UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88758
www.vishay.com
30-Jul-02
1
New Product
Ultrafast Rectifiers
Reverse Voltage 500 to 600V
Forward Current 12A
Reverse Recovery Time 30ns
0.08
(2.032)
0.24
(6.096)
0.42
(10.66)
0.63
(17.02)
0.12
(3.05)
0.33
(8.38)
Mounting Pad Layout TO-263AB
0.380 (9.65)
0.411 (10.45)
0.320 (8.13)
0.360 (9.14)
0.591 (15.00)
0.624 (15.85)
1
2
0.245 (6.22)
MIN
K
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
K
0.160 (4.06)
0.190 (4.83)
0.045 (1.14)
0.055 (1.40)
0.021 (0.53)
0.014 (0.36)
0.110 (2.79)
0.140 (3.56)
0.090 (2.29)
0.110 (2.79)
0.047 (1.19)
0.055 (1.40)
PIN 1
PIN 2
K - HEATSINK
0-0.01 (0-0.254)
0.060 (1.52)
0.405 (10.27)
0.383 (9.72)
0.191 (4.85)
0.171 (4.35)
0.600 (15.5)
0.580 (14.5)
0.560 (14.22)
0.530 (13.46)
0.037 (0.94)
0.027 (0.69)
0.140 (3.56)
0.130 (3.30)
0.350 (8.89)
0.330 (8.38)
0.188 (4.77)
0.172 (4.36)
0.110 (2.80)
0.100 (2.54)
0.131 (3.39)
0.122 (3.08)
0.110 (2.80)
0.100 (2.54)
0.022 (0.55)
0.014 (0.36)
0.205 (5.20)
0.195 (4.95)
1
2
PIN
DIA.
DIA.
PIN 1
PIN 2
0.676 (17.2)
0.646 (16.4)
ITO-220AC (UGF12 Series)
TO-220AC (UG12 Series)
Dimensions in inches
and (millimeters)
TO-263AB (UGB12 Series)
0.154 (3.91)
0.148 (3.74)
DIA.
0.113 (2.87)
0.103 (2.62)
0.185 (4.70)
0.175 (4.44)
0.055 (1.39)
0.045 (1.14)
0.145 (3.68)
0.135 (3.43)
0.350 (8.89)
0.330 (8.38)
0.160 (4.06)
0.140 (3.56)
0.037 (0.94)
0.027 (0.68)
0.205 (5.20)
0.195 (4.95)
0.560 (14.22)
0.530 (13.46)
0.022 (0.56)
0.014 (0.36)
0.110 (2.79)
0.100 (2.54)
1
2
1.148 (29.16)
1.118 (28.40)
0.105 (2.67)
0.095 (2.41)
0.410 (10.41)
0.390 (9.91)
0.635 (16.13)
0.625 (15.87)
0.603 (15.32)
0.573 (14.55)
PIN
0.415 (10.54) MAX.
PIN 1
PIN 2
CASE
0.370 (9.40)
0.360 (9.14)
Features
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Ideally suited for freewheeling diode and power factor
correction applications
Soft recovery characteristics
Excellent high temperature switching
Optimized to reduce switching losses
Glass passivated chip junction
Mechanical Data
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB
molded plastic body
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
High temperature soldering in accordance with CECC
802 / Reflow guaranteed
Polarity: As marked
Mounting Position: Any
Mounting Torque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88758
2
30-Jul-02
Maximum Ratings
(T
C
= 25C unless otherwise noted)
Parameter
Symbol
UG12HT
UG12JT
Unit
Maximum repetitive peak reverse voltage
V
RRM
500
600
V
Maximum working reverse voltage
V
RWM
400
480
V
Maximum RMS voltage
V
RMS
350
420
V
Maximum DC blocking voltage
V
DC
500
600
V
Maximum average forward rectified current
I
F(AV)
12
A
Peak forward surge current 8.3ms single half sine-wave
I
FSM
135
A
superimposed on rated load (JEDEC Method)
Operating junction and storage temperature range
T
J
, T
STG
55 to +150
C
RMS Isolation voltage (UGF types only)
4500
(1)
from terminals to heatsink with t = 1.0 second, RH
