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Электронный компонент: FLE21-FLE24

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August 2000 Rev. 4 - ECO #13129
1
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Features
Very High Density Linear Flash Card
Supports 5V only systems
Based on AMD Flash Components
-low standby power without entering reset mode
-allows standard access from standby mode
Fast Read Performance
- 150ns Maximum Access Time
x8/ x16 Data Interface
High Performance Random Writes
- 7s Typical Word Write Time
Automated Write and Erase Algorithms
- AMD Command Set
1,000,000 Erase Cycles per Block
64K word (128kB) symmetrical Block Architecture
PC Card Standard Type I Form Factor
WEDC's PCMCIA Flash memory cards offer the
highest density, linear Flash solid state storage
solutions for code and data storage, high performance
disk emulation and execute in place (XIP) applications
in mobile PC and dedicated (embedded) equipment.
Packaged in a PCMCIA type I housing, each card
contains a connector, an array of Flash memories
packaged in TSOP packages and card control logic.
The card control logic provides the system interface
and controls the internal Flash memories. Combined
with file management software, such as Flash
Translation Layer (FTL), WEDC Flash cards provide
removable high-performance disk emulation.
The WEDC FLE series is based on AMD Flash
memories. The FLE series offers byte wide and word
wide operation, low power modes and Card
Information Structure (CIS) for easy identification of
card characteristics.
Note: Standard options include attribute memory.
Cards without attribute memory are available. Cards
are also available with or without a hardware write
protect switch.
PCMCIA Flash Memory Card 8 MEGABYTE through 64 MEGABYTE (AMD based)
WEDC's FLE series is designed to support up to twenty (see Block diagram) 32Mb components, providing a wide
range of density options. Cards are based on the Am29F032 (32Mb) device for 5V only applications. The device
code for the Am29F032 is 41h and the manufacturer's ID is 01h. Systems should be able to recognize these codes.
Cards utilizing 32Mb components provide densities ranging from 8MB to 64MB in 8MB increments.
In support of the PC Card (PCMCIA) standard for word wide access, devices are paired. Therefore, the Flash array
is structured in 64K word blocks. Write, read and block erase operations can be performed as either a word or byte
wide operation . By multiplexing A0, CE1# and CE2#, 8-bit hosts can access all data on data lines DQ0 - DQ7. The
FLE series cards conform with the PC Card Standard (formerly PCMCIA) and supported JEIDA, providing
electrical and physical compatibility. The PC Card form factor offers an industry standard pinout and mechanical
outline, allowing density upgrades without system design changes.
WEDC's standard cards are shipped with WEDC's silkscreen design. Cards are also available with blank housings
(no silkscreen). The blank housings are available in both a recessed (for label) and flat housing. Please contact your
WEDC sales representative for further information on Custom artwork.
General Description
Architecture Overview
August 2000 Rev. 4 - ECO #13129
2
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Vcc
Device (N-2)
Device 1
CSn
Device 2
CS1
CS0
Device Pair 0
Device Pair 1
Device 3
Device Pair (N/2 - 1)
RH#
DATA
BUS
Q0-Q7
I/O buffer
M Res
WH#
Vcc
DATA
BUS
D8-D15
control
Vcc
DATA
BUS
D0-D7
Device (N-1)
0000h
WL# RL#
DATA
BUS
Q8-Q15
Device 0
Q0-Q7
WH#
WL#
CSn
RL#
RH#
Q2
Qn
At/Reg enable
CS0
Q0
Control Logic
PCMCIA Interface
Ctrl
attrib. mem
CIS
EEPROM 2kB
WE#
OE#
CE2#
CE1#
REG#
A0
WP
ADDRESS BUS
Control
Address
Bus
ADDRESS
BUFFER
Array
Address
Bus
A1-A25
Block Diagram
Device type Manuf ID Device ID
Am29F032
01
H
41
H
August 2000 Rev. 4 - ECO #13129
3
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Pin Signal name I/O
Function
Active
Pin Signal name I/O
Function
Active
1
GND
Ground
35
GND
Ground
2
DQ3
I/O
Data bit 3
36
CD1#
O
Card Detect 1
LOW
3
DQ4
I/O
Data bit 4
37
DQ11
I/O
Data bit 11
4
DQ5
I/O
Data bit 5
38
DQ12
I/O
Data bit 12
5
DQ6
I/O
Data bit 6
39
DQ13
I/O
Data bit 13
6
DQ7
I/O
Data bit 7
40
DQ14
I/O
Data bit 14
7
CE1#
I
Card enable 1 LOW
41
DQ15
I
Data bit 15
8
A10
I
Address bit 10
42
CE2#
I
Card Enable 2
LOW
9
OE#
I
Output enable LOW
43
VS1
O
Voltage Sense 1
N.C.
