1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
August 2003 Rev. 6
FEATURES
n
Access Times of 60, 70, 90, 120, 150ns
n
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400
(1)
).
68 lead, 40mm, Low Capacitance Hermetic
CQFP (Package 501)
1
68 lead, 40mm, Low Profile 3.5mm (0.140"),
CQFP (Package 502)
1
68 lead, 22.4mm (0.880") Low Profile CQFP
(G2U) 3.5mm (0.140") high, (Package 510)
1
68 lead, 23.9mm (0.940") Low Profile CQFP
(G1U)
1
3.5mm (0.140") high, (Package 519)
68 lead, 23.9mm (0.940") Low Profile
CQFP (G1T), 4.06mm (0.160") high,
Package (524)
68 lead, 22.4mm (0.880") CQFP (G2L)
5.08mm (0.200") high, Package (528)
n
100,000 Erase/Program Cycles Minimum
n
Sector Architecture
8 equal size sectors of 64KBytes each
Any combination of sectors can be concur
rently erased. Also supports full chip erase
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-18
Address Inputs
WE
1-4
Write Enables
CS
1-4
Chip Selects
OE
Output Enable
V
CC
Power Supply
GND
Ground
NC
Not Connected
B
LOCK
D
IAGRAM
F
IG
. 1 P
IN
C
ONFIGURATION
F
OR
WF512K32N-XH1X5
512Kx32 5V FLASH MODULE, SMD 5962-94612
T
OP
V
IEW
512K x 8
8
I / O
0 - 7
W E
CS
1
1
512K x 8
8
I / O
8 - 1 5
W E
CS
2
2
512K x 8
8
I / O
1 6 - 2 3
W E
CS
3
3
512K x 8
8
I / O
2 4 - 3 1
W E
CS
4
4
A
0
-
1 8
O E
n
Organized as 512Kx32
n
Commercial, Industrial and Military Temperature
Ranges
n
5 Volt Programming. 5V 10% Supply.
n
Low Power CMOS, 6.5mA Standby
n
Embedded Erase and Program Algorithms
n
TTL Compatible Inputs and CMOS Outputs
n
Built-in Decoupling Caps for Low Noise Opera
tion
n
Page Program Operation and Internal Program
Control Time
n
Weight
WF512K32 - XG2UX5 - 8 grams typical
WF512K32 - XH1X5 - 13 grams typical
WF512K32N - XG4X5
1
- 20 grams typical
WF512K32 - XG4TX5
1
- 20 grams typical
WF512K32 - XG1UX5
1
- 5 grams typical
WF512K32 - XG1TX5 - 5 grams typical
WF512K32-XG2LX5 - 8 grams typical
Note 1: Package Not Recommended for New Design
See Flash Programming Application Note 4M5 for algorithms.
