1
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
HI-RELIABILITY PRODUCT
1Mx32 5V FLASH MODULE
ADVANCED*
s Organized as 1Mx32, user configurable as 2Mx16 or 4Mx8.
s Commercial, Industrial and Military Temperature Ranges
s 5V
10% for Read and Write Operations.
s Low Power CMOS
s Embedded Erase and Program Algorithm
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WEDF1M32B-XG2TX5 - 8 grams typical
WEDF1M32B-XHX5 - 13 grams typical
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
FEATURES
s Access Times of 70, 90, 120ns
s Packaging:
66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP
(Package 401)
68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),
(Package 509)
s Sector Architecture
One 16KByte Sectors
Two 8KByte Sectors
One 32KByte Sectors
Fifteen 64KByte Sectors
s 1,000,000 Erase/Program Cycles
WEDF1M32B-XXX5
May 1999 Rev. 1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
RESET
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
A
19
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
17
WE
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
V
CC
CS
4
NC
I/O
27
A
4
A
5
A
6
NC
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
11 22 33 44 55 66
1 12 23 34 45 56
FIG. 1
PIN CONFIGURATION FOR WEDF1M32B-XHX5
PIN DESCRIPTION
TOP VIEW
I/O
0-31
Data Inputs/Outputs
A
0-19
Address Inputs
WE
Write Enable
CS
1-4
Chip Selects
OE
Output Enable
RESET
Reset
V
CC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
1M x 8
8
I / O
0 - 7
CS
1
1M x 8
8
I / O
8 - 1 5
CS
2
1M x 8
8
I / O
1 6 - 2 3
CS
3
1M x 8
8
I / O
2 4 - 3 1
CS
4
A 0 - 1 9
O E
W E
R E S E T
2
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WEDF1M32B-XXX5
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
1
OE
CS
2
A
17
WE
2
WE
3
WE
4
A
18
A
19
NC
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
RESET
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
GND
CS
4
WE
1
A
6
A
7
A
8
A
9
A
10
V
CC
FIG. 2
PIN CONFIGURATION FOR WEDF1M32B-XG2TX5
TOP VIEW
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
0.940"
1M x 8
8
I / O
0 - 7
1M x 8
8
I / O
8 - 1 5
1M x 8
8
I / O
1 6 - 2 3
1M x 8
8
I / O
2 4 - 3 1
CS
4
A 0 - 1 9
O E
RESET
CS
3
CS
2
CS
1
WE
4
WE
3
WE
2
WE
1
BLOCK DIAGRAM
PIN DESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-19
Address Inputs
WE
1-4
Write Enables
CS
1-4
Chip Selects
OE
Output Enable
RESET
Reset
V
CC
Power Supply
GND
Ground
NC
Not Connected
3
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WEDF1M32B-XXX5
FIG. 3
AC TEST CIRCUIT
NOTES:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z
0
= 75
.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
AC TEST CONDITIONS
I
Current Source
D.U.T.
C = 50 pf
eff
I
OL
V
1.5V
(Bipolar Supply)
Z
Current Source
OH
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
4.5
5.5
V
Input High Voltage
V
IH
2.0
V
CC
+ 0.5
V
Input Low Voltage
V
IL
-0.5
+0.8
V
Operating Temp. (Mil.)
T
A
-55
+125
C
Parameter
Typ
Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
CAPACITANCE
(T
A
= +25
C)
Parameter
Symbol
Conditions
Max
Unit
OE capacitance
C
OE
V
IN
= 0 V, f = 1.0 MHz
50
pF
WE
1-4
capacitance
C
WE
V
IN
= 0 V, f = 1.0 MHz
20
pF
CS
1-4
capacitance
C
CS
V
IN
= 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
C
I/O
V
I/O
= 0 V, f = 1.0 MHz
20
pF
Address input capacitance
C
AD
V
IN
= 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
ABSOLUTE MAXIMUM RATINGS
NOTES:
1. Minimum DC voltage is -0.5V on input/output pins. During transitions, this
level may undershoot to -2.0V for periods <20ns. Maximum DC voltage on
input/output pins is V
CC
+ 0.5V which, during transitions, may overshoot to
V
CC
+ 2.0V for periods <20ns.
2. Minimum DC input voltage on pins A
9
, OE, and RESET is -0.5V. During
voltage transitions, A
9
, OE, and RESET may undershoot Vss to -2.0V for
periods of up to 20ns. See Figure 6. Maximum DC input voltage on pin A
9
is
+12.5V which may overshoot to +13.5V for periods up to 20ns.
3. Output shorted for no more than one second. No more than one output
shorted at a time.
Stresses above those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a Stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Parameter
Unit
Voltage on Any Pin with Respect to
-0.5 to +7.0
V
GND V
CC
and V
PP
)
Voltage with Respect to GND
-2.0 to +12.5
V
A
9
, OE, and RESET (2)
Voltage with Respect to GND
-2.0 to +7.0
V
All other pins (1)
Output Short Circuit Current
200
mA
DATA RETENTION
Parameter
Test Conditions
Min
Unit
Minimum Pattern Data
150
C
10
Years
Retention Time
125
C
20
Years
4
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
DC CHARACTERISTICS - CMOS COMPATIBLE
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
NOTES:
1. The Icc current listed is typically less than 2mA/MHz, with OE at V
IH
.
2. Maximum Icc specifications are tested with V
CC
= V
CC
max.
3. I
CC
active while Embedded Erase or Embedded Program is in progress.
4. Not 100% tested.
5. I
CC3
= 20
A max at extended temperature (> +85
C).
