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Электронный компонент: WED3DL324V-12

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1
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
White Electronic Designs
WED3DL324V
4Mx32 SDRAM
FEATURES
n
53% Space Savings vs. Monolithic Solution
n
Reduced System Inductance and Capacitance
n
Pinout and Footprint Compatible to SSRAM 119 BGA
n
3.3V Operating Supply Voltage
n
Fully Synchronous to Positive Clock Edge
n
Clock Frequencies of 133, 125 and 100MHz
n
Burst Operation
Sequential or Interleave
Burst Length = Programmable 1, 2, 4, 8 or Full Page
Burst Read and Write
Multiple Burst Read and Single Write
n
Data Mask Control Per Byte
n
Auto and Self Refresh
n
Automatic and Controlled Precharge Commands
n
Suspend Mode and Power Down Mode
n
119 Pin BGA, JEDEC MO-163
The WED3DL324V is a 4Mx32 Synchronous DRAM con-
figured as 4x1Mx32. The SDRAM BGA is constructed
with two 4Mx16 SDRAM die mounted on a multi-layer
laminate substrate and packaged in a 119 lead, 14mm
by 22mm, BGA.
The WED3DL324V is available in clock speeds of
133MHz, 125MHz and 100MHz. The range of operating
frequencies, programmable burst lengths and program-
mable latencies allow the same device to be useful for a
variety of high bandwidth, high performance memory sys-
tem applications.
The package and design provides performance enhance-
ments via a 50% reduction in capacitance vs. two mono-
lithic devices. The design includes internal ground and
power planes which reduces inductance on the ground
and power pins allowing for improved decoupling and a
reduction in system noise.
FIG. 1 PINOUT (TOP VIEW)
*NOTE:
Pin B3 is designated as NC/A
12
. This pin is used for future density upgrades as address pin A
12
.
PIN DESCRIPTION
DESCRIPTION
1
2
3
4
5
6
7
A
V
DDQ
NC
BA
0
NC
A
10
A
7
V
DDQ
A
B
NC
NC
NC/A
12
*
CAS
A
11
NC
NC
B
C
NC
NC
BA
1
V
DD
A
9
A
8
NC
C
D
DQ
C
NC
V
SS
NC
V
SS
NC
DQ
B
D
E
DQ
C
DQ
C
V
SS
CE
V
SS
DQ
B
DQ
B
E
F
V
DDQ
DQ
C
V
SS
RAS
V
SS
DQ
B
V
DDQ
F
G
DQ
C
DQ
C
DQMC
NC
DQMB
DQ
B
DQ
B
G
H
DQ
C
DQ
C
V
SS
CKE
V
SS
DQ
B
DQ
B
H
J
V
DDQ
V
DD
NC
V
DD
NC
V
DD
V
DDQ
J
K
DQ
D
DQ
D
V
SS
CLK
V
SS
DQ
A
DQ
A
K
L
DQ
D
DQ
D
DQMD
NC
DQMA
DQ
A
DQ
A
L
M
V
DDQ
DQ
D
V
SS
WE
V
SS
DQ
A
V
DDQ
M
N
DQ
D
DQ
D
V
SS
A
1
V
SS
DQ
A
DQ
A
N
P
DQ
D
NC
V
SS
A
0
V
SS
NC
DQ
A
P
R
NC
A
6
NC
V
DD
NC
A
2
NC
R
T
NC
NC
A
5
A
4
A
3
NC
NC
T
U
V
DDQ
NC
NC
NC
NC
NC
V
DDQ
U
1
2
3
4
5
6
7
A0 A11
Address Bus
BA0-1
Bank Select Addresses
DQ
Data Bus
CLK
Clock
CKE
Clock Enable
DQM
Data Input/Output Mask
RAS
Row Address Strobe
CAS
Column Address Strobe
CE
Chip Enable
VDD
Power Supply pins, 3.3V
VDDQ
Data Bus Power Supply pins,3.3V
VSS
Ground pins
Oct. 2001 Rev.1
ECO #15407
2
White Electronic Designs Corporation Westborough, MA (508) 366-5151
White Electronic Designs
WED3DL324V
FIG. 2
4MX32 SDRAM BLOCK DIAGRAM
DQMC
DQMD
DQ
B
DQ
A
DQ
8-15
DQ
0-7
DQ
8-15
DQ
0-7
ADDR
0-11
BA
0
BA
1
DQMA
DQMB
CE
RAS
CAS
WE
CLK
CKE
BA
0
BA
1
LDQM
UDQM
CS
RAS
CAS
WE
CLK
CKE
BA
0
BA
1
LDQM
UDQM
CS
RAS
CAS
WE
CLK
CKE
DQ
D
DQ
C
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
/AP
A
11
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
/AP
A
11
DQ
0-31
3
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
White Electronic Designs
WED3DL324V
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
RECOMMENDED DC OPERATING CONDITIONS
(Voltage Referenced to: V
SS
= 0V,
T
A
= 0C - 70C Commercial, -40C - 85C Industrial)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage
V
DD
/V
DDQ
3.0
3.3
3.6
V
Input High Voltage
V
IH
2.0
3.0 V
DD
+0.3
V
Input Low Voltage
V
IL
-0.3
0.8
V
Output High Voltage (I
OH
= -2mA)
V
OH
2.4
V
Output Low Voltage (I
OL
= 2mA)
V
OL
0.4
V
Input Leakage Voltage
I
IL
-5
5
A
Output Leakage Voltage
I
OL
-5
5
A
CAPACITANCE
(T
A
= 25C, f = 1MHz, V
DD
= 3.3V)
Parameter
Symbol
Min
Max
Units
Power Supply Voltage
V
DD
/V
DDQ
-1.0
+4.6
V
Input Voltage
V
IN
-1.0
+4.6
V
Output Voltage
V
OUT
-1.0
+4.6
V
Operating Temperature
T
OPR
-0
+70
C
Storage Temperature
T
STG
-55
+125
C
Power Dissipation
P
D
1.5
W
Short Circuit Output Current
I
OS
50
mA
Stress greater than those listed under "Absolute Maximum Ratings" may cause perma-
nent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions greater than those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect reliability.
