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Электронный компонент: VT8363KT133AMDATHLONNORTHBRIDG

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KT133 -
VT8363
Preliminary Revision 1.0, May 12, 2000
-1-
Features
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VIA VT8363
KT133 AMD A
THLON
TM N
ORTH
B
RIDGE
Single-Chip North Bridge
for Socket-A (Socket-462) Based Athlon CPUs
with 200 MHz Front Side Bus
for Desktop PC Systems
with AGP 4x and PCI
plus Advanced Memory Controller
supporting PC133 / PC100 SDRAM and VCM
High Performance and High Integration Athlon AGP 4x / PC133 Chipset with Advanced System
Power Management
-
KT133 Chipset: VT8363 system controller and VT82C686A PCI to ISA bridge
-
Single chip Athlon system controller with 64-bit Socket-A Athlon CPU, 64-bit system memory, 32-bit PCI and 32-
bit AGP interfaces
-
PCI-to-ISA bridge chip includes UltraDMA-33/66 EIDE, 4 USB Ports, Integrated Super-I/O, AC97 / MC97 link (for
Audio and Modem support), Hardware Monitoring, Power Management, and Keyboard / PS2-Mouse Interfaces plus
RTC / CMOS on chip
-
Supports separately powered 3.3V (5V tolerant) interface to system memory, AGP, and PCI bus
-
Modular power management and clock control for advanced system power management
High Performance Athlon CPU Interface
-
Supports Socket-A (Socket-462) AMD Athlon processors
-
HSTL-like 1.5V high-speed transceiver logic signal levels
-
Support independent address, data, and snoop interfaces
-
100 MHz DDR (Double Data Rate) transfer on Athlon CPU address and data buses
-
Built-in PLL (Phase Lock Loop) circuitry for optimal skew control within and between clocking regions
-
Four-entry command queue to accommodate maximum CPU throughput
-
Four-entry probe queue to stores probes from the system to the processor
-
Twenty four-entry processor system data and control queue to store system data control commands in two separate
read and write buffers for data movement in and out of processor interface
-
Supports WC (Write Combining) cycles
-
Sleep mode support
-
System management interrupt, memory remap and STPCLK mechanism
KT133 -
VT8363
Preliminary Revision 1.0, May 12, 2000
-2-
Features
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Full Featured Accelerated Graphics Port (AGP) Controller
-
Synchronous and pseudo-synchronous with the host CPU bus with optimal skew control
PCI
AGP
CPU
Mode
33 MHz
66 MHz
100 MHz DDR
3x synchronous
-
AGP v2.0 compliant
-
Supports SideBand Addressing (SBA) mode (non-multiplexed address / data)
-
Supports 66 MHz 1x, 2x and 4x modes for AD and SBA signaling
-
Pipelined split-transaction long-burst transfers up to 1GB/sec
-
Thirty-two level read request queue
-
Four level posted-write request queue
-
Thirty-two level (quadwords) read data FIFO (256 bytes)
-
Sixteen level (quadwords) write data FIFO (128 bytes)
-
Intelligent request reordering for maximum AGP bus utilization
-
Supports Flush/Fence commands
-
Graphics Address Relocation Table (GART)
-
One level TLB structure
-
Sixteen entry fully associative page table
-
LRU replacement scheme
-
Windows 95 OSR-2 VXD and integrated Windows 98 / Windows 2000 miniport driver support
Concurrent PCI Bus Controller
-
PCI buses are synchronous / pseudo-synchronous to host CPU bus
-
33 MHz operation on the primary PCI bus
-
66 MHz PCI operation on the AGP bus
-
PCI-to-PCI bridge configuration on the 66MHz PCI bus
-
Supports up to five PCI masters
-
Peer concurrency
-
Concurrent multiple PCI master transactions; i.e., allow PCI masters from both PCI buses active at the same time
-
Zero wait state PCI master and slave burst transfer rate
-
PCI to system memory data streaming up to 132Mbyte/sec
-
Two lines (32 double-words) of CPU to PCI posted write buffers
-
Byte merging in the write buffers to reduce the number of PCI cycles and to create further PCI bursting possibilities
-
Enhanced PCI command optimization (MRL, MRM, MWI, etc.)
-
Thirty-two levels (double-words) of post write buffers from PCI masters to DRAM
(two cache lines / 16 double-words for PCI bus, two cache lines / 16 double-words for Athlon processor interface)
-
Sixteen levels (double-words) of prefetch buffers from DRAM for access by PCI masters
-
Delay transaction from PCI master accessing DRAM
-
Read caching for PCI master reading DRAM
-
Transaction timer for fair arbitration between PCI masters (granularity of two PCI clocks)
-
Symmetric arbitration between Host/PCI bus for optimized system performance
-
Complete steerable PCI interrupts
-
PCI-2.2 compliant, 32 bit 3.3V PCI interface with 5V tolerant inputs
KT133 -
VT8363
Preliminary Revision 1.0, May 12, 2000
-3-
Features
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Advanced High-Performance DRAM Controller
-
Supports PC133 and PC100 SDRAM and Virtual Channel Memory (VCM) SDRAM up to 3 DIMMs
-
Concurrent CPU, AGP, and PCI access
-
Different DRAM types may be used in mixed combinations
-
Different DRAM timing for each bank
-
Dynamic Clock Enable (CKE) control for SDRAM power reduction in high speed systems
-
Mixed 1M / 2M / 4M / 8M / 16M / 32MxN DRAMs
-
Support up to 1.5 GB memory space (256Mb DRAM technology)
-
Flexible row and column addresses
-
64-bit data width and 3.3V DRAM interface
-
Programmable I/O drive capability for MA, command, and MD signals
-
Two-bank interleaving for 16Mbit SDRAM support
-
Two-bank and four bank interleaving for 64Mbit SDRAM support
-
Supports maximum 16-bank interleave (i.e., 16 pages open simultaneously); banks are allocated based on LRU
-
Independent SDRAM control for each bank
-
Seamless DRAM command scheduling for maximum DRAM bus utilization
(e.g., precharge other banks while accessing the current bank)
-
Four cache lines (32 quadwords) of CPU to DRAM write buffers
-
Four cache lines (32 quadwords) of CPU to DRAM read prefetch buffers
-
Read around write capability for non-stalled CPU read
-
Burst read and write operation
-
BIOS shadow at 16KB increment
-
Decoupled and burst DRAM refresh with staggered RAS timing
-
CAS before RAS or self refresh
Advanced System Power Management Support
-
Dynamic power down of SDRAM (CKE)
-
PCI and AGP bus clock run and clock generator control
-
VTT suspend power plane preserves memory data
-
Suspend-to-DRAM and Self-Refresh operation
-
SDRAM self-refresh power down
-
8 bytes of BIOS scratch registers
-
Low-leakage I/O pads
Built-in NAND-tree pin scan test capability
3.3V, 0.35um, high speed / low power CMOS process
35 x 35 mm, 552 pin BGA Package