30%
V
ISOL
3500
(2)
V
1500
(3)
Electrical Characteristics
(T
C
= 25C unless otherwise noted)
Parameter
Symbol
UG12HT
UG12JT
Unit
Maximum instantaneous
I
F
= 12A, T
J
= 25C
V
F
1.75
V
forward voltage
(4)
I
F
= 12A, T
J
= 125C
1.50
T
J
= 25C
30
A
Maximum DC reverse current at V
RWM
T
J
= 100C
I
R
800
A
T
J
= 125C
4.0
mA
Maximum reverse recovery time at
I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
t
rr
30
ns
Maximum reverse recovery time at
t
rr
50
ns
I
F
= 1.0A, di/dt = 50A/
s, V
R
= 30V, I
rr
= 0.1 I
RM
Typical softness factor (t
b
/t
a
)
S
0.9
--
I
F
= 12A, di/dt = 240A/
s, V
R
= 400V, I
rr
= 0.1 I
RM
Maximum reverse recovery current at
I
RM
7.5
A
I
F
= 12A, di/dt = 96A/
s, V
R
= 400V, T
C
= 125C
Peak forward recovery time at
t
fr
500
ns
I
F
= 12A, di/dt = 96A/
s, V
F
= 1.1V
Thermal Characteristics
(T
C
= 25C unless otherwise noted)
Parameter
Symbol
UG12
UGF12
UGB12
Unit
Typical thermal resistance from junction to case
R
JC
1.73
3.04
1.73
C/W
Notes: (1) Clip mounting (on case), where lead does not overlap heatsink with 0.110" offset
(2) Clip mounting (on case), where leads do overlap heatsink
(3) Screw mounting with 4-40 screw, where washer diameter is
4.9 mm (0.19")
(4) Pulse test: 300
s pulse width, 1% duty cycle
Ordering Information
Product
Case
Package Code
Package Option
UG12HT & UG12JT
TO-220AC
45
Anti-Static tube, 50/tube, 2K/carton
UGF12HT & UGF12JT
ITO-220AC
45
Anti-Static tube, 50/tube, 2K/carton
31
13" reel, 800/reel, 4.8K/carton
UGB12HT & UGB12JT
TO-263AB
45
Anti-Static tube, 50/tube, 2K/carton
81
Anti-Static 13" reel, 800/reel, 4.8K/carton
0
25
50
75
100
125
150
175
0
2
4
6
8
10
12
14
16
1
10
0
25
50
75
100
125
150
175
200
100
0.01
0.1
1
10
100
1
10
100
1
10
100
25
50
50
75
100
100
150
200
250
300
350
400
125
0
0
20
40
60
80
100
1
10
100
1,000
10,000
Fig. 2 Maximum Non-Repetitive Peak
Forward Surge Current
Peak Forward Surge Current (A)
Number of Cycles at 60 H
Z
Fig. 1 Forward Current
Derating Curve
A
verage Forward Current (A)
Case Temperature (C)
Instantaneous Forward Voltage (V)
Fig. 3 Typical Instantaneous
Forward Characteristics Per Leg
Fig. 4 Typical Reverse Leakage
Characteristics Per Leg
Instantaneous Reverse Leakage
Current (
A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Current (A)
Junction Temperature (
C)
Stored Charge / Reverse Recovery T
ime
(nC/ns)
Fig. 6 Reverse Switching Characteristics
Per Leg
Reverse Voltage (V)
Junction Capacitance (pF)
Fig. 5 Typical Junction Capacitance
Per Leg
T
J
= 25
C
T
J
= 25
C
T
J
= 125
C
T
J
= 125
C
T
J
= 100
C
T
J
= 100
C
t
rr
Q
rr
UG12HT, UG12JT,
UGB12HT, UGB12JT
UGF12HT, UGF12JT
0.1
0.3
0.5
0.7
0.9
1.0
1.3
1.5
1.7
1.9
2.1
12A, 240A/
s, 400V
1A, 50A/
s, 30V
12A, 240A/
s, 400V
1A, 50A/
s, 30V
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88758
www.vishay.com
30-Jul-02
3
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
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