Parameter
Symbol
Max
Unit
Input Capacitance
C
I1
4
pF
Input/Output Capacitance (DQ)
C
Out
5
pF
Symbol
Type
Signal
Polarity
Function
CLK
Input
Pulse
Positive Edge
The system clock input. All of the SDRAM inputs are sampled on the rising edge of the clock.
CKE
Input
Level
Active High
Activates the CLK signal when high and deactivates the CLK signal when low. By deactivating the clock, CKE low
initiates the Power Down mode, Suspend mode, or the Self Refresh mode.
CE
Input
Pulse
Active Low
CE disable or enable device operation by masking or enabling all inputs except CLK, CKE and DQM.
RAS, CAS
Input
Pulse
Active Low
When sampled at the positive rising edge of the clock, CAS, RAS, and WE define the operation to be
WE
executed by the SDRAM.
BA
0
,BA
1
Input
Level
Selects which SDRAM bank is to be active.
During a Bank Activate command cycle, A
0-11
defines the row address (RA
0-11
) when sampled at the rising clock
edge.
During a Read or Write command cycle, A
0-7
defines the column address (CA
0-7
) when sampled at the rising
A
0-11
,
clock edge. In addition to the row address, A10/AP is used to invoke Autoprecharge operation at the end of the
A
10
/AP
Input
Level
Burst Read or Write cycle. If A
10
/AP is high, autoprecharge is selected and BA
0
, BA
1
defines the bank to be
precharged . If A10/AP is low, autoprecharge is disabled.
During a Precharge command cycle, A10/AP is used in conjunction with BA0, BA1 to control which
bank(s) to precharge. If A10/AP is high, all banks will be precharged regardless of the state of BA0,
BA1. If A10/AP is low, then BA0, BA1 is used to define which bank to precharge.
DQ
Input/Output
Level
Data Input/Output are multiplexed on the same pins
The Data Input/Output mask places the DQ buffers in a high impedance state when sampled high. In Read
DQM
Input
Pulse
Mask
mode, DQM has a latency of two clock cycles and controls the output buffers like an output enable. In Write
Active High
mode, DQM has a latency of zero and operates as a word mask by allowing input data to be written if it is low
but blocks the Write operation if DQM is high.
V
DD
, V
SS
Supply
Power and ground for the input buffers and the core logic.
V
DDQ
Supply
Isolated power and ground for the output buffers to improve noise immunity.
4
White Electronic Designs Corporation Westborough, MA (508) 366-5151
White Electronic Designs
WED3DL324V
OPERATING CURRENT CHARACTERISTICS
(V
CC
= 3.3V, T
A
= 0C to +70C Commercial, -40C - 85C Industrial)
Parameter
Symbol
Conditions
-7 -8
-10
Units
Operating Current (One Bank Active) (1)
I
CC1
Burst Length = 1, t
RC
t
RC
(min), I
OL
= 0mA
250 230
200
mA
Operating Current (Burst Mode) (1)
I
CC4
Page Burst, 4 banks active, t
CCD
= 2 clocks
300 280
230
mA
Precharge Standby Current in Power Down Mode
I
CC2
P
CKE V
IL
(max), t
CC
= 15ns
2 2
2
mA
I
CC2
PS
CKE, CLK V
IL
(max), t
CC
= , Inputs Stable
2 2
2
mA
I
CC1
N
CKE = V
IH
, t
CC
= 15ns
160 160
160
mA
Input Change one time every 30ns
I
CC1
NS
CKE
V
IH
(min), t
CC
=
120 120
120
mA
No Input Change
I
CC3
P
CKE V
IL
(max), t
CC
= 15ns
12 12
12
mA
I
CC3
PS
CKE V
IL
(max), t
CC
=
12 12
12
mA
I
CC3
N
CKE = V
IH
, t
CC
= 15ns
120 120
120
mA
Input Change one time every 30ns
I
CC3
NS
CKE V
IH
(min), t
CC
= , No Input Change
90 90
90
mA
Refresh Current (2)
I
CC5
t
RC
t
RC
(min)
460 420
400
mA
Self Refresh Current
I
CC6
CKE 0.2V
6 6
6
mA
NOTES:
1. Measured with outputs open.
2. Refresh period is 64ms.
Precharge Standby Current in Non-Power Down Mode
Active Standby Current in Non-Power Down Mode
(One Bank Active)
Precharge Standby Current in Power Down Mode
5
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
White Electronic Designs
WED3DL324V
Burst Definition
Burst
Starting Column
Order of
Accesses
Within
a
Burst
Length
Address Type
=
Sequential
Type
=
Interleaved
A0
2
0
0-1
0-1
1
1-0
1-0
A1 A0
0
0
0-1-2-3
0-1-2-3
4
0
1
1-2-3-0
1-0-3-2
1
0
2-3-0-1
2-3-0-1
1
1
3-0-1-2
3-2-1-0
A2 A1 A0
0
0
0
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7
0
0
1
1-2-3-4-5-6-7-0
1-0-3-2-5-4-7-6
0
1
0
2-3-4-5-6-7-0-1
2-3-0-1-6-7-4-5
8
0
1
1
3-4-5-6-7-0-1-2
3-2-1-0-7-6-5-4
1
0
0
4-5-6-7-0-1-2-3
4-5-6-7-0-1-2-3
1
0
1
5-6-7-0-1-2-3-4
5-4-7-6-1-0-3-2
1
1
0
6-7-0-1-2-3-4-5
6-7-4-5-2-3-0-1
1
1
1
7-0-1-2-3-4-5-6
7-6-5-4-3-2-1-0
Full
n = A0-A7
Cn, Cn + 1, Cn + 2
Page
Cn + 3, Cn + 4...
