1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
1Mx32 3.3V Flash Module
FEATURES
Access Times of 100, 120, 150ns
Packaging
66 pin, PGA Type, 1.185" square, Hermetic
Ceramic HIP (Package 401)
68 lead, Low Profi le CQFP (G2T), 4.6mm
(0.180") square (Package 509)
1,000,000 Erase/Program Cycles
Sector
Architecture
One 16KByte, two 8KBytes, one 32KByte, and
fi fteen 64kBytes in byte mode
Any combination of sectors can be concurrently
erased. Also supports full chip erase
Organized as 1Mx32
Commercial, Industrial and Military Temperature
Ranges
3.3 Volt for Read and Write Operations
Boot Code Sector Architecture (Bottom)
Low Power CMOS, 1.0mA Standby
Embedded Erase and Program Algorithms
Built-in Decoupling Caps for Low Noise Operation
Erase
Suspend/Resume
Supports reading data from or programing data to
a sector not being erased
Low Current Consumption
Typical values at 5MHz:
40mA Active Read Current
80mA Program/Erase Current
Weight
WF1M32B-XG2TX3 -8 grams typical
WF1M32B-XHX3 -13 grams typical
Note: For programming information refer to Flash Programming 8M3 Application Note.
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
RESET#
CS
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
#
A
19
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
V
CC
CS
4
#
NC
I/O
27
A
4
A
5
A
6
NC
CS
3
#
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
11 22 33 44 55 66
1 12 23 34 45 56
PIN CONFIGURATION FOR WF1M32B-XHX3
Top View
Pin Description
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE#
Write Enable
CS1-4#
Chip Selects
OE#
Output Enable
RESET#
Reset
V
CC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram
1M x 8
8
I / O 0 - 7
CS1#
1M x 8
8
I / O 8 - 1 5
CS2#
1M x 8
8
I / O 1 6 - 2 3
CS3#
1M x 8
8
I / O 2 4 - 3 1
CS4#
A 0 - 1 9
O E #
W E #
RESET#
2
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
Pin Confi guration for WF1M32B-XG2TX3
Top View
Pin Description
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
RESET
Reset/Powerdown
V
CC
Power Supply
GND
Ground
The White 68 lead G2T CQFP fi lls the
same fi t and function as the JEDEC 68 lead
CQFJ or 68 PLCC. But the G2T has the
TCE and lead inspection advantage of the
CQFP form.
1M x 8
8
I / O 0 - 7
1M x 8
8
I / O 8 - 1 5
1M x 8
8
I / O 1 6 - 2 3
1M x 8
8
I / O 2 4 - 3 1
A0-19
OE#
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
R ES E T#
Block Diagram
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
V
CC
A1
1
A12
A13
A14
A15
A16
CS1#
OE#
CS2#
A17
WE2#
WE3#
WE4#
A18
A19
NC
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
RESET#
A0
A1
A2
A3
A4
A5
CS3#
GND
CS4#
WE1#
A6
A7
A8
A9
A10
V
CC
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ABSOLUTE MAXIMUM RATINGS
Parameter
Unit
Operating Temperature
-55 to +125
C
Supply Voltage Range (V
CC
)
-0.5 to +4.0
V
Signal Voltage Range
-0.5 to Vcc +0.5
V
Storage Temperature Range
-65 to +150
C
Lead Temperature (soldering, 10 seconds)
+300
C
Endurance (write/erase cycles)
1,000,000 min.
cycles
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
3.0
3.6
V
Input High Voltage
V
IH
0.7 x V
CC
V
CC
+ 0.3
V
Input Low Voltage
V
IL
-0.5
+0.8
V
Operating Temp. (Mil.)
T
A
-55
+125
C
Operating Temp. (Ind.)
