triquint.com/
manufacturing/QR/bdy_qr-pubs.htm
Training
GaAs Design Classes:
Half Day Introduction; Upon Request
Four Day Technical Training; Fall & Spring at
TriQuint Oregon facility
For Training and Schedules please visit::
www.triquint.com/foundry
PDF 
ZIP