Not Supported
(y)
(location 0-y)
...Cn - 1,
Cn...
M3 = 0
1
2
4
8
Reserved
Reserved
Reserved
Full Page
M3 = 1
1
2
4
8
Reserved
Reserved
Reserved
Reserved
Operating Mode
Standard Operation
All other states reserved
0
-
0
-
Defined
-
0
1
Burst Type
Sequential
Interleaved
CAS Latency
Reserved
Reserved
2
3
Reserved
Reserved
Reserved
Reserved
Burst Length
M0
0
1
0
1
0
1
0
1
Burst Length
CAS Latency
BT
A9
A7
A6
A5
A4
A3
A8
A2
A1
A0
Mode Register (Mx)
Address Bus
9
7
6
5
4
3
8
2
1
0
M1
0
0
1
1
0
0
1
1
M2
0
0
0
0
1
1
1
1
M3
M4
0
1
0
1
0
1
0
1
M5
0
0
1
1
0
0
1
1
M6
0
0
0
0
1
1
1
1
M6-M0
M8
M7
Op Mode
A10
A11
10
11
Reserved* WB
0
1
Write Burst Mode
Programmed Burst Length
Single Location Access
M9
*Should program
M11, M10 = " 0, 0"
to ensure compatibility
with future devices.
Mode Register Definition
6
White Electronic Designs Corporation Westborough, MA (508) 366-5151
White Electronic Designs
WED3DL324V
SDRAM AC CHARACTERISTICS
Symbol
133MHz
125MHz
100MHz
Parameter
Min
Max
Min
Max
Min
Max
Units
Clock Cycle Time (1)
CL = 3
t
CC
7
1000
8
1000
10
1000
ns
CL = 2
t
CC
7.5
1000
10
1000
12
1000
Clock to valid Output delay (1,2)
t
SAC
5.4
6
7
ns
Output Data Hold Time (2)
t
OH
3
3
3
ns
Clock HIGH Pulse Width (3)
t
CH
2.5
3
3
ns
Clock LOW Pulse Width (3)
t
CL
2.5
3
3
ns
Input Setup Time (3)
t
SS
1.5
2
2
ns
Input Hold Time (3)
t
SH
0.8
1
1
ns
CLK to Output Low-Z (2)
t
SLZ
1.0
1
1.5
ns
CLK to Output High-Z
t
SHZ
5.4
7
7
ns
Row Active to Row Active Delay (4)
t
RRD
14
20
20
ns
RAS to CAS Delay (4)
t
RCD
15
20
20
ns
Row Precharge Time (4)
t
RP
15
20
20
ns
Row Active Time (4)
t
RAS
37
120,000
50
120,000
50
120,000
ns
Row Cycle Time - Operation (4)
t
RC
60
70
80
ns
Row Cycle Time - Auto Refresh (4,8)
t
RFC
66
70
80
ns
Last Data in to New Column Address Delay (5)
t
CDL
1
1
1
CLK
Last Data in to Row Precharge (5)
t
RDL
2
2
2
CLK
Last Data in to Burst Stop (5)
t
BDL
1
1
1
CLK
Column Address to Column Address Delay (6)
t
CCD
1.0
1.0
1.5
CLK
Data Out to High Impedance from Precharge
CL3
t
ROH
3
3
3
CL2
t
ROH
2
2
2
CLK
NOTES:
1. Parameters depend on programmed CAS latency.
2. If clock rise time is longer than 1ns (t
rise
/2 -0.5)ns should be added to the parameter.
3. Assumed input rise and fall time = 1ns. If t
rise
of t
fall
are longer than 1ns. [(t
rise
= t
fall
)/2] - 1ns should be added to the parameter.
4. The minimum number of clock cycles required is detemined by dividing the minimum time required by the clock cycle time and then rounding up to the next higher integer.
5. Minimum delay is required to complete write.
6. All devices allow every cycle column address changes.
7. In case of row precharge interrupt, auto precharge and read burst stop.
8. A new command may be given t
RFC
after self-refresh exit.