T
A
-40
+85
C
CAPACITANCE
T
A
= +25C
Parameter
Symbol
Conditions Max Unit
OE# capacitance
C
OE
V
IN
= 0 V, f = 1.0 MHz
50
pF
WE#1-4 capacitance
C
WE
V
IN
= 0 V, f = 1.0 MHz
20 pF
CS1-4 capacitance
C
CS
V
IN
= 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
C
I/O
V
I/O
= 0 V, f = 1.0 MHz
20
pF
Address input capacitance
C
AD
V
IN
= 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS CMOS COMPATIBLE
V
CC
= 3.3V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
Conditions
Min
Max Unit
Input Leakage Current
I
LI
V
CC
= 3.6, V
IN
= GND or V
CC
10
A
Output Leakage Current
I
LOx32
V
CC
= 3.6, V
IN
= GND or V
CC
10
A
V
CC
Active Current for Read (1)
I
CC1
CS# = V
IL
, OE# = V
IH
, f = 5MHz
120
mA
V
CC
Active Current for Program or Erase (2)
I
CC2
CS# = V
IL
, OE# = V
IH
140
mA
V
CC
Standby Current
I
CC3
V
CC
= 3.6, CS = V
IH
, f = 5MHz
200
A
Output Low Voltage
V
OL
I
OL
= 5.8 mA, V
CC
= 3.0
0.45
V
Output High Voltage
V
OH1
I
OH
= -2.0 mA, V
CC
= 3.0
0.85
X
V
CC
V
Low V
CC
Lock-Out Voltage (4)
V
LKO
2.3
2.5
V
NOTES:
1. The
I
CC
current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 8 mA/MHz, with
OE# at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
4. Guaranteed by design, but not tested.
DATA RETENTION
Parameter
Test Conditions
Min
Unit
Minimum Pattern Data
150C
10
Years
Retention Time
125C
20
Years
4
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS CS# CONTROLLED
V
CC
= 3.3V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
-100
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
AVAV
t
WC
100
120
150
ns
Write Enable Setup Time
t
WLEL
t
WS
0
0
0
ns
Chip Select Pulse Width
t
ELEH
t
CP
45
50
50
ns
Address Setup Time
t
AVEL
t
AS
0
0
0
ns
Data Setup Time
t
DVEH
t
DS
45
50
50
ns
Data Hold Time
t
EHDX
t
DH
0
0
0
ns
Address Hold Time
t
ELAX
t
AH
45
50
50
ns
Chip Select Pulse Width High
t
EHEL
t
CPH
20
20
20
ns
Duration of Byte Programming Operation (1)
t
WHWH1
300
300
300
s
Sector Erase Time
t
WHWH2
15
15
15
sec
Read Recovery Time (2)
t
GHEL
0
0
0
s
Chip Programming Time
50
50
50
sec
1. Typical value for t
WHWH1
is 9s.
2. Guaranteed by design, but not tested.
AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Typ
Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 2.5
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
NOTES:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75 .
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I
Current Source
D.U.T.
C = 50 pf
eff
I
OL
V
1.5V
(Bipolar Supply)
Z
Current Source
OH
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS WE# CONTROLLED
V
CC
= 3.3V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
-100
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
AVAV
t
WC
100
120
150
ns
Chip Select Setup Time
t
ELWL
t
CS
0
0
0
ns
Write Enable Pulse Width
t
WLWH
t
WP
50
50
65
ns
Address Setup Time
t
AVWL
t
AS
0
0
0
ns
Data Setup Time
t
DVWH
t
DS
50
50
65
ns
Data Hold Time
t
WHDX
t
DH
0
0
0
ns
Address Hold Time
t
WLAX
t
AH
50
50
65
ns
Write Enable Pulse Width High
t
WHWL
t
WPH
30
30
35
ns
Duration of Byte Programming Operation (1)
t
WHWH1
300
300
300
s
Sector Erase
t
WHWH2
15
15
15
sec
Read Recovery Time before Write (3)
t
GHWL
0
0
0
s
VCC Setup Time
t
VCS
50
50
50
s
Chip Programming Time
50
50
50
sec
Output Enable Setup Time
t
OES
0
0
0
ns
Output Enable Hold Time (2)
t
OEH
10
10
10
ns
1. Typical value for t
WHWH1
is 9s.