10
A11
I
Address bit 11
44
RFU
Reserved
11
A9
I
Address bit 9
45
RFU
Reserved
12
A8
I
Address bit 8
46
A17
I
Address bit 17
13
A13
I
Address bit 13
47
A18
I
Address bit 18
14
A14
I
Address bit 14
48
A19
I
Address bit 19
15
WE#
I
Write Enable LOW
49
A20
I
Address bit 20
16 RDY/BSY# O
Ready/Busy
LOW
50
A21
I
Address bit 21
17
Vcc
Supply Voltage
51
Vcc
Supply Voltage
18
Vpp1
Prog. Voltage
N.C.
52
Vpp2
Prog. Voltage
N.C.
19
A16
I
Address bit 16
53
A22
I
Address bit 22
8MB(3)
20
A15
I
Address bit 15
54
A23
I
Address bit 23
16MB(3)
21
A12
I
Address bit 12
55
A24
I
Address bit 24
32MB(3)
22
A7
I
Address bit 7
56
A25
I
Address bit 25
64MB(3)
23
A6
I
Address bit 6
57
VS2
O
Voltage Sense 2
N.C.
24
A5
I
Address bit 5
58
RST
I
Card Reset
HIGH
25
A4
I
Address bit 4
59
Wait#
O Extended Bus cycleLOW(2)
26
A3
I
Address bit 3
60
RFU
Reserved
27
A2
I
Address bit 2
61
REG#
I
Attrib Mem Select
28
A1
I
Address bit 1
62
BVD2
O
Bat. Volt. Detect 2
(2)
29
A0
I
Address bit 0
63
BVD1
O
Bat. Volt. Detect 1
(2)
30
DQ0
I/O
Data bit 0
64
DQ8
I/O
Data bit 8
31
DQ1
I/O
Data bit 1
65
DQ9
I/O
Data bit 9
32
DQ2
I/O
Data bit 2
66
DQ10
O
Data bit 10
33
WP
O
Write Potect
HIGH
67
CD2#
O
Card Detect 2
LOW
34
GND
Ground
68
GND
Ground
Pinout
Notes:
1. RDY/BSY is an open drain output, external pull-up resistor is required.
2. Wait#, BVD1 and BVD2 are driven high for compatibility.
3. Shows density for which specified address bit is MSB. Higher order address bits are no
connects (i.e., 16MB A23 is MSB A24, A25 are NC).
MAX.
3.370
2.126
.039
.063
.400
.130
.039
Mechanical
August 2000 Rev. 4 - ECO #13129
4
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Symbol
Type
Name and Function
A0 - A25
INPUT
ADDRESS INPUTS: A0 through A25 enable direct addressing of
up to 64MB of memory on the card. Signal A0 is not used in word
access mode. A25 is the most significant bit
DQ0 - DQ15
INPUT/OUTPUT
DATA INPUT/OUTPUT: DQ0 THROUGH DQ15 constitute the
bi-directional databus. DQ15 is the MSB.
CE1#, CE2#
INPUT
CARD ENABLE 1 AND 2: CE1# enables even byte accesses, CE2#
enables odd byte accesses. Multiplexing A0, CE1# and CE2# allows
8-bit hosts to access all data on DQ0 - DQ7.