7
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
White Electronic Designs
WED3DL324V
COMMAND TRUTH TABLE
Register
Mode Register Set
H
X
L
L
L
L
X
OP CODE
Refresh
Auto Refresh (CBR)
H
H
L
L
L
H
X
X
X
X
Entry Self Refresh
H
L
L
L
L
H
X
X
X
X
Precharge
Single Bank Precharge
H
X
L
L
H
L
X
BA
L
X
2
Precharge all Banks
H
X
L
L
H
L
X
X
H
X
Bank Activate
H
X
L
L
H
H
X
BA Row Address
2
Write
H
X
L
H
L
L
X
BA
L
Column
2
Write with Auto Precharge
H
X
L
H
L
L
X
BA
H
Column
2
Read
H
X
L
H
L
L
X
BA
L
Column
2
Read with Auto Precharge
H
X
L
H
L
H
X
BA
H
Column
2
Burst Termination
H
X
L
H
H
L
X
X
X
X
3
No Operation
H
X
L
H
H
H
X
X
X
X
Device Deselect
H
X
H
X
X
X
X
X
X
X
Clock Suspend/Standby Mode
L
X
X
X
X
X
X
X
X
X
4
Data Write/Output Disable
H
X
X
X
X
X
L
X
X
X
5
Data Mask/Output Disable
H
X
X
X
X
X
H
X
X
X
5
Power Down Mode
Entry
X
L
H
X
X
X
X
X
X
X
6
Exit
X
H
H
X
X
X
X
X
X
X
6
Function
CKE
CE
RAS
CAS
WE
DQM
BA
0-1
A
10
/AP
A
11
Notes
Previous Current
(A-D)
Cycle
Cycle
A
9-0
NOTES:
1. All of the SDRAM operations are defined by states of CE, WE, RAS, CAS, and DQM at the positive rising edge of the clock.
2. Bank selects (BA
0
-BA
1
) select 1 of 4 memory banks.
3. During a Burst Write cycle there is a zero clock delay, for a Burst Read cycle the delay is equal to the CAS latency.
4. During normal access mode, CKE is held high and CLK is enabled. When it is low, it freezes the internal clock and extends data Read and Write operations. One
clock delay is required for mode entry and exit.
5. The DQM has two functions for the data DQ Read and Write operations. During a Read cycle, when DQM goes high at a clock timing the data outputs are disabled
and become high impedance after a two clock delay. DQM also provides a data mask function for Write cycles. When it activates, the Write operation at the clock is
prohibited (zero clock latency). DQM(A-D) act on bytes DQ
0-7
, DQ
8-15
, DQ
16-23
, and DQ
24-31
respectively.
All banks must be precharged before entering the Power Down Mode. The Power Down Mode does not preform any Refresh operations, therefore the device cant remain in
this mode longer than the Refresh period (t
REF
) of the device. One clock delay is required for mode entry and exit.
8
White Electronic Designs Corporation Westborough, MA (508) 366-5151
White Electronic Designs
WED3DL324V
NOTES:
1. For the given Current State CKE must be low in the previous cycle.
2. When CKE has a low to high transition, the clock and other inputs are re-enabled asynchronously. The minimum setup time for CKE (
tCKS
) must be satisfied before
any command other than Exit is issued.
3. The address inputs (A
11-
A
0
) depend on the command that is issued. See the Idle State section of the Current State Truth Table for more information.
4. The Power Down Mode, Self Refresh Mode, and the Mode Register Set can only be entered from the all banks idle state.
Must be a legal command as defined in the Current State Truth Table.
CLOCK ENABLE (CKE
0
) TRUTH TABLE
H
X
X
X
X
X
X
X
INVALID
1
L
H
H
X
X
X
X
X
Exit Self Refresh with Device Deselect
2
L
H
L
H
H
H
X
X
Exit Self Refresh with No Operation
2
Self Refresh
L
H
L
H
H
L
X
X
ILLEGAL
2
L
H
L
H
L
X
X
X
ILLEGAL
2
L
H
L
L
X
X
X
X
ILLEGAL
2
L
L
X
X
X
X
X
X
Maintain Self Refresh
H
X
X
X
X
X
X
X
INVALID
1
Power Down
L
H
H
X
X
X
X
X
Power Down Mode exit, all banks idle
2
L
H
L
X
X
X
X
X
ILLEGAL
2
H
X
L
H
L
L
X
Maintain Power Down Mode
2
H
H
H
X
X
X
H
H
L
H
X
X
Refer to the Idle State section of the
3
H
H
L
L
H
X
Current State Truth Table
H
H
L
L
L
H
X
X
CBR Refresh
H
H
L
L
L
L
OP Code
Mode Register Set
4
All Banks Idle
H
L
H
X
X
X
H
L
L
H
X
X
Refer to the Idle State section of the
3
H
L
L
L
H
X
Current State Truth Table
H
L
L
L
L
H
X
X
Entry Self Refresh
4
H
H
L
L
L
L
OP Code
Mode Register Set
L
X
X
X
X
X
X
X
Power Down
4
H
H
X
X
X
X
X
X
Refer to the Operations in the Current
State Truth Table
Any State other
H
L
X
X
X
X
X
X
Begin Clock Suspend next cycle
5
than listed above
L
H
X
X
X
X
X
X
Exit Clock Suspend next cycle
L
L
X
X
X
X
X
X
Maintain Clock Suspend
Current State
CKE
Command
Action
Notes
Previous Current
CE
RAS
CAS
WE
BA
0-1
A
10-11
Cycle
Cycle
9
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WED3DL324V
CURRENT STATE TRUTH TABLE
L
L
L
L
OP Code
Mode Register Set
Set the Mode Register
2
L
L
L
H
X
X
Auto orSelf Refresh
Start Auto orSelf Refresh
2,3
L
L
H
L
X
X
Precharge
No Operation
L
L
H
H
BA
Row Address
Bank Activate
Activate the specified bank and row
Idle
L
H
L
L
BA
Column
Write w/o Precharge
ILLEGAL
4
L
H
L
H
BA
Column
Read w/o Precharge
ILLEGAL
2
L
H
H
L
X
X
Burst Termination
No Operation
2
L
H
H
H
X
X
No Operation
No Operation
H
X
X
X
X
X
Device Deselect
No Operation or Power Down
5
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
Precharge
6
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
2
Row Active
L
H
L
L
BA
Column
Write
Start Write; Determine if Auto Precharge
7,8
L
H
L
H
BA
Column
Read
Start Read; Determine if Auto Precharge
7,8
L
H
H
L
X
X
Burst Termination
No Operation
L
H
H
H
X
X
No Operation
No Operation
H
X
X
X
X
X
Device Deselect
No Operation
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
Terminate Burst; Start the Precharge
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Read
L
H
L
L
BA
Column
Write
Terminate Burst; Start the Write cycle
8,9
L
H
L
H
BA
Column
Read
Terminate Burst; Start a new Read cycle
8,9
L
H
H
L
X
X
Burst Termination
Terminate the Burst
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
Terminate Burst; Start the Precharge
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Write
L
H
L
L
BA
Column
Write
Terminate Burst; Start a new Write cycle
8,9
L
H
L
H
BA
Column
Read
Terminate Burst; Start the Read cycle
8,9
L
H
H
L
X
X
Burst Termination
Terminate the Burst
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
4
Read with
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Auto Precharge
L
H
L
L
BA
Column
Write
ILLEGAL
L
H
L
H
BA
Column
Read
ILLEGAL
L
H
H
L
X
X
Burst Termination
ILLEGAL
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
Current State
Command
Action
Notes
CE
RAS
CAS
WE
BA
0-1
A
11
,
Description
A
10
/AP
-
A
0
10
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WED3DL324V
CURRENT STATE TRUTH TABLE (cont.)