2
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
P
IN
D
ESCRIPTION
F
IG
. 2 P
IN
C
ONFIGURATION
F
OR
WF512K32F-XG4X5
1
(L
OW
C
APACITANCE
) A
ND
WF512K32-XG4TX5
1
I/O0-31 Data Inputs/Outputs
A0-18
Address Inputs
WE
Write Enable
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
B
LOCK
D
IAGRAM
T
OP
V
IEW
F
IG
. 3 P
IN
C
ONFIGURATION
F
OR
WF512K32-XG2UX5, WF512K32-XG2LX5, WF512K32-XG1TX5 AND
WF512K32-XG1UX5
1
P
IN
D
ESCRIPTION
T
OP
V
IEW
I/O0-31 Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
B
LOCK
D
IAGRAM
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
2
OE
CS
4
A
17
A
18
NC
NC
NC
NC
NC
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
1
GND
CS
3
WE
A
6
A
7
A
8
A
9
A
10
V
CC
512K x 8
8
I / O
0 - 7
CS
1
512K x 8
8
I / O
8 - 1 5
CS
2
512K x 8
8
I / O
1 6 - 2 3
CS
3
512K x 8
8
I / O
2 4 - 3 1
CS
4
A
0 - 1 8
O E
W E
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
1
OE
CS
2
A
17
WE
2
WE
3
WE
4
A
18
NC
NC
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
GND
CS
4
WE
1
A
6
A
7
A
8
A
9
A
10
V
CC
512K x 8
8
I / O
0 - 7
CS
1
512K x 8
8
I / O
8 - 1 5
CS
2
512K x 8
8
I / O
1 6 - 2 3
CS
3
512K x 8
8
I / O
2 4 - 3 1
CS
4
A
0 - 1 8
O E
WE
3
WE
2
WE
1
WE
4
Note 1: Package not recommended for new designs
3
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
Parameter
Symbol
ConditionsMax Unit
OE capacitance
C
OE
V
IN
= 0 V, f = 1.0 MHz
50
pF
WE
1-4
capacitance
C
WE
V
IN
= 0 V, f = 1.0 MHz
pF
HIP (PGA)
20
CQFP G4T
50
CQFP G2U/G1U/G1T/G2L
15
CS
1-4
capacitance
C
CS
V
IN
= 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
C
I/O
V
I/O
= 0 V, f = 1.0 MHz
20
pF
Address input capacitance
C
AD
V
IN
= 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
Parameter
Symbol
ConditionsMin
Max
Unit
Input Leakage Current
I
L I
V
CC
= 5.5, V
IN
= GND or V
CC
10
A
Output Leakage Current
I
L O x 3 2
V
CC
= 5.5, V
IN
= GND or V
CC
10
A
V
CC
Active Current for Read (1)
I
CC1
CS = V
IL
, OE = V
IH
, f = 5MHz
190
mA
V
CC
Active Current for Program or Erase (2)
I
CC2
CS = V
IL
, OE = V
IH
240
mA
V
CC
Standby Current
I
C C 4
V
CC
= 5.5, CS = V
IH
, f = 5MHz
6.5
mA
V
CC
Static Current
I
C C 3
V
CC
= 5.5, CS = V
IH
0.6
mA
Output Low Voltage
V
OL
I
OL
= 8.0 mA, V
C C
= 4.5
0.45
V
Output High Voltage
V
OH1
I
OH
= 2.5 mA, V
C C
= 4.5
0.85
X
V
C C
V
Low V
CC
Lock-Out Voltage
V
LKO
3.2
4.2
V
A
BSOLUTE
M
AXIMUM
R
ATINGS
(1)
NOTES:
1. Stresses above the absolute maximum rating may cause permanent
damage to the device. Extended operation at the maximum levels
may degrade performance and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage
transitions,inputs may overshoot Vss to -2.0 V for periods of up
to 20ns. Maximum DC voltage on output and I/O pins is Vcc +
0.5V. During voltage transitions, outputs may overshoot to Vcc +
2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage
transitions, A9 may overshoot Vss to -2V for periods of up to
20ns. Maximum DC input voltage on A9 is +13.5V which may
overshoot to 14.0 V for periods up to 20ns.
DC C
HARACTERISTICS
- CMOS C
OMPATIBLE
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55C
TO
+125C)
Parameter
Unit
Operating Temperature
-55 to +125
C
Supply Voltage Range (V
CC
)
-2.0 to +7.0
V
Signal voltage range (any pin except A9) (2)
-2.0 to +7.0
V
Storage Temperature Range
-65 to +150
C
Lead Temperature (soldering, 10 seconds)
+300
C
Data Retention (Mil Temp)
20 years
Endurance - write/erase cycles (Mil Temp)
100,000 cycles min.
A9 Voltage for sector protect (V
ID
) (3)
-2.0 to +14.0
V
DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency
component typically is less than2
mA/MHz, with OE at VIH.
