CHT3091RCF
Ref. : DSCHT3091RCF1257 - 14-Sept-01-
1/3
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Dpartementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
DC-40GHz Attenuator
GaAs Monolithic Microwave IC in SMD leadless package
Description
The monolithic microwave IC (MMIC) in the
package is a variable DC-40GHz
attenuator. It is designed for a wide range of
applications, from military to commercial
communication systems.
The circuit is manufactured with a MESFET
process, 0.7m gate length, via holes
through the substrate and air bridges.
It is supplied in a new SMD leadless chip
carrier.
Main Features
Broad band performance: DC-40GHz
Minimum attenuation [S21] : 4dB
( VS = 0V; VP = -5V )
Maximum attenuation [S21] : 20dB
( VS = -5V; VP = 0V )
Minimum input 1dB compression point
(P
-1dB
) : 14dBm
SMD leadless package
Dimensions: 5.08 x 5.08 x 0.97 mm
3
SMD Package Dimensions
"Please note that PIN 1 is located in the lower left corner of the package (front-side view) for all SMD-type packages from United Monolithic Semiconductors. It is indicated
by a triangle on the package lid. Starting with PIN 1 the other pads are numbered counter-clockwise (front-side view). ATTENTION: The dot on the backside of the
package (i.e. side with metallic pads) is just for fabrication purposes and does NOT indicate the location of PIN
RF in
8
RF out
4
NC
7
Vp
3
NC
6
NC
2
NC
5
Vs
1
Function
PIN
Function
PIN
RF in
8
RF out
4
NC
7
Vp
3
NC
6
NC
2
NC
5
Vs
1
Function
PIN
Function
PIN
5.08 [0.20]
5
.
08 [0.2
0]
UMS
CHT3091
0.97
[0.038]
0.
46
[0.
02]
0.91
[0.036]
0.46
[0.02]
0.
8
6
[0
.
0
34
]
2.46
[0.10]
1.02 [0.04]
2.46
[
0
.10]
1
2
6
5
3
7
4
8
PIN 1 Index
not to scale; not all details shown;
dimensions are in millimeters [inches]
5.08 [0.20]
5
.
08 [0.2
0]
UMS
CHT3091
0.97
[0.038]
0.
46
[0.
02]
0.91
[0.036]
0.46
[0.02]
0.
8
6
[0
.
0
34
]
2.46
[0.10]
1.02 [0.04]
2.46
[
0
.10]
1
2
6
5
3
7
4
8
PIN 1 Index
not to scale; not all details shown;
dimensions are in millimeters [inches]
EXPOSED
GROUND PAD
CONNECT TO RF
GROUND PLANE
EXPOSED
GROUND PAD
CONNECT TO RF
GROUND PLANE
CHT3091RCF
DC-40GHz Attenuator
Ref. : DSCHT3091RCF1257 - 14-Sept-01-
2/3
Specifications subject to change without notice
Route Dpartementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Typical Bias Conditions
for an ambient Temperature of +25C
Symbol Pin
No.
Parameter
Values Unit
Vs
1
VS control voltage
-5 to 0
V
Vp
3
VP control voltage
0 to 5
V
All other pins are not used for this device.
Footprint
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used.
For further details, see application note AN0005.
0.
46
[
0
.
02]
Suggested PCB Footprint
for CHT3091RCF
0
.
86 [
0
.
034]
2.03 [0.080]
1.
02
[
0
.
040]
0.88 [0.035]
1.02
[0.040]
3.91 [0.154]
4.
93 [
0
.
194]
0.46
[0.018]
not to scale; dimensions are
in millimeters [inches]
0.
46
[
0
.
02]
Suggested PCB Footprint
for CHT3091RCF
0
.
86 [
0
.
034]
2.03 [0.080]
1.
02
[
0
.
040]
0.88 [0.035]
1.02
[0.040]
3.91 [0.154]
4.
93 [
0
.
194]
0.46
[0.018]
not to scale; dimensions are
in millimeters [inches]
DC-40GHz Attenuator
CHT3091RCF
Ref. : DSCHT3091RCF1257 - 14-Sept-01-
3/3
Specifications subject to change without notice
Route Dpartementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
Ordering Information
SMD leadless package form :
CHT3091RCF/24
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
PDF 
ZIP