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
4
Write with
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Auto Precharge
L
H
L
L
BA
Column
Write
ILLEGAL
L
H
L
H
BA
Column
Read
ILLEGAL
L
H
H
L
X
X
Burst Termination
ILLEGAL
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
No Operation; Bank(s) idle after t
RP
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Precharging
L
H
L
L
BA
Column
Write w/o Precharge
ILLEGAL
4
L
H
L
H
BA
Column
Read w/o Precharge
ILLEGAL
4
L
H
H
L
X
X
Burst Termination
No Operation; Bank(s) idle after t
RP
L
H
H
H
X
X
No Operation
No Operation; Bank(s) idle after t
RP
H
X
X
X
X
X
Device Deselect
No Operation; Bank(s) idle after t
RP
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
4
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4,10
Row Activating
L
H
L
L
BA
Column
Write
ILLEGAL
4
L
H
L
H
BA
Column
Read
ILLEGAL
4
L
H
H
L
X
X
Burst Termination
No Operation; Row active after t
RCD
L
H
H
H
X
X
No Operation
No Operation; Row active after t
RCD
H
X
X
X
X
X
Device Deselect
No Operation; Row active after t
RCD
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
4
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
Write Recovering
L
H
L
L
BA
Column
Write
Start Write; Determine if Auto Precharge
9
L
H
L
H
BA
Column
Read
Start Read; Determine if Auto Precharge
9
L
H
H
L
X
X
Burst Termination
No Operation; Row active after t
DPL
L
H
H
H
X
X
No Operation
No Operation; Row active after t
DPL
H
X
X
X
X
X
Device Deselect
No Operation; Row active after t
DPL
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
4
Write Recovering
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
4
with Auto
L
H
L
L
BA
Column
Write
ILLEGAL
4,9
Precharge
L
H
L
H
BA
Column
Read
ILLEGAL
4,9
L
H
H
L
X
X
Burst Termination
No Operation; Precharge after t
DPL
L
H
H
H
X
X
No Operation
No Operation; Precharge after t
DPL
H
X
X
X
X
X
Device Deselect
No Operation; Precharge after t
DPL
Current State
Command
Action
Notes
CE
RAS
CAS
WE
BA
0-1
A
11
,
Description
A
10
/AP
-
A
0
11
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WED3DL324V
NOTES:
1. CKE is assumed to be active (high) in the previous cycle for all entries. The Current State is the state of the bank that the command is being applied to.
2. Both Banks must be idle otherwise it is an illegal action.
3. If CKE is active (high) the SDRAM starts the Auto (CBR) Refresh operation, if CKE is inactive (low) then the Self Refresh mode is entered.
4. The Current State refers only refers to one of the banks, if BA selects this bank then the action is illegal. If BA selects the bank not being referenced by the Current
State then the action may be legal depending on the state of that bank.
5. If CKE is inactive (low) than the Power Down mode is entered, otherwise there is a No Operation.
6. The minimum and maximum Active time (t
RAS
) must be satisfied.
7. The RAS to CAS Delay (t
RCD
) must occur before the command is given.
8. Address A10 is used to determine if the Auto Precharge function is activated.
9. The command must satisfy any bus contention, bus turn around, and/or write recovery requirements.
The command is illegal if the minimum bank to bank delay time (t
RRD
) is not satisfied.
CURRENT STATE TRUTH TABLE (cont.)