OE#
INPUT
OUTPUT ENABLE: Active low signal gating read data from the
memory card.
WE#
INPUT
WRITE ENABLE: Active low signal gating write data to the
memory card.
RDY/BSY#
OUTPUT
READY/BUSY OUTPUT: Indicates status of internally timed erase
or program algorithms. A high output indicates that the card is ready
to accept accesses. A low output indicates that one or more devices
in the memory card are busy with internally timed erase or write
activities.
CD1#, CD2#
OUTPUT
CARD DETECT 1 and 2: Provide card insertion detection. These
signals are connected to ground internally on the memory card. The
host socket interface circuitry shall supply 10K-ohm or larger pull-up
resistors on these signal pins.
WP
OUTPUT
WRITE PROTECT: Write protect reflects the status of the Write
Protect switch on the memory card. WP set to high = write protected,
providing internal hardware write lockout to the Flash array.
If card does not include optional write protect switch, this signal will
be pulled low internally indicating write protect = "off".
VPP1, VPP2
N.C.
PROGRAM/ERASE POWER SUPPLY: Not connected for 5V
only card.
VCC
CARD POWER SUPPLY: 5.0V for all internal circuitry.
GND
GROUND: for all internal circuitry.
REG#
INPUT
ATTRIBUTE MEMORY SELECT : provides access to Flash
memory card registers and Card Information Structure in the
Attribute Memory Plane.
RST
INPUT
RESET: Active high signal for placing card in Power-on default
state. Reset can be used as a Power-Down signal for the memory
array.
WAIT#
OUTPUT
WAIT: This signal is pulled high internally for compatibility. No
wait states are generated.
BVD1, BVD2
OUTPUT
BATTERY VOLTAGE DETECT: These signals are pulled high to
maintain SRAM card compatibility.
VS1, VS2
OUTPUT
VOLTAGE SENSE: Notifies the host socket of the card's VCC
requirements. VS1 and VS2 are open to indicate a 5V card has been
inserted.
RFU
RESERVED FOR FUTURE USE
N.C.
NO INTERNAL CONNECTION TO CARD: pin may be driven
or left floating
Card Signal Description
August 2000 Rev. 4 - ECO #13129
5
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Absolute Maximum Ratings
(2)
Operating Temperature TA (ambient)
Commercial
0C to +60C
Industrial
-40C to +85C **
Storage Temperature
Commercial
-30C to +80C
Industrial
-40C to +85C **
Voltage on any pin relative to V
SS
-0.5V to V
CC
+0.5V (1)
V
CC
supply Voltage relative to V
SS
-0.5V to +7.0V
Notes:
(1) During transitions, inputs may undershoot
to -2.0V or overshoot to V
CC
+2.0V for periods
less than 20ns.
(2) Stress greater than those listed under
"Absolute Maximum ratings" may cause
permanent damage to the device. This is a
stress rating only and functional operation at
these or any other conditions greater than
those indicated in the operational sections of
this specification is not implied. Exposure to
absolute maximum rating conditions for
extended periods may affect reliability.
Sym
Parameter
Density
(Mbytes)
Notes
Typ
(4)
Max
Units
Test Conditions
I
CCR
V
CC
Read Current
All
40
(5)
75
mA
V
CC
= V
CC
max
tcycle = 150ns,CMOS levels
I
CCW
V
CC
Program Current
All
30
(6)
40
(6)
mA
I
CCE
V
CC
Erase Current
All
30
(6)
40
(6)
mA
8MB
50
200
I
CCS
(CMOS)
V
CC
Standby Current
64MB
2,3
100
400
A
V
CC
= V
CC
max
Control Signals = V
CC
Reset = V
SS
, CMOS levels
Notes:
1. All currents are RMS values unless otherwise specified. ICCR, ICCW and ICCE are based on Word wide operations.
2. Control Signals: CE
1
#, CE
2
#, OE#, WE#, REG#.
