1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
V
CC
CS
4
#
WE
4
#
I/O
27
A
4
A
5
A
6
WE
3
#
CS
3
#
GND
I/O
19
128K
X
32 5V FLASH MODULE, SMD 5962-94716
FEATURES
Access Times of 50**, 60, 70, 90, 120, 150ns
Packaging:
66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 3.56mm (0.140 inch) high
(Package 510)
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880 inch) square, 4.06mm (0.160 inch) high
(Package 528)
Sector Architecture
8 equal size sectors of 16KBytes each
Any combination of sectors can be concurrently
erased. Also supports full chip erase
100,000 Erase/Program Cycles Typical, 0C to
+70C
Organized as 128Kx32
FIGURE 1 PIN CONFIGURATION FOR WF128K32N-XH1X5
Pin Description
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V 10% Supply
Low Power CMOS, 1mA Standby Typical
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Page Program Operation and Internal Program
Control Time
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note: For programming information refer to Flash Programming 1M5 Application Note.
* This product is subject to change without notice.
* * The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
Block Diagram
WE
1
# CS
1
#
CS
2
#
CS
3
#
CS
4
#
WE
4
#
WE
3
#
WE
2
#
128K x 8
128K x 8
128K x 8
128K x 8
OE#
A
0-16
I/O
0-7
I/O
24-31
I/O
16-23
I/O
8-15
8
8
8
8
Top View
I/O
0-31
Data Inputs/Outputs
A
0-16
Address Inputs
WE
1-4
#
Write Enables
CS
1-4
#
Chip Selects
OE#
Output Enable
V
CC
Power Supply
GND Ground
NC
Not Connected
2
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PIN DESCRIPTION
FIGURE 3 PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5
BLOCK DIAGRAM
TOP VIEW
WE
1
# CS
1
#
CS
2
#
CS
3
#
CS
4
#
WE
4
#
WE
3
#
WE
2
#
128K x 8
128K x 8
128K x 8
128K x 8
OE#
A
0-16
I/O
0-7
I/O
24-31
I/O
16-23
I/O
8-15
8
8
8
8
I/O
0-31
Data Inputs/Outputs
A
0-16
Address Inputs
WE
1-4
#
Write Enables
CS
1-4
#
Chip Selects
OE#
Output Enable
V
CC
Power Supply
GND Ground
NC
Not Connected
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
1
#
OE#
CS
2
#
NC
WE
4
#
WE
3
#
WE
2
#
NC
NC
NC
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
#
GND
CS
4
#
WE
1
#
A
6
A
7
A
8
A
9
A
10
V
CC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
9 8 7 6 5 4 3 2 1 68 67
66 65
64
63
62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
ABSOLUTE MAXIMUM RATINGS (1)
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to
the device. Extended operation at the maximum levels may degrade performance
and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,
inputs may overshoot V
SS
to -2.0 V for periods of up to 20ns. Maximum DC
voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs
may overshoot to V
CC
+ 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9
is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
NOTES:
1. The
I
CC
current listed includes both the DC operating current and the frequency
dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
4.5
5.5
V
Input High Voltage
V
IH
2.0
V
CC
+ 0.3
V
Input Low Voltage
V
IL
-0.5
+0.8
V
Operating Temp. (Mil.)
T
A
-55
+125
C
A9 Voltage for Sector Protect
V
ID
11.5
12.5
V
Parameter
Unit
Operating Temperature
-55 to +125
C
Supply Voltage Range (V
CC
)
-2.0 to +7.0
V
Signal voltage range (any pin except A9) (2)
-2.0 to +7.0
V
Storage Temperature Range
-65 to +150
C
Lead Temperature (soldering, 10 seconds)
+300
C
Data Retention Mil Temp
10 years
Endurance (write/erase cycles) Mil Temp
10,000 cycles min.