L
L
L
L
OP Code
Mode Register Set
ILLEGAL
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
Refreshing
L
H
L
L
BA
Column
Write
ILLEGAL
L
H
L
H
BA
Column
Read
ILLEGAL
L
H
H
L
X
X
Burst Termination
No Operation; Idle after t
RC
L
H
H
H
X
X
No Operation
No Operation; Idle after t
RC
H
X
X
X
X
X
Device Deselect
No Operation; Idle after t
RC
L
L
L
L
OP Code
Mode Register Set
Load mode register
L
L
L
H
X
X
Auto orSelf Refresh
ILLEGAL
L
L
H
L
X
X
Precharge
ILLEGAL
Mode Register
L
L
H
H
BA
Row Address
Bank Activate
ILLEGAL
Accessing
L
H
L
L
BA
Column
Write
ILLEGAL
L
H
L
H
BA
Column
Read
ILLEGAL
L
H
H
L
X
X
Burst Termination
ILLEGAL
L
H
H
H
X
X
No Operation
No Operation; Idle after two clock cycles
H
X
X
X
X
X
Device Deselect
No Operation; Idle after two clock cycles
Current State
Command
Action
Notes
CE
RAS
CAS
WE
BA
0-1
A
11
,
Description
A
10
/AP
-
A
0
12
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WED3DL324V
SINGLE BIT READ-WRITE CYCLE (SAME PAGE) @CAS LATENCY=3, BURST LENGTH=1
FIG. 3
RAS
CAS
ADDR
BA
DQM
t
SS
t
SH
A
10
/AP
CKE
CLOCK
CE
Cb
Cc
Rb
Ca
Ra
t
SH
DQ
Row Active
Precharge
Read
Write
Read
Row Active
Db
Qc
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
t
SS
t
SH
t
RCD
t
RP
t
RAS
t
RCD
t
SS
t
SH
t
SS
BS
BS
BS
BS
BS
Note 3
Note 3
Note 4
Rb
Note 3
Note 2, 3
Note 2, 3
Note 2
Note 4
Note 2, 3
Ra
BS
Qa
t
SH
t
SS
t
OH
t
SAC
t
SLZ
t
SS
t
SH
t
SS
t
SH
t
RAC
t
SS
t
SH
t
CCD
t
CH
t
CL
t
CC
DON'T CARE
Note 2
3. Enable and disable auto precharge function are controlled by A10/AP in
read/write command.
4. A10/AP and BA0~BA1 control bank precharge when precharge command is
asserted.
BA0
BA1 Active & Read/Write
0
0
Bank A
0
1
Bank B
1
0
Bank C
1
1
Bank D
NOTES:
1. All input except CKE & DQM can be don't care when CE is high at the CLK
high going edge.
2. Bank active & read/write are controlled by BA0~BA1.
BA0 BA1
Operation
0
0
Distribute auto precharge, leave bank A active at end of burst.
0
1
Disable auto precharge, leave bank B active at end of burst.
1
0
Disable auto precharge, leave bank C active at end of burst.
1
1
Disable auto precharge, leave bank D active at end of burst.
0
0
Enable auto precharge, precharge bank A at end of burst.
0
1
Enable auto precharge, precharge bank B at end of burst.
1
0
Enable auto precharge, precharge bank C at end of burst.
1
1
Enable auto precharge, precharge bank D at end of burst.
A10/AP
0
1
A10/AP BA0 BA1 Precharge
0
0
0
Bank A
0
0
1
Bank B
0
1
0
Bank C
0
1
1
Bank D
1
x
x
All Banks
13
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WED3DL324V
POWER UP SEQUENCE
FIG. 4
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Key
RAa
DQ
Mode Register Set
Row Active
(A-Bank)
Auto Refresh
Auto Refresh
Precharge
(All Banks)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
t
RP
RAa
HIGH-Z
t
RFC
t
RFC
High level is necessary
High level is necessary
DON'T CARE
14
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READ & WRITE CYCLE AT SAME BANK @BURST LENGTH=4
FIG. 5
NOTES:
1. Minimum row cycle times are required to complete internal DRAM operation.
2. Row precharge can interrupt burst on any cycle. (CAS Latency - 1) number of valid output
data is available after Row precharge. Last valid output will be Hi-Z(t
SHZ
) after the clock.
3. Access time from Row active command. t
CC
*(t
RCD
+ CAS latency - 1) + t
SAC.
4. Output will be Hi-Z after the end of burst (1, 2, 4, 8 & full page bit burst).
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Rb
Cb0
Ca0
Ra
CL = 2
DQ
Row Active
(A-Bank)
Write
(A-Bank)
Precharge
(A-Bank)
Precharge
(A-Bank)
Read
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
t
RCD
t
RC
Rb
Note 1
Ra
Qa0
t
SHZ
t
SHZ
t
RDL
t
RDL
t
RAC
t
RAC
Qa1
Qa2
Qa3
Db0
Db1
Db2
Db3
CL = 3
Qa0
Qa1
Qa2
Qa3
Db0
Db1
Db2
Db3
t
SAC
t
SAC
t
OH
t
OH
Note 3
Note 4
Note 4
Note 3
DON'T CARE
Note 2
15
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WED3DL324V
PAGE READ & WRITE CYCLE AT SAME BANK @BURST LENGTH=4
FIG. 6
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Cc0
Cd0
Ca0
Ra
CL = 2
DQ
Write
(A-Bank)
Write
(A-Bank)
Read
(A-Bank)
Precharge
(A-Bank)
Read
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
t
RCD
Ra
Qa0
t
RDL
t
CDL
Qa1
Qb0
Qb1
Qb2
Dc0
Dc1
Dd0
Dd1
CL = 3
Qa0
Qa1
Qb0
Qb1
Dc0
Dc1
Dd0
Dd1
DON'T CARE
Cb0
Note 2
Note 3
Note 1
NOTES:
1. To write data before burst read ends, DQM should be asserted three cycles prior to
write command to avoid bus contention.
2. Row precharge will interrupt writing. Last data input, t
RDL
before Row precharge, will be written.