2. For Toggle and Data Polling.
3. Guaranteed by design, but not tested.
AC CHARACTERISTICS READ-ONLY OPERATIONS
V
CC
= 3.3V, V
SS
= 0V, -55C T
A
+125C
Parameter
Symbol
-100
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
AVAV
t
RC
100
120
150
ns
Address Access Time
t
AVQV
t
ACC
100
120
150
ns
Chip Select Access Time
t
ELQV
t
CE
100
120
150
ns
Output Enable to Output Valid
t
GLQV
t
OE
40
50
55
ns
Chip Select High to Output High Z (1)
t
EHQZ
t
DF
30
30
40
ns
Output Enable High to Output High Z (1)
t
GHQZ
t
DF
30
30
40
ns
Output Hold from Addresses, CS# or OE#
Change, whichever is First
t
AXQX
t
OH
0
0
0
ns
1. Guaranteed by design, not tested.
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS FOR READ OPERATIONS
s
e
s
s
e
r
d
d
A
CS#
OE#
WE#
s
t
u
p
t
u
O
Z
h
g
i
H
e
l
b
a
t
S
s
e
s
s
e
r
d
d
A
t
E
O
t
C
R
d
i
l
a
V
t
u
p
t
u
O
t
E
C
t
C
C
A
t
H
O
Z
h
g
i
H
t
F
D
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. D
OUT
is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
e
s
s
e
r
d
d
A
CS#
E#
O
E#
W
a
t
a
D
V
0
.
5
A
P
A
P
H
5
5
5
5
t
C
W
t
S
C
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
W
t
H
D
t
S
D
Data# Polling
t
S
A
t
C
R
t
P
W
H
0
A
0
A
t
E
O
t
F
D
t
H
O
t
E
C
t
L
W
H
G
t
1
H
W
H
W
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
Addresses
CS#
OE#
WE#
Data
V
CC
5555H
2AAAH
2AAAH
SA
5555H
5555H
t
WP
t
CS
t
VCS
1010H/3030H
5555H
8080H
5555H
AAAAH
AAAAH
t
AH
t
AS
t
GHWL
t
WPH
t
DH
t
DS
9
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
S#
C
E#
O
E#
W
t
E
O
t
E
O
t
E
C
t
H
C
t
H
O
O#
#
/
I
7
O
/
I
d
n
a
5
1
O
/
I
7
O
/
I
d
n
a
5
1
a
t
a
D
d
i
l
a
V
Z
h
g
i
H
O
/
I
6
-
0
O
/
I
d
n
a
4
1
-
8
d
i
l
a
v
n
I
O
/
I
5
1
-
0
a
t
a
D
d
i
l
a
V
t
F
D
O
/
I
7
d
n
a
O
/
I
5
1
O
/
I
6
-
0
d
n
a
O
/
I
4
1
-
8
t
H
E
O
t
2
r
o
1
H
W
H
W
a
t
a
D
10
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
s
e
s
s
e
r
d
d
A
E#
W
E#
O
S#
C
a
t
a
D
V
0
.
5
A
P
A
P
H
5
5
5
5
t
C
W
t
S
W
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
C
t
P
C
t
H
D
t
S
D
Data# Polling
t
S
A
t
L
E
H
G
H
0
A
t
1
H
W
H
W
11
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) 0.05 (0.002)
0.27 (0.011) 0.04 (0.002)
25.15 (0.990) 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
0.26 (0.010)
22.36 (0.880) 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
0.127 (0.005)
0.25 (0.010) REF
1
/ 7
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
The WEDC 68 lead G2T
CQFP fi lls the same fi t and
function as the JEDEC 68
lead CQFJ or 68 PLCC.
But the G2T has the TCE
and lead inspection advan-
tage of the CQFP form.
0.940"
12
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
30.1 (1.185) 0.38 (0.015) SQ
25.4 (1.0) TYP
15.24 (0.600) TYP
0.76 (0.030) 0.1 (0.005)
3.81 (0.150)
0.1 (0.005)
2.54 (0.100)
TYP
25.4 (1.0) TYP
1.27 (0.050) 0.1 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018) 0.05 (0.002) DIA
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
13
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
PROGRAMMING VOLTAGE
3
=
3.3V
DEVICE GRADE:
M = Military Screened
-55C to +125C
I = Industrial
-40C to +85C
C = Commercial
0C to +70C
PACKAGE TYPE:
H = Ceramic Hex In line Package, HIP (Package 401)
G2T = 22mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 509)
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 1M x 32
User confi gurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
W F 1M32 B - XXX X X 3 X
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