3. ICCS is specified for lowest density card (8MB for two, 32Mb components) This represents a single pair of devices.
4. Typical: V
CC
= 5V, T = +25C.
5. The Icc current is typically less then 1mA/MHz per device, with with OE not active.
6. Icc active while Embedded Program or Erase algorithm is in progress. Value based on one device active.
CMOS Test Conditions: V
CC
= 5V 5%, V
IL
= V
SS
0.2V, V
IH
= V
CC
0.2V
DC Characteristics
(1)
Symbol
Parameter
Notes
Min
Max
Units
Test Conditions
I
LI
Input Leakage Current
1
20
A
V
CC
= V
CC
MAX
Vin =V
CC
or V
SS
I
LO
Output Leakage Current
1
20
A
V
CC
= V
CC
MAX
Vout =V
CC
or V
SS
V
IL
Input Low Voltage
1
0
0.8
V
V
IH
Input High Voltage
1
0.7V
CC
V
CC
+0.5
V
V
OL
Output Low Voltage
1
0.4
V
IOL = 3.2mA
V
OH
Output High Voltage
1
V
CC
-0.4
V
CC
V
IOH = -2.0mA
V
LKO
V
CC
Erase/Program
Lock Voltage
1
2.0
V
** Advanced information
Notes:
1. Values are the same for byte and word wide modes for all card densities.
2. Exceptions: Leakage currents on CE1#, CE2#, OE#, REG# and WE# will be < 500 A when VIN = GND due to
internal pull-up resistors. Leakage currents on RST will be <150A when VIN=V
CC
due to internal pull-down resistor.
August 2000 Rev. 4 - ECO #13129
6
PCMCIA Flash Memory Card
FLE Series
PC Card Products
150ns
SYM
(PCMCIA)
Parameter
Min
Max
Unit
t
C
(R)
Read Cycle Time
150
ns
t
a
(A)
Address Access Time
150
ns
t
a
(CE)
Card Enable Access Time
150
ns
t
a
(OE)
Output Enable Access Time
75
ns
t
su
(A)
Address Setup Time
20
ns
t
su
(CE)
Card Enable Setup Time
0
ns
t
h
(A)
Address Hold Time
20
ns
t
h
(CE)
Card Enable Hold Time
20
ns
t
v
(A)
Output Hold from Address Change
0
ns
t
dis
(CE)
Output Disable Time from CE#
75
ns
t
dis
(OE)
Output Disable Time from OE#
75
ns
t
en
(CE)
Output Enable Time from CE#
5
ns
t
en
(OE)
Output Enable Time from OE#
5
ns
AC Characteristics
Note: AC timing diagrams and characteristics are guaranteed to meet or exceed PCMCIA 2.1 specifications.
Read Timing Diagram
N O TE 1
N O TE 1
A[25::0], /R EG
/C E 1, /C E2
/O E
D [15::0]
tc(R )
ta(A)
th(A )
tv(A)
ta(C E )
tsu(C E )
th(C E)
ten(O E )
ta(O E )
tsu(A )
D ATA V A LID
tdis(C E)
tdis(O E )
Read Timing Parameters
Note: Signal may be high or low in this area.
August 2000 Rev. 4 - ECO #13129
7
PCMCIA Flash Memory Card
FLE Series
PC Card Products
150ns
SYM
(PCMCIA)
Parameter
Min
Max
Unit
t
C
W
Write Cycle Time
150
ns
t
w
(WE)
Write Pulse Width
80
ns
t
su
(A)
Address Setup Time
20
ns
t
su
(A-WEH)
Address Setup Time for WE#
100
ns
t
su
(CE-WEH)
Card Enable Setup Time for WE#
100
ns
t
su
(D-WEH)
Data Setup Time for WE#
50
ns
t
h
(D)
Data Hold Time
20
ns
t
rec
(WE)
Write Recover Time
20
ns
t
dis
(WE)
Output Disable Time from WE#
75
ns
t
dis
(OE)
Output Disable Time from OE#
75
ns
t
en
(WE)
Output Enable Time from WE#
5
ns
t
en
(OE)
Output Enable Time from OE#
5
ns
t
su
(OE-WE)
Output Enable Setup from WE#
10
ns
t
h
(OE-WE)
Output Enable Hold from WE#
10
ns
t
su
(CE)
Card Enable Setup Time from OE#
0
ns
t
h
(CE)
Card Enable Hold Time
20
ns
Note: AC timing diagrams and characteristics are guaranteed to meet or exceed PCMCIA 2.1 specifications.