3. DQM should mask invalid input data on precharge command cycle when asserting precharge
before end of burst. Input data after Row precharge cycle will be masked internally.
16
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WED3DL324V
PAGE READ CYCLE AT DIFFERENT BANK @BURST LENGTH=4
FIG. 7
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
CAc
CBd
CAe
RBb
CAa
RAa
CL = 2
DQ
Read
(A-Bank)
Read
(A-Bank)
Read
(B-Bank)
Row Active
(B-Bank)
Read
(B-Bank)
Precharge
(A-Bank)
Read
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
RAa
QAa2 QAa3 QBb0 QBb1 QBb2 QBb3 QAc0 QAc1 QBd0 QBd1 QAe0
QAe1
CL = 3
QAa2 QAa3
QAa0 QAa1
QAa0 QAa1
QBb0 QBb1
QBb3
QBb2
QAc0 QAc1 QBd0 QBd1 QAe0
QAe1
DON'T CARE
CBb
Note 2
Note 1
RBb
NOTES:
1. CE can be don't care when RAS, CAS and WE are high at the clock high going edge.
2. To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.
17
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WED3DL324V
PAGE WRITE CYCLE AT DIFFERENT BANK @BURST LENGTH=4
FIG. 8
NOTES:
1. To interrupt burst write by Row precharge, DQM should be asserted to mask invalid input data.
2. To interrupt burst write by Row precharge, both the write and the precharge banks must be the same.
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
CAc
CBd
RBb
CAa
RAa
DQ
Write
(A-Bank)
Write
(B-Bank)
Row Active
(B-Bank)
Write
(B-Bank)
Precharge
(Both Banks)
Write
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
RAa
DAa3 DBb0
DBb1 DBb2 DBb3 DAc0
DAc1 DBd0 DBd1
DAa1
DAa0
DAa2
DON'T CARE
CBb
Note 2
Note 1
RBb
t
RDL
t
CDL
18
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WED3DL324V
READ & WRITE CYCLE AT DIFFERENT BANK @BURST LENGTH=4
FIG. 9
NOTE:
1. t
CDL
should be met to complete write.
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
RAc
CAc
CAa
RBb
RAa
CL = 2
Read
(A-Bank)
Row Active
(A-Bank)
Read
(A-Bank)
Write
(B-Bank)
Precharge
(A-Bank)
Row Active
(B-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
RAa
QAa3
DBb0 DBb1 DBb2 DBb3
QAc0 QAc1
QAa1
QAa0
QAa2
DON'T CARE
CBb
Note 1
RAc
RBb
t
CDL
QAc2
CL = 3
DQ
QAa3
DBb0 DBb1 DBb2 DBb3
QAc0 QAc1
QAa1
QAa0
QAa2
19
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WED3DL324V
READ & WRITE CYCLE WITH AUTO PRECHARGE @BURST LENGTH=4
FIG. 10
NOTE:
1. t
CDL
should be controlled to meet minimum t
RAS
before internal precharge start.
(in the case of Burst Length=1 & 2 and BRSW mode)
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Cb
Ca
Rb
Ra
CL = 2
Auto Precharge
Start Point
(B-Bank)
Auto Precharge
Start Point
(A-Bank)
Write with
Auto Precharge
(B-Bank)
Read with
Auto Precharge
(A-Bank)
Row Active
(B-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
Ra
Qa3
Db0
Db1
Db2
Db3
Qa1
Qa0
Qa2
DON'T CARE
Rb
CL = 3
DQ
Qa3
Db0
Db1
Db2
Db3
Qa1
Qa0
Qa2
20
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WED3DL324V
CLOCK SUSPENSION & DQM OPERATION CYCLE @CAS LATENCY=2, BURST LENGTH=4
FIG. 11
NOTE:
1. DQM is needed to prevent bus contention.
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Cb
Cc
Ca
DQ
Read
Read DQM
Write
Write
DQM
Write
DQM
Clock
Suspension
Clock
Suspension
Read
Row Active
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Ra
Qa0
t
SHZ
t
SHZ
Qa1
Qa2
Qa3
Dc0
Dc2
DON'T CARE
Qb1
Qb1
Ra
Note 1
21
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WED3DL324V
READ INTERRUPTED BY PRECHARGE COMMAND & READ BURST STOP
@BURST LENGTH=FULL PAGE
FIG. 12
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
CAb
CAa
RAa
CL = 2
Precharge
(A-Bank)
Read
(A-Bank)
Burst Stop
Read
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
DON'T CARE
RAa
QAa0 QAa1 QAa2 QAa3 QAa4
QAb1
QAb0
QAb3
QAb2
QAb5
QAb4
CL = 3
DQ
QAa0 QAa1 QAa2 QAa3 QAa4
QAb1
QAb0
QAb3
QAb2
QAb5
QAb4
Note 2
1
1
2
2
NOTES:
1. At full page mode, burst is end at the end of burst. So auto precharge is possible.
2. About the valid DQs after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated in above timing diagram. See the label 1, 2.
But at burst write, Burst stop and RAS interrupt should be compared carefully.
Refer to the timing diagram of "Full page write burst stop cycle."
3. Burst stop is valid at every burst length.
22
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WED3DL324V
WRITE INTERRUPTED BY PRECHARGE COMMAND & WRITE BURST STOP CYCLE
@BURST LENGTH=FULL PAGE
FIG. 13
NOTES:
1. At full page mode, burst is end at the end of burst. So auto precharge is possible.
2. Data-in at the cycle of interrupted by precharge cannot be written into the corresponding
memory cell. It is defined by AC parameter of t
RDL
.
