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Электронный компонент: BYV26EGP

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BYV26DGP and BYV26EGP
Vishay Semiconductors
formerly General Semiconductor
Document Number 88554
www.vishay.com
07-Mar-02
1
New Product
Glass Passivated Ultrafast Rectifier
Reverse Voltage 800 to 1000V
Forward Current 1.0A
Maximum Ratings & Thermal Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Parameter
Symbol
BYV26DGP
BYV26EGP
Unit
Maximum repetitive peak reverse voltage
V
RRM
800
1000
V
Maximum RMS voltage
V
RMS
560
700
V
Maximum DC blocking voltage
V
DC
800
1000
V
Maximum average forward rectified current
0.375" (9.5mm) lead length
(See Fig. 1)
I
F(AV)
1.0
A
Peak forward surge current 10ms single half
sine-wave superimposed on rated load
I
FSM
30
A
Non repetitive peak reverse energy
(Note 1)
E
RSM
10
mj
Typical thermal resistance
(Note 2,3)
R
JA
70
R
JL
16
C/W
Operating junction and storage temperature range
T
J
, T
STG
65 to +175
C
Electrical Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Minimum avalanche breakdown voltage at 100
A
V
BR
900
1100
V
Maximum instantaneous
T
J
= 25C
V
F
2.5
V
forward voltage at 1.0A
T
J
= 175C
1.3
Maximum DC reverse current
T
A
= 25C
5.0
at rated DC blocking voltage
T
A
= 165C
I
R
150
A
Max. reverse recovery time at I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
t
rr
75
ns
Typical junction capacitance at 4.0V, 1MHz
C
J
15
pF
Notes: (1) Peak reverse energy measured at I
R
= 400mA, T
J
= T
J
max. on inductive load, t = 20
s
(2) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, mounted on P.C.B. with 0.5 x 0.5" (12 x 12mm) copper pads
(3) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heatsink
Features
High temperature metallurgically bonded construction
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0.
Cavity-free glass passivated junction
Ultrafast recovery time for high efficiency
Low forward voltage, high current capability
Capable of meeting environmental standards of
MIL-S-19500
Low leakage current High surge current capability
Specified reverse surge capability
High temperature soldering guaranteed: 350C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AC, molded plastic over glass body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.015 oz., 0.4 g
0.034 (0.86)
0.028 (0.71)
Dia.
0.140 (3.6)
0.104 (2.6)
Dia.
0.230 (5.8)
0.300 (7.6)
1.0 (25.4)
min.
1.0 (25.4)
min.
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306.
Patented*
DO-204AC (DO-15)
Dimensions
in inches and
(millimeters)
BYV26DGP and BYV26EGP
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88554
2
07-Mar-02
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
Temperature (
C)
Fig. 1 Maximum Forward Current
Derating Curve
A
verage Forward Rectified Current (A)
Fig. 3 Typical Instantaneous
Forward Voltage Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Leakage
Current (
A)
Fig. 4 Typical Reverse Leakage
Characteristics
Fig. 6 Typical Transient
Thermal Impedance
Number of Cycles at 60 H
Z
t, Pulse Duration (sec.)
Fig. 2 Maximum Non-Repetitive Peak
Forward Surge Current
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance, pF
T
ransient
Thermal Impedance (
C/W)
Fig. 5 Typical Junction
Capacitance
0
25
50
75
100
125
150
175
0
0.2
0.4
0.6
0.8
1.0
1.2
Mounted on P.C.B.
0.375" (9.5mm) Lead Length
on 0.5 x 0.5" (12 x 12mm)
Copper Pads
Resistive or
Inductive Load
T
A
= Ambient Temperature
TL = Lead
Temperature
Lead Mounted
on Heatsinks
1
10
100
1
10
100
10ms, Single Half Sine-Wave
T
J
= T
J
max.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01
0.1
1
10
20
T
J
= 25
C
Pulse Width = 300
s
1% Duty Cycle
0
20
40
60
80
100
0.01
0.1
1
10
100
1,000
0.1
1
10
100
1
10
100
T
J
= 25
C
f = 1.0MH
Z
Vsig = 50mVp-p
0.01
0.1
1
10
100
1
10
100
Mounted on P.C.B.
0.375" (9.5mm) Lead Length
on 0.47 x 0.47" (12 x 12mm)
Copper Pads
T
J
= 165
C
T
J
= 25
C