Write Timing Diagram
Write Timing Parameters
th (O E -W E )
N O T E 1
/C E 1 , /C E 2
N O T E 1
ts u (C E -W E H )
tc ( W )
A [2 5 ::0 ], /R E G
tw (W E )
td is (W E )
th (D )
D [1 5 ::0 ](D in )
D A T A IN P U T
ts u (A )
ts u (A -W E H )
/O E
ts u (C E )
ts u ( D -W E H )
tre c (W E )
th (C E )
ts u (O E - W E )
td is (O E )
D [1 5 ::0 ](D o u t)
te n (O E )
te n ( W E )
N O T E 2
N O T E 2
/W E
Notes:
1. Signal may be high or low in this area.
2. When the data I/O pins are in the output state, no signals shall be applied to the data pins
(D15 - D0) by the host system.
August 2000 Rev. 4 - ECO #13129
8
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Data Write and Erase Performance
(1,3)
Notes:
1. Typical: Nominal voltages and T
A
= 25C.
2. Excludes system overhead.
3. Valid for all speed options.
4. To maximize system performance RDY/BSY# signal should be polled.
V
CC
= 5V 5%, T
A
= 0C to + 60C
SYM
Parameter
Notes
Min
Typ
(1)
Max
Units
Test Conditions
t
WHQV1
t
EHQV1
Word/Byte Program time
2,4
7
300
s
Excludes system-level
overhead
t
WHQV2
t
EHQV2
Block Program Time
2
0.5
2.0
sec
Block Erase Time
2
1
8
sec
Excludes 00h prog.
prior to erasure
August 2000 Rev. 4 - ECO #13129
9
PCMCIA Flash Memory Card
FLE Series
PC Card Products
EDI
Company Name
Lot code / trace number
Date code
Part number
PRODUCT MARKING
WED
7P016FLE2200C15 C995 9915
Note:
Some products are currently marked with our pre-merger company name/acronym (EDI). During our
transition period, some products will also be marked with our new company name/acronym (WED).
Starting October 2000 all PCMCIA products will be marked only with the WED prefix.
Card capacity
016 16MB
Packaging option
00
Standard, type 1
PC card
P
Standard PCMCIA
R
Ruggedized PCMCIA
Card family and version
- See Card Family and Version Info. for details (next page)
Temperature range
C Commercial 0C to +70C
I Industrial -40C to +85C
Card access time
15
150ns
25
250ns
Card technology
7
FLASH
8
SRAM
PART NUMBERING
7
P
016
FLE22
00
C
15
August 2000 Rev. 4 - ECO #13129
10
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Ordering Information
EDI7P XXX FLE 22 SS T ZZ
Based on Am29F032 for 5V only applications.
where
XXX:
008 8MB
016 16MB
024 24MB
032 32MB
040 40MB
048 48MB
056 56MB
064 64MB
SS:
00
WEDC Silkscreen
01
Blank Housing, Type I
02
Blank Housing, Type I Recessed
T:
C
Commercial
I
Industrial
ZZ:
15
150ns
Note: Options without attribute memory and with hardware write protect switch are available.
