1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
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5
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7
8
9
10
11
12
13
14
15
16
A
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
B
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
C
NC
NC
NC
A2
A1
A0
GND
GND
V
CC
V
CC
A18
A17
A16
GND
NC
NC
D
NC
NC
CS#2
A3
A4
D14
D15
NC
CS#4
D24
D25
OE#
A15
NC
NC
NC
E
NC
NC
D9
D8
A19
D12
D13
GND
V
CC
D26
D27
WE#4
D31
D30
NC
NC
F
NC
NC
D10
D11
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
D28
D29
NC
NC
G
NC
NC
WE#2
GND
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
V
CC
NC
NC
NC
H
NC
NC
GND
GND
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
NC
NC
J
NC
NC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
GND
GND
NC
NC
K NC
NC
CS#1
V
CC
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
GND
NC
NC
NC
L
NC
NC
D1
D0
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
D23
D22
NC
NC
M
NC
NC
D2
D3
A20
D7
D5
V
CC
GND
D17
D16
CS#3
D20
D21
NC
NC
N
NC
NC
WE#1
A6
A5
D6
D4
NC
WE#3
D19
D18
A14
A13
NC
NC
NC
P
NC
NC
GND
A7
A8
A9
V
CC
V
CC
GND
GND
A10
A11
A12
V
CC
NC
NC
R
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
T
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
PIN CONFIGURATION FOR W82M32V-XBX
TOP VIEW
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-20
Address Inputs
WE#1-4
Write Enables
CS#1-4
Chip Selects
OE#
Output Enable
V
CC
Power Supply
GND
Ground
NC
Not Connected
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
Low
Power
CMOS
TTL Compatible Inputs and Outputs
Fully
Static
Operation:
No clock or refresh required.
Three
State
Output.
Access Times of 12, 15, 17, 20ns
Packaging
255 PBGA, 25mm x 25mm, 625mm
2
Organized as 2Mx32
Commercial,
Industrial
and
Military
Temperature
Ranges
Low
Voltage
Operation:
3.3V
10%
Power
Supply
WE#1 CS#1
CS#2
CS#3
CS#4
WE#4
WE#3
WE#2
2M x 8
2M x 8
2M x 8
2M x 8
OE#
A0-20
I/O 0-7
I/O 24-31
I/O 16-23
I/O 8-15
8
8
8
8
BLOCK DIAGRAM
FEATURES
* This product is subject to change without notice.
2
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
CAPACITANCE
(TA = +25C)
Parameter
Symbol
Conditions Max Unit
OE# capacitance
C
OE
V
IN
= 0 V, f = 1.0 MH
Z
30 pF
WE#1-4 capacitance
C
WE
V
IN
= 0 V, f = 1.0 MH
Z
10 pF
CS#1-4 capacitance
C
CS
V
IN
= 0 V, f = 1.0 MH
Z
10 pF
Data I/O capacitance
C
I/O
V
I/O
= 0 V, f = 1.0 MH
Z
10
pF
Address input capacitance
C
AD
V
IN
= 0 V, f = 1.0 MH
Z
30
pF
TRUTH TABLE
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Operating Temperature
T
A
-55
+125
C
Storage Temperature
T
STG
-65
+150
C
Signal Voltage Relative to GND
V
G
-0.5
4.6
V
Junction Temperature
T
J
150
C
Supply Voltage
V
CC
-0.5
4.6
V
CS#
OE#
WE#
Mode
Data I/O
Power
H
X
X
Standby
High Z
Standby
L
L
H
Read
Data Out
Active
L
X
L
Write
Data In
Active
L
H
H
Out Disable
High Z
Active
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
3.0
3.6
V
Input High Voltage
V
IH
2.2
V
CC
+ 0.3
V
Input Low Voltage
V
IL
-0.3
+0.8
V
DC CHARACTERISTICS
(V
CC
= 3.3V 0.3V, -55C TA 125C)
Parameter
Sym
Conditions
Min
Max
Units
Input Leakage Current
I
LI
V
IN
= GND to V
CC
10
A
Output Leakage Current
I
LO
CS# = V
IH
, OE# = V
IH
, V
OUT
= GND to V
CC
10
A
Operating Supply Current (x 32 Mode)
I
CC
x 32
CS# = V
IL
, OE# = V
IH
, f = 5MH
Z
, V
CC
= 3.6V
1100
mA
Standby Current
I
SB
CS# = V
IH
, OE# = V
IH
, f = 5MH
Z
, V
CC
= 3.6V
400
mA
Output Low Voltage
V
OL
I
OL
= 8mA
0.4
V
Output High Voltage
V
OH
I
OH
= -4.0mA
2.4
V
NOTE: DC test conditions: V
IH
= V
CC
-0.3V, V
IL
= 0.3V.
NOTE: Contact factory for low power option.
This parameter is guaranteed by design but not tested.
3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC TEST CIRCUIT
Notes:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75 W.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit. ATE tester includes
jig capacitance.