DQM at write interrupted by precharge command is needed to prevent invalid write.
DQM should mask invalid input data on precharge command cycle when asserting
precharge before end of burst. Input data after Row precharge cycle will be masked internally.
3. Burst stop is valid at every burst length.
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
CAb
CAa
RAa
DQ
Precharge
(A-Bank)
Write
(A-Bank)
Burst Stop
Write
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
DON'T CARE
RAa
DAa0 DAa1 DAa2 DAa3 DAa4
DAb1
DAb0
DAb3
DAb2
DAb5
DAb4
Note 2
t
RDL
t
BDL
23
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White Electronic Designs
WED3DL324V
BURST READ SINGLE BIT WRITE CYCLE @BURST LENGTH=2
FIG. 14
NOTES:
1. BRSW mode is enabled by setting A
9
"High" at MRS (Mode Register Set). At the
BRSW Mode, the burst length at write is fixed to "1" regardless of programmed burst length.
2. When BRSW write command with auto precharge is executed, keep it in mind that t
RAS
should not be violated. Auto precharge is executed at the burst-end cycle, so in the case
of BRSW write command, the next cycle starts the precharge.
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
CBc
CAd
RBb
CAa
RAa
CL = 2
Row Active
(A-Bank)
Read
(A-Bank)
Row Active
(B-Bank)
Write with
Auto Precharge
(B-Bank)
Precharge
(Both Banks)
Write
(A-Bank)
Read with
Auto Precharge
(A-Bank)
Row Active
(A-Bank)
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
HIGH
RAa
QAb0 QAb1
DBc0
QAd0 QAd1
DAa0
DON'T CARE
CAb
Note 2
RBb
RAc
RAc
CL = 3
DQ
QAb0 QAb1
DBc0
QAd0 QAd1
DAa0
Note 1
24
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WED3DL324V
ACTIVE/PRECHARGE POWER DOWN MODE @CAS LATENCY=2, BURST LENGTH=4
FIG. 15
NOTES:
1. Both banks should be in idle state prior to entering precharge power down mode.
2. CKE should be set high at least 1 CLK + t
SS
prior to Row active command.
3. Cannot violate minimum refresh specification (64ms).
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
Ra
Ca
DQ
Precharge
Read
Row Active
Precharge
Power-Down
Entry
Precharge
Power-Down
Exit
Active
Power-Down
Entry
Active
Power-Down
Exit
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Note 3
Note 2
t
SS
DON'T CARE
t
SS
t
SS
t
SHZ
Note 1
Ra
Qa1
Qa0
Qa2
25
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White Electronic Designs
WED3DL324V
SELF REFRESH ENTRY & EXIT CYCLE
FIG. 16
RAS
CAS
ADDR
BA
DQM
A
10
/AP
CKE
CLOCK
CE
DQ
Auto Refresh
Self Refresh Entry
Self Refresh Exit
WE
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
t
SS
DON'T CARE
Note 1
Note 3
Note 4
t
RFC
min
Note 6
Note 5
Note 7
HI-Z
HI-Z
Note 2
NOTES:
TO ENTER SELF REFRESH MODE
1. CE, RAS & CAS with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don't care except for CKE.
3. The device remains in self refresh mode as long as CKE stays "Low."
Once the device enters self refresh mode, minimum t
RAS
is required before exit from self refresh.
TO EXIT SELF REFRESH MODE
4. System clock restart and be stable before returning CKE high.
5. CE starts from high.
6. Minimum t
RFC
is required after CKE going high to complete self refresh exit.
7. 4K cycle of burst auto refresh is required before self refresh entry and after self refresh exit if the system uses burst refresh.
26
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White Electronic Designs
WED3DL324V
AUTO REFRESH CYCLE
FIG. 17
MODE REGISTER SET CYCLE
FIG. 18
RAS
CAS
ADDR
DQM
CKE
CLOCK
CE
Ra
Key
DQ
New Command
New
Command
Auto Refresh
MRS
WE
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
9
10
DON'T CARE
t
RFC
HI-Z
HI-Z
Note 2
Note 1
Note 3
HIGH
HIGH
NOTES:
Both banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.
MODE REGISTER SET CYCLE
1. CE, RAS, CAS, & WE activation at the same clock cycle with address key will set internal mode register.
2. Minimum 2 clock cycles should be met before new RAS activation.
3. Please refer to Mode Register Set table.
27
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WED3DL324V
ORDERING INFORMATION
PART NUMBER
CLOCK FREQUENCY
PACKAGE
OPERATING RANGE
WED3DL324V7BC
133MHZ
119 BGA
COMMERCIAL
WED3DL324V8BC
125MHZ
119 BGA
COMMERCIAL
WED3DL324V10BC
100MHZ
119 BGA
COMMERCIAL
WED3DL324V7BI
133MHZ
119 BGA
INDUSTRIAL
WED3DL324V8BI
125MHZ
119 BGA
INDUSTRIAL
WED3DL324V10BI
100MHZ
119 BGA
INDUSTRIAL
PACKAGE DESCRIPTION
2.79 (0.110)
MAX
0.711 (0.028)
MAX
1.27 (0.050)
TYP
1.27 (0.050) TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
14.00 (0.551) TYP
A1
CORNER
20.32 (0.800)
TYP
22.00 (0.866)
TYP
7.62 (0.300)
TYP
R 1.52 (0.060)
MAX (4x)
Note:
Ball attach pad for above BGA package is 480 microns in diameter.
Pad is solder mask defined.