Parameter
Symbol
Conditions
Min
Max
Unit
Input Leakage Current
I
LI
V
IN
= V
CC
to GND
10
A
Output Leakage Current
I
LO
V
OUT
= V
CC
to GND
10
A
V
CC
Read Current (1,2)
I
CC1
CS = V
IL
, OE V
IH
, f = 5 MHz, I
OUT
= 0mA
160
mA
V
CC
Write Current (2,3,4)
I
CC2
CS = V
IL
, OE V
IH
200
mA
V
CC
Standby Current (2,5)
I
CC3
CS = RESET = OE = V
IH
, f = 5MHz
20.0
mA
Output Low Voltage
V
OL
V
CC
= 4.5, I
OL
= 5.8 mA
0.45
V
Output High Voltage
V
OH
V
CC
= 4.5, I
OH
= -2.5 mA
2.4
V
Low V
CC
Lockout Voltage (4)
V
LKO
3.2
4.2
V
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS - WE CONTROLLED
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
Parameter
Symbol
-70
-90
-120
Unit
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
AVAV
t
WC
70
90
120
ns
Chip Select Setup Time
t
ELWL
t
CS
0
0
0
ns
Write Enable Pulse Width
t
WLWH
t
WP
35
45
50
ns
Address Setup Time
t
AVWH
t
AS
0
0
0
ns
Data Setup Time
t
DVWH
t
DS
30
45
50
ns
Data Hold Time
t
WHDX
t
DH
0
0
0
ns
Address Hold Time
t
WHAX
t
AH
45
45
50
ns
Chip Select Hold Time
t
WHEH
t
CH
0
0
0
ns
Write Enable Pulse Width High
t
WHWL
t
WPH
20
20
20
ns
Programming Operation (2)
t
WHWH1
300
300
300
s
Sector Erase Operation (3)
t
WHWH2
8
8
8
sec
Write Recovery before Read
t
WHGL
0
0
0
s
Chip Programming Time
50
50
50
sec
NOTES:
1. Guaranteed by design, not tested.
2. Typical value for t
WHWH1
is 7
s.
3. Typical value for t
WHWH2
is 1sec.
WEDF1M32B-XXX5
5
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
NOTES:
1. Typical value for t
WHWH1
is 7
s.
2. Typical value for t
WHWH2
is 1sec.
Parameter
Symbol
-70
-90
-120
Unit
Min
Max
Min
Max
Min
Max
Write Enable Cycle Time
t
AVAV
t
WC
70
90
120
ns
Write Enable Setup Time
t
WLEL
t
WS
0
0
0
ns
Chip Select Pulse Width
t
ELEH
t
CP
35
45
50
ns
Address Setup Time
t
AVEH
t
AS
0
0
0
ns
Data Setup Time
t
DVEH
t
DS
30
45
50
ns
Data Hold Time
t
EHDX
t
DH
0
0
5
ns
Address Hold Time
t
EHAX
t
AH
45
45
50
ns
Write Enable Hold Time
t
EHWH
t
WH
0
0
0
ns
Chip Select Pulse Width High
t
EHEL
t
EPH
20
20
20
ns
Programming Operation (1)
t
WHWH1
300
300
300
s
Sector Erase Operation (2)
t
WHWH2
8
8
8
sec
Write Recovery before Read
t
EHGL
0
0
0
s
AC CHARACTERISTICS WRITE OPERATION - CS CONTROLLED
(1)
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
AC CHARACTERISTICS READ-ONLY OPERATIONS
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
Parameter
Symbol
-70
-90
-120
Unit
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
AVAV
t
RC
70
90
120
ns
Address Access Time
t
AVQV
t
ACC
70
90
120
ns
Chip Select to Output Valid (1)
t
ELQV
t
CE
70
90
120
ns
Output Enable to Output Valid (1)
t
GLQV
t
OE
30
35
50
ns
Chip Select to Output Low Z (2)
t
ELQX
t
LZ
0
0
0
ns
Chip Select High to Output High Z (2)
t
EHQZ
t
HZ
20
20
50
ns
Output Enable to Output Low Z (2)
t
GLOX
t
OLZ
0
0
0
ns
Output Enable High to Output High Z (2)
t
GHQZ
t
DF
20
20
30
ns
Output Hold from Addresses, CS or OE
t
OH
0
0
0
ns
Change, Whichever is First (2)
NOTES:
1. OE may be delayed up to t
CE
-t
OE
after the falling edge of CS without impact on t
CS
.
2. Guaranteed by design, not tested.
WEDF1M32B-XXX5
6
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
PACKAGE 509:
68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
0.05 (0.002)
0.27 (0.011)
0.04 (0.002)
25.15 (0.990)
0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
0.26 (0.010)
22.36 (0.880)
0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
0.127 (0.005)
0.25 (0.010) REF
1
/ 7
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
WEDF1M32B-XXX5
7
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
PACKAGE 401:
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H)
30.1 (1.185)
0.38 (0.015) SQ
25.4 (1.0) TYP
15.24 (0.600) TYP
0.76 (0.030)
0.1 (0.005)
6.22 (0.245)
MAX
3.81 (0.150)
0.1 (0.005)
2.54 (0.100)
TYP
25.4 (1.0) TYP
1.27 (0.050)
0.1 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018)
0.05 (0.002) DIA
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
WEDF1M32B-XXX5
8
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
V
PP
PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
M = Military Screened
-55
C to +125
C
I = Industrial
-40
C to +85
C
C = Commercial
0
C to +70
C
PACKAGE TYPE:
H = Ceramic Hex-In-Line Package, HIP (Package 401)
G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
Bottom Boot Block
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
WED F 1M32 B - XXX X X 5 X
WEDF1M32B-XXX5
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