AC TEST CONDITIONS
Parameter
Typ
Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 2.5
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
AC CHARACTERISTICS
(V
CC
= 3.3V, -55C TA +125C)
Parameter
Read Cycle
Symbol
-12
-15
-17
-20
Units
Min
Max
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
RC
12
15
17
20
ns
Address Access Time
t
AA
12
15
17
20
ns
Output Hold from Address Change
t
OH
3
3
3
3
ns
Chip Select Access Time
t
ACS
12
15
17
20
ns
Output Enable to Output Valid
t
OE
7
8
8
10
ns
Chip Select to Output in Low Z
t
CLZ
1
3
3
3
3
ns
Output Enable to Output in Low Z
t
OLZ
1
1
1
1
1
ns
Chip Disable to Output in High Z
t
CHZ
1
7
8
8
10
ns
Output Disable to Output in High Z
t
OHZ
1
7
8
8
10
ns.
AC CHARACTERISTICS
(V
CC
= 3.3V, -55C TA +125C)
Parameter
Write Cycle
Symbol
-12
-15
-17
-20
Units
Min
Max
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
WC
12
15
17
20
ns
Chip Select to End of Write
t
CW
10
12
12
14
ns
Address Valid to End of Write
t
AW
10
12
12
14
ns
Data Valid to End of Write
t
DW
8
9
9
10
ns
Write Pulse Width
t
WP
10 12
14
14
ns
Address Setup Time
t
AS
0
0
0
0
ns
Address Hold Time
t
AH
0
0
0
0
ns
Output Active from End of Write
t
OW
1
2
2
3
3
ns
Write Enable to Output in High Z
t
WHZ
1
7
8
8
9
ns
Data Hold Time
t
DH
0
0
0
0
ns
Current Source
I
OL
V
Z
1.5V
D.U.T.
C
EFF
= 50pf
Current Source
I
OH
(Bipolar Supply)
1. This parameter is guaranteed by design but not tested
1. This parameter is guaranteed by design but not tested
4
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
TIMING WAVEFORM - READ CYCLE
WRITE CYCLE - CS# CONTROLLED
WRITE CYCLE - WE# CONTROLLED
ADDRESS
DATA I/O
PREVIOUS DATA VALID
READ CYCLE 1 (CS# = OE# = VIL, WE# = VIH)
DATA VALID
t
OH
t
AA
t
RC
ADDRESS
t
RC
t
AA
CS#
OE#
DATA I/O
HIGH IMPEDANCE
READ CYCLE 2 (WE# = VIH)
DATA VALID
t
OHZ
t
CLZ
t
ACS
t
CHZ
t
OLZ
t
OE
ADDRESS
CS#
WE#
DATA I/O
WRITE CYCLE 1 WE# CONTROLLED
DATA VALID
t
WC
t
AW
t
CW
t
AH
t
WP
t
AS
t
DW
t
DH
ADDRESS
CS#
WE#
DATA I/O
WRITE CYCLE 1, WE# CONTROLLED
DATA VALID
t
WC
t
AW
t
CW
t
AH
t
WP
t
AS
t
WHZ
t
DW
t
OW
t
DH
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
0.69 (0.027) NOM
1.27
(0.050)
NOM
19.05 (0.750) NOM
25.1 (0.988) MAX
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
25.1 (0.955)
MAX
19.05 (0.750) NOM
1.27 (0.050) NOM
2.16 (0.085) MAX
BOTTOM VIEW
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
255x 0.762(0.030) NOM
PACKAGE 781: 255 BALL GRID ARRAY
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ORDERING INFORMATION
DEVICE GRADE:
M = Military
-55C to +125C
I = Industrial
-40C to +85C
C = Commercial
0C to +70C
PACKAGE TYPE:
B = 25mm x 25mm, 255 PBGA
ACCESS TIME (ns)
Low Voltage Supply 3.3V 10%
ORGANIZATION, 2Mx32
User confi gurable as 4Mx16 or 8Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W 8 2M 32 V - XX X
X
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
Document Title
2M x 32 Asynchronous SRAM
Revision History
Rev # History
Release Date
Status
Rev 0 Initial Release
July 2002
Advanced
Rev 1 Changes
October 2002
Advanced
1.1 Add AC/DC Electricals & Timing Diagrams (Pg. 1-7)
1.2 Change Pinout to full 255 (16x16) array
1.3 Change Package Dimension to full 255 (16x16) array
Rev 2 Changes (Pg.1,5,6,7)
May 2002
Advanced
2.1 Change package dimension from 27mm square to 25mm square
2.2 Change package height from 2.20mm to 2.70mm Max
Rev 3 Changes (Pg.1,5,7)
November 2003
Advanced
3.1 Change package mechanical drawing to new format.
Rev 4 Changes (Pg.1,7)
May 2004
Preliminary
4.1 Change status to preliminary.
Rev 5 Changes (Pg. 1, 7)
April 2006
Final
5.1 Change status to Final
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