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Электронный компонент: W3EG6433S-AD4

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1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
May 2005
Rev. 1
PRELIMINARY*
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
W3EG6433S-AD4
-BD4
256MB - 32Mx64 DDR SDRAM UNBUFFERED, w/PLL
DESCRIPTION
The W3EG6433S is a 32Mx64 Double Data Rate
SDRAM memory module based on 256Mb DDR
SDRAM component. The module consists of eight
32Mx8 DDR SDRAMs in 66 pin TSOP package
mounted on a 200 Pin FR4 substrate.
Synchronous design allows precise cycle control with
the use of system clock. Data I/O transactions are
possible on both edges and Burst Lenths allow the
same device to be useful for a variety of high bandwidth,
high performance memory system applications.
* This product is under development, is not qualifi ed or characterized and is subject to
change without notice.
FEATURES
DDR200, DDR266 and DDR333
Double-data-rate
architecture
Bi-directional data strobes (DQS)
Differential clock inputs (CK & CK#)
Programmable Read Latency 2,2.5 (clock)
Programmable
Burst
Length
(2,4,8)
Programmable Burst type (sequential & interleave)
Edge aligned data output, center aligned data input
Auto and self refresh
Serial presence detect
Power supply: 2.5V 0.20V
JEDEC standard 200 pin SO-DIMM package
Package height options:
AD4: 35.5mm (1.38")
BD4: 31.75mm (1.25")
NOTE: Consult factory for availability of:
Lead-Free or RoHS Products
Vendor source control options
Industrial temperature option
OPERATING FREQUENCIES
DDR333 @CL=2.5
DDR266 @CL=2
DDR266 @CL=2.5
DDR200 @CL=2
Clock Speed
166MHz
133MHz
133MHz
100MHz
CL-t
RCD
-t
RP
2.5-3-3
2-2-2
2.5-3-3
2-2-2
2
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG6433S-AD4
-BD4
May 2005
Rev. 1
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
PIN NAMES
A0 A12
Address input (Multiplexed)
BA0-BA1
Bank Select Address
DQ0-DQ63
Data Input/Output
DQS0-DQS8
Data Strobe Input/Output
CK0
Clock input
CK0#
Clock input
CKE0 Clock
Enable
Input
CS0#
Chip select Input
RAS#
Row Address Strobe
CAS#
Column Address Strobe
WE#
Write Enable
DQM0-DQM8
Data-In Mask
V
CC
Power Supply
V
CCQ
Power Supply for DQS
V
SS
Ground
V
REF
Power Supply for Reference
V
CCSPD
Serial EEPROM Power Supply
SDA
Serial data I/O
SCL
Serial clock
SA0-SA2
Address in EEPROM
V
CCID
V
CC
Identifi cation Flag
NC
No Connect
PIN CONFIGURATIONS
Pin
Symbol
Pin
Symbol
Pin
Symbol
Pin
Symbol
1
V
REF
51
V
SS
101
A9
151
DQ42
2
V