A
9
Voltage for sector protect (V
ID
) (3)
-2.0 to +14.0
V
Parameter
Symbol
Conditions
Min
Max
Unit
Input Leakage Current
I
LI
V
CC
= 5.5, V
IN
= GND to V
CC
10
A
Output Leakage Current
I
LOx32
V
CC
= 5.5, V
IN
= GND to V
CC
10
A
V
CC
Active Current for Read
(1)
I
CC1
CS# = V
IL
, OE# = V
IH
140
mA
V
CC
Active Current for Program or
Erase
(2)
I
CC2
CS# = V
IL
, OE# = V
IH
200
mA
V
CC
Standby Current
I
CC3
V
CC
= 5.5, CS# = V
IH
, f = 5MHz
6.5
mA
V
CC
Static Current
I
CC4
V
CC
= 5.5, CS# = V
IH
0.6
mA
Output Low Voltage
V
OL
I
OL
= 8.0 mA, V
CC
= 4.5
0.45
V
Output High Voltage
V
OH1
I
OH
= -2.5 mA, V
CC
= 4.5
0.85 x
VCC
V
Output High Voltage
V
OH2
I
OH
= -100 A, V
CC
= 4.5
VCC
-0.4
V
Low V
CC
Lock Out Voltage
V
LKO
3.2
V
CAPACITANCE
Ta = +25C
Parameter
Symbol
Conditions Max Unit
OE# capacitance
C
OE
V
IN
= 0V, f = 1.0 MHz
50
pF
WE
1-4
# capacitance
HIP (PGA) H1
C
WE
V
IN
= 0V, f = 1.0 MHz
20
pF
CQFP G2U/G2L
15
CS
1-4
# capacitance
C
CS
V
IN
= 0V, f = 1.0 MHz
20
pF
Data# I/O capacitance
C
I/O
V
I/O
= 0V, f = 1.0 MHz
20
pF
Address input capacitance
C
AD
V
IN
= 0V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS CMOS COMPATIBLE
V
CC
= 5.0V, V
SS
= 0V, -55C T
A
+125C
4
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED
V
CC
= 5.0V, V
SS
= 0V, -55C T
A
+125C
FIGURE 4 AC TEST CIRCUIT
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
AVAV
t
WC
50
60
70
90
120
150
ns
WE# Setup Time
t
WLEL
t
WS
0
0
0
0
0
0
ns
CS# Pulse Width
t
ELEH
t
CP
25
30
35
45
50
50
ns
Address Setup Time
t
AVEL
t
AS
0
0
0
0
0
0
ns
Data Setup Time
t
DVEH
t
DS
25
30
30
45
50
50
ns
Data Hold Time
t
EHDX
t
DH
0
0
0
0
0
0
ns
Address Hold Time
t
ELAX
t
AH
40
45
45
45
50
50
ns
WE# Hold from WE# High
t
EHWH
t
WH
0
0
0
0
0
0
ns
CS# Pulse Width High
t
EHEL
t
CPH
20
20
20
20
20
20
ns
Duration of Programming Operation
t
WHWH1
14
14
14
14
14
14
s
Duration of Erase Operation
t
WHWH2
2.2
60
2.2
60
2.2
60
2.2
60
2.2
60
2.2
60
sec
Read Recovery before Write
t
GHEL
0
0
0
0
0
0
ns
Chip Programming Time
12.5
12.5
12.5
12.5
12.5
12.5
sec
Notes:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75 .
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
AC Test Conditions
Parameter
Typ
Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
V
CC
= 5.0V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
AVAV
t
WC
50
60
70
90
120
150
ns
Chip Select Setup Time
t
ELWL
t
CS
0
0
0
0
0
0
ns
Write Enable Pulse Width
t
WLWH
t
WP
25
30
35
45
50
50
ns
Address Setup Time
t
AVWL
t
AS
0
0
0
0
0
0
ns
Data Setup Time
t
DVWH
t
DS
25
30
30
45
50
50
ns
Data Hold Time
t
WHDX
t
DH
0
0
0
0
0
0
ns
Address Hold Time
t
WLAX
t
AH
40
45
45
45
50
50
ns
Chip Select Hold Time
t
WHEH
t
CH
0
0
0
0
0
0
ns
Write Enable Pulse Width High
t
WHWL
t
WPH
20
20
20
20
20
20
ns
Duration of Byte Programming Operation
(min)
t
WHWH1
14
14
14
14
14
14
s
Sector Erase Time
t
WHWH2
2.2
60
2.2
60
2.2
60
2.2
60
2.2
60
2.2
60
sec
Read Recovery Time Before Write
t
GHWL
0
0
0
0
0
0
ns
V
CC
Setup Time
t
VCS
50
50
50
50
50
50
s
Chip Programming Time
12.5
12.5
12.5
12.5
12.5
12.5
sec
Output Enable Setup Time
t
OES
0
0
0
0
0
0
ns
Output Enable Hold Time (1)
t
OEH
10
10
10
10
10
10
ns
1. For Toggle and Data Polling.
AC CHARACTERISTICS READ ONLY OPERATIONS
V
CC
= 5.0V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
AVAV
t
RC
50
60
70
90
120
150
ns
Address Access Time
t
AVQV
t
ACC
50
60
70
90
120
150
ns
Chip Select Access Time
t
ELQV
t
CE
50
60
70
90
120
150
ns
OE# to Output Valid
t
GLQV
t
OE
25
30
35
40
50
55
ns
Chip Select to Output High Z (1)
t
EHQZ
t
DF
20
20
20
25
30
35
ns
OE# High to Output High Z (1)