Card families:
FLE 21
- No Attribute memory, No WP switch
FLE 22
- With Attribute Memory, No WP switch
FLE 23
- No Attribute Memory, With WP switch
FLE 24
- With Attribute Memory, With WP switch
August 2000 Rev. 4 - ECO #13129
11
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Address Value
Description
Address Value
Description
00H
01H
CISTPL_DEVICE
40H
45H
E
02H
03H
TPL_LINK
42H
44H
D
04H
53H
writable)
44H
49H
I
06H
1EH
CARD SIZE: 8MB
46H
37H
7
3EH
16MB
48H
50H
P
5EH
24MB
4AH
30H
0
7EH
32MB
4CH
1)
x
9EH
40MB
4EH
1)
x
BEH
48MB
50H
46H
F
DEH
56MB
52H
4CH
L
FEH
64MB
54H
45H
E
08H
FFH
END OF DEVICE
56H
32H
2
0AH
18H
CISTPL_JEDEC_C
58H
2)
x
0CH
02H
TPL_LINK
5AH
2DH
-
0EH
01H
AMD - ID
5CH
2DH
-
10H
41H
29F032 - ID
5EH
2DH
-
12H
17H
CISTPL_DEVICE_A
60H
31H
1
14H
03H
TPL_LINK
62H
35H
5
16H
42H
EEPROM - 200ns
64H
20H
SPACE
18H
01H
Device Size = 2KBytes
66H
00H
END TEXT
1AH
FFH
END OF TUPLE
68H
43H
C
1CH
1EH
CISTPL_DEVICEGEO
6AH
4FH
O
1EH
06H
TPL_LINK
6CH
50H
P
20H
02H
DGTPL_BUS
6EH
59H
Y
22H
11H
DGTPL_EBS
70H
52H
R
24H
01H
DGTPL_RBS
72H
49H
I
26H
01H
DGTPL_WBS
74H
47H
G
28H
01H
DGTPL_PART
76H
48H
H
2AH
01H
FLASH DEVICE
78H
54H
T
NON-INTERLEAVED
7AH
20H
SPACE
2CH
20H
CISTPL_MANFID
7CH
45H
E
2EH
04H
TPL_LINK(04H)
7EH
4CH
L
30H
F6H
EDITPLMID_MANF: LSB
80H
45E
E
32H
01H
EDI PLMID_MANF: MSB
82H
43H
C
34H
00H
LSB: Number Not Assign.
84H
54H
T
36H
00H
MSB: Number Not
Assign.
86H
52H
R
38H
15H
CISTPL_VERS1
88H
4FH
O
3AH
47H
TPL_LINK
8AH
4EH
N
3CH
04H
TPLLV1_MAJOR
8CH
49H
I
3EH
01H
TPLLV1_MINOR
8EH
43H
C
90H
20H
SPACE
92H
44H
D
Address
Value
Description
94H
45H
E
96H
53H
S
98H
49H
I
9AH
47H
G
9CH
4EH
N
9EH
53H
S
A0H
20H
SPACE
A2H
49H
I
A4H
4EH
N
A6H
43H
C
A8H
4FH
O
AAH
52H
R
ACH
50H
P
AEH
4FH
O
B0H
52H
R
B2H
41H
A
B4H
54H
T
B6H
45H
E
B8H
44H
D
BAH
20H
SPACE
BCH
00H
END TEXT
BEH
31H
1
C0H
39H
9
C2H
39H
9
C4H
39H
9
C6H
00H
END TEXT
C8H
00H
END OF LIST
CIS Information for FLE Series Cards
1)
Address Value Description
4CH 30
0
31
1
32
2
33
3
34
4
36
6
4EH 30
0
32
2
34
4
36
6
38
8
2)
58H 32
2
34
4
CIS for FLE22, 150ns
August 2000 Rev. 4 - ECO #13129
12
PCMCIA Flash Memory Card
FLE Series
PC Card Products
Date of revision
Version
Description
7-Feb-98
-001
Initial release
27-May-99
-002
Logo change
31-May-00
-003
Added page 9, Heading changed on all pgs
1-Aug-00
-004
Corrected Timing Errors, pgs. 6&7
REVISION HISTORY
White Electronic Designs Corporation
One Research Drive, Westborough, MA 01581, USA
tel:
(508) 366 5151
fax: (508) 836 4850
www.whiteedc.com