REF
52
V
SS
102
A8
152
DQ46
3
V
SS
53
DQ19
103
V
SS
153
DQ43
4
V
SS
54
DQ23
104
V
SS
154
DQ47
5
DQ0
55
DQ24
105
A7
155
V
CC
6
DQ4
56
DQ28
106
A6
156
V
CC
7
DQ1
57
V
CC
107
A5
157
V
CC
8
DQ5
58
V
CC
108
A4
158
NC
9
V
CC
59
DQ25
109
A3
159
V
SS
10
V
CC
60
DQ29
110
A2
160
NC
11
DQS0
61
DQS3
111
A1
161
V
SS
12
DQM0
62
DQM3
112
A0
162
V
SS
13
DQ2
63
V
SS
113
V
CC
163
DQ48
14
DQ6
64
V
SS
114
V
CC
164
DQ52
15
V
SS
65
DQ26
115
A10/AP
165
DQ49
16
V
SS
66
DQ30
116
BA1
166
DQ53
17
DQ3
67
DQ27
117
BA0
167
V
CC
18
DQ7
68
DQ31
118
RAS#
168
V
CC
19
DQ8
69
V
CC
119
WE#
169
DQS6
20
DQ12
70
V
CC
120
CAS#
170
DQM6
21
V
CC
71
NC
121
CS0#
171
DQ50
22
V
CC
72
NC
122
NC
172
DQ54
23
DQ9
73
NC
123
NC
173
V
SS
24
DQ13
74
NC
124
NC
174
V
SS
25
DQS1
75
V
SS
125
V
SS
175
DQ51
26
DQM1
76
V
SS
126
V
SS
176
DQ55
27
V
SS
77
DQS8
127
DQ32
177
DQ56
28
V
SS
78
DQM8
128
DQ36
178
DQ60
29
DQ10
79
NC
129
DQ33
179
V
CC
30
DQ14
80
NC
130
DQ37
180
V
CC
31
DQ11
81
V
CC
131
V
CC
181
DQ57
32
DQ15
82
V
CC
132
V
CC
182
DQ61
33
V
CC
83
NC
133
DQS4
183
DQS7
34
V
CC
84
NC
134
DQM4
184
DQM7
35
CK0
85
NC
135
DQ34
185
V
SS
36
V
CC
86
NC
136
DQ38
186
V
SS
37
CK0#
87
V
SS
137
V
SS
187
DQ58
38
V
SS
88
V
SS
138
V
SS
188
DQ62
39
V
SS
89
NC
139
DQ35
189
DQ59
40
V
SS
90
V
SS
140
DQ39
190
DQ63
41
DQ16
91
NC
141
DQ40
191
V
CC
42
DQ20
92
V
CC
142
DQ44
192
V
CC
43
DQ17
93
V
CC
143
V
CC
193
SDA
44
DQ21
94
V
CC
144
V
CC
194
SA0
45
V
CC
95
NC
145
DQ41
195
SCL
46
V
CC
96
CKE0
146
DQ45
196
SA1
47
DQS2
97
NC
147
DQS5
197
V
CCSPD
48
DQM2
98
NC
148
DQM5
198
SA2
49
DQ18
99
A12
149
V
SS
199
V
CCID
50
DQ22
100
A11
150
V
SS
200
NC
3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG6433S-AD4
-BD4
May 2005
Rev. 1
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
FUNCTIONAL BLOCK DIAGRAM
120
CK0
CK0#
DDR SDRAM
DDR SDRAM
DDR SDRAM
DDR SDRAM
DDR SDRAM
DDR SDRAM
DDR SDRAM
DDR SDRAM
PLL
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DM CS# DQS
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DM0
S0#
DM CS# DQS
DM CS# DQS
DM CS# DQS
DQS0
DM1
DQS1
DM2
DQS2
DM3
DQS3
DM4
DQS4
DM5
DQS5
DM CS# DQS
DM CS# DQS
DM CS# DQS
DM CS# DQS
DM6
DQS6
DM7
DQS7
BA0, BA1
A0-A12
RAS#
BA0, BA1: DDR SDRAMs
A0-A12: DDR SDRAMs
RAS#: DDR SDRAMs
WE#: DDR SDRAMs
CKE0: DDR SDRAMs
CAS#: DDR SDRAMs
WE#
CKE0
CAS#
V
CCSPD
V
CC
V
REF
V
SS
SPD/EEPROM
DDR SDRAMS
DDR SDRAMS
DDR SDRAMS
A0
SA0
SERIAL PD
SDA
A1
SA1
A2
SA2
WP
SCL
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
NOTE: All resistor values are 22 ohms unless otherwise specifi ed.