t
GHQZ
t
DF
20
20
20
25
30
35
ns
Output Hold from Address, CS# or OE#
Change, whichever is fi rst
t
AXQX
t
OH
0
0
0
0
0
0
ns
1. Guaranteed by design, not tested.
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 5 AC WAVEFORMS FOR READ OPERATIONS
Addresses
Addresses Stable
Output Valid
D
X
D
X
High Z
High Z
t
ACC
t
OE
t
OH
t
DF
t
CE
t
RC
Outputs
CS1#/CS2#
OE#
WE#
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 6 WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D
7
# is the output of the complement of the data written to the device (for each chip).
4. D
OUT
is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
Addresses
5555H
PA
PA
Data# Polling
t
AS
t
AH
t
WC
t
GHWL
t
CS
t
DS
t
WP
t
WPH
t
WHWH1
t
DH
AOH
PD
D
7
#
t
RC
t
OE
t
DF
t
OH
t
CE
D
OUT
CS#
OE#
WE#
Data
5.0 V
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 7 AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
Notes:
1. SA is the sector address for Sector Erase.
Addresses
5555H
5555H
5555H
2AAAH
2AAAH
SA
t
AS
t
AH
t
GHWL
t
WP
t
WPH
t
DH
AAH
55H
80H
AAH
55H
10H/30H
t
CS
t
DS
t
VDS
CS#
OE#
WE#
Data
V
CC
9
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 8
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
CS#
OE#
WE#
D0-D6
D7
D7#
D0-D6 = Invalid
D7 =
Valid Data
High Z
D0-D7
Valid Data
Data
t
CH
t
OEH
t
OE
t
OE
t
OH
t
DF
t
CE
t
WHWH 1 or 2
10
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
FIGURE 9 WRITE/ERASE/PROGRAM OPERATION, CS# CONTROLLED
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D
7
# is the output of the complement of the data written to the device (for each chip).
4. D
OUT
is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
Addresses
5555H
PA
PA
Data# Polling
t
AS
t
AH
t
WC
t
GHEL
t
WS
t
DS
t
CP
t
CPH
t
WHWH1
t
DH
AOH
PD
D
7
#
D
OUT
WE#
OE#
CS#
Data
5.0 V
11
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
12
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
The White 68 lead G2U CQFP fi lls the same fi t
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
o
o
13
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White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
25.15 (0.990) 0.25 (0.010) MAX
22.36 (0.880) 0.25 (0.010) MAX
20.31 (0.800) REF
0.38 (0.015) 0.05 (0.002)
1.27 (0.050) TYP
5.10 (0.200) MAX
0.25 (0.010) 0.10 (0.002)
24.0 (0.946)
0.25 (0.010)
0.23 (0.009) REF
R 0.127
(0.005)
2
O
/ 9
O
0.89 (0.035)
1.14 (0.045)
1.37 (0.054) MIN 0.004
0.940" TYP
PACKAGE 528 : 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
14
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
V
PP
PROGRAMMING VOLTAGE
5 = 5V
DEVICE
GRADE:
Q = MIL - STD 833 Compliant
M = Military Screened
-55C to +125C
I
=
Industrial
-40C
to
+85C
C = Commercial
0C to + 70C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 528)
ACCESS
TIME
(ns)
IMPROVEMENT
MARK
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade
ORGANIZATION,
128K
x
32
User confi gurable as 256K x 16 or 512K x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W F 128K32 X - XXX X X 5 X
15
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF128K32-XXX5
March 2006
Rev. 8
Note 1: Package Not Recommended For New Design
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
128K x 32 Flash
150ns
66 pin HIP (H1)
5962-94716 01H8X
128K x 32 Flash
120ns
66 pin HIP (H1)
5962-94716 02H8X
128K x 32 Flash
90ns
66 pin HIP (H1)
5962-94716 03H8X
128K x 32 Flash
70ns
66 pin HIP (H1)
5962-94716 04H8X
128K x 32 Flash
60ns
66 pin HIP (H1)
5962-94716 05H8X
128K x 32 Flash
150ns
68 lead CQFP (G2U)
5962-94716 01HNX
128K x 32 Flash
120ns
68 lead CQFP (G2U)
5962-94716 02HNX
128K x 32 Flash
90ns
68 lead CQFP (G2U)
5962-94716 03HNX
128K x 32 Flash
70ns
68 lead CQFP (G2U)
5962-94716 04HNX
128K x 32 Flash
60ns
68 lead CQFP (G2U)
5962-94716 05HNX
128K x 32 Flash
150ns
68 lead CQFP (G2L)
5962-94716 01HAX
128K x 32 Flash
120ns
68 lead CQFP (G2L)
5962-94716 02HAX
128K x 32 Flash
90ns
68 lead CQFP (G2L)
5962-94716 03HAX
128K x 32 Flash
70ns
68 lead CQFP (G2L)
5962-94716 04HAX
128K x 32 Flash
60ns
68 lead CQFP (G2L)
5962-94716 05HAX
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