4
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG6433S-AD4
-BD4
May 2005
Rev. 1
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Units
Voltage on any pin relative to V
SS
V
IN
, V
OUT
-0.5 to 3.6
V
Voltage on V
CC
supply relative to V
SS
V
CC
, V
CCQ
-1.0 to 3.6
V
Storage Temperature
T
STG
-55 to +150
C
Power Dissipation
P
D
8
W
Short Circuit Current
I
OS
50
mA
Note:
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC CHARACTERISTICS
0C
T
A
70C, V
CC
= 2.5V 0.2V
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
2.3
2.7
V
Supply Voltage
V
CCQ
2.3
2.7
V
Reference Voltage
V
REF
V
CCQ/2
- 50mV
V
CCQ/2
+ 50mV
V
Termination Voltage
V
TT
V
REF
- 0.04
V
REF
+ 0.04
V
Input High Voltage
V
IH
V
REF
+ 0.15
V
CCQ
+ 0.3
V
Input Low Voltage
V
IL
-0.3
V
REF
- 0.15
V
Output High Voltage
V
OH
V
TT
+ 0.76
--
V
Output Low Voltage
V
OL
--
V
TT
- 0.76
V
CAPACITANCE
T
A
= 25C, f = 1MHz, V
CC
= 3.3V, V
REF
=1.4V 200mV
Parameter
Symbol
Max
Unit
Input Capacitance (A0-A12)
C
IN1
29
pF
Input Capacitance (RAS#, CAS#, WE#)
C
IN2
29
pF
Input Capacitance (CKE0)
C
IN3
29
pF
Input Capacitance (CK0,CK0#)
C
IN4
5.5
pF
Input Capacitance (CS0#)
C
IN5
29
pF
Input Capacitance (DQM0-DQM8)
C
IN6
8
pF
Input Capacitance (BA0-BA1)
C
IN7
29
pF
Data input/output capacitance (DQ0-DQ63)(DQS)
C
OUT
8
pF
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG6433S-AD4
-BD4
May 2005
Rev. 1
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
I
DD
SPECIFICATIONS AND TEST CONDITIONS
Recommended operating conditions, 0C T
A
70C, V
CCQ
= 2.5V 0.2V, V
CC
= 2.5V 0.2V
DDR333@CL=2.5 DDR266@CL=2, 2.5
DDR200@CL=2
Parameter
Symbol Conditions
Max
Max
Max
Units
Operating Current
I
DD0
One device bank; Active - Precharge;
t
RC
=t
RC
(MIN); t
CK
=t
CK
(MIN); DQ,DM and DQS
inputs changing once per clock cycle; Address
and control inputs changing once every two
cycles.
1275
1276
1235
mA
Operating Current
I
DD1
One device bank; Active-Read-Precharge;
Burst = 2; t
RC
=t
RC
(MIN);t
CK
=t
CK
(MIN); Iout =
0mA; Address and control inputs changing
once per clock cycle.
1635
1555
1435
mA
Precharge Power-Down
Standby Current
I
DD2P
All device banks idle; Power- down mode;
t
CK
=t
CK
(MIN); CKE=(low)
32
32
32
mA
Idle Standby Current
I
DD2F
CS# = High; All device banks idle;
t
CK
=t
CK
(MIN); CKE = high; Address and other
control inputs changing once per clock cycle.
Vin = Vref for DQ, DQS and DM.
675
635
635
mA
Active Power-Down
Standby Current
I
DD3P
One device bank active; Power-down mode;
t
CK
(MIN); CKE=(low)
240
200
240
mA
Active Standby Current
I
DD3N
CS# = High; CKE = High; One device
bank; Active-Precharge; t
RC
=t
RAS
(MAX);
t
CK
=t
CK
(MIN); DQ, DM and DQS inputs
changing twice per clock cycle; Address and
other control inputs changing once per clock
cycle.
755
675
675
mA
Operating Current
I
DD4R
Burst = 2; Reads; Continous burst; One
device bank active;Address and control inputs
changing once per clock cycle; t
CK
=t
CK
(MIN);
Iout = 0mA.
1675
1475
1475
mA
Operating Current
I
DD4W
Burst = 2; Writes; Continous burst; One
device bank active; Address and control inputs
changing once per clock cycle; t
CK
=t
CK
(MIN);
DQ,DM and DQS inputs changing twice per
clock cycle.
1675
1475
1475
mA
Auto Refresh Current
I
DD5
t
RC
=t
RC
(MIN)
2315
2155
2235
mA
Self Refresh Current
I
DD6
CKE
0.2V
307
307
307
mA
Operating Current
I
DD7A
Four bank interleaving Reads (BL=4) with auto
precharge with t
RC
=t
RC
(MIN); t
CK
=t
CK
(MIN);
Address and control inputs change only
during Active Read or Write commands.
3555
3075
3195
mA
* For DDR333 consult factory