2. ICC active while Embedded Algorithm (program or erase) is in progress.
R
ECOMMENDED
O
PERATING
C
ONDITIONS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
4.5
5.5
V
Input High Voltage
V
IH
2.0
V
CC
+ 0.5
V
Input Low Voltage
V
IL
-0.5
+0.8
V
Operating Temp. (Mil.)
T
A
-55
+125
C
Operating Temp. (Ind.)
T
A
-40
+85
C
A
9
Voltage for Sector Protect
V
ID
11.5
12.5
V
L
OW
C
APACITANCE
CQFP
(T
A
= +25C)
Parameter
Symbol
ConditionsMax Unit
OE capacitance
COE
VIN = 0 V, f = 1.0 MHz
32
pF
CQFP G4 capacitance
CWE
VIN = 0 V, f = 1.0 MHz
32
pF
CS1-4 capacitance
CCS
VIN = 0 V, f = 1.0 MHz
15
pF
Data I/O capacitance
CI/O
VI/O = 0 V, f = 1.0 MHz
15
pF
Address input capacitance
CAD
VIN = 0 V, f = 1.0 MHz
32
pF
This parameter is guaranteed by design but not tested.
C
APACITANCE
(T
A
= +25C)
4
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
Parameter
Symbol
-60
-70
-90
-120
-150
Unit
Min Max Min Max Min
Max Min Max Min
Max
Write Cycle Time
tAVAV
tWC
60
70
90
120
150
ns
Write Enable Setup Time
t
W L E L
t
WS
0
0
0
0
0
ns
Chip Select Pulse Width
t
ELEH
t
CP
40
45
45
50
50
ns
Address Setup Time
t
AVEL
t
AS
0
0
0
0
0
ns
Data Setup Time
t
DVEH
t
DS
40
45
45
50
50
ns
Data Hold Time
t
EHDX
t
DH
0
0
0
0
0
ns
Address Hold Time
t
E L A X
t
AH
40
45
45
50
50
ns
Chip Select Pulse Width High
t
EHEL
t
CPH
2 0
2 0
2 0
20
20
ns
Duration of Byte Programming Operation (1)
t
W H W H 1
300
300
300
300
300
s
Sector Erase Time (2)
t
W H W H 2
15
15
15
15
15
sec
Read Recovery Time
t
GHEL
0
0
0
0
0
ns
Chip Programming Time
11
11
11
11
11
sec
Chip Erase Time (3)
64
64
64
64
64
sec
AC C
HARACTERISTICS
W
RITE
/E
RASE
/P
ROGRAM
O
PERATIONS
,CS C
ONTROLLED
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55C
TO
+125C)
F
IG
. 4 AC T
EST
C
IRCUIT
AC T
EST
C
ONDITIONS
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75W.
VZ is typically the midpoint of VOH and VOL.
IOL & IOH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
Parameter
Typ Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
NOTES:
1. Typical value for tWHWH1 is 7s.
2. Typical value for tWHWH2 is 1sec.
3. Typical value for Chip Erase Time is 8sec.
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
Parameter
Symbol
-60
-70
-90
-120
-150 Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
A V A V
t
RC
60
70
90
120
150
ns
Address Access Time
t
AVQV
t
A C C
60
70
90
120
150
ns
Chip Select Access Time
t
ELQV
t
CE
60
70
90
120
150
ns
Output Enable to Output Valid
t
GLQV
t
OE
30
35
35
50
55
ns
Chip Select to Output High Z (1)
t
EHQZ
t
DF
20
20
20
30
35
ns
Output Enable High to Output High Z (1)
t
GHQZ
t
DF
20
20
20
30
35
ns
Output Hold from Address, CS or OE Change,
t
A X Q X
t
OH
0
0
0
0
0
ns
whichever is First
Min
Max
Min
Max
Min
Max Min
Max
Min
Max
Write Cycle Time
t
A V A V
t
WC
60
70
90
120
150
ns
Chip Select Setup Time
t
E L W L
t
CS
0
0
0
0
0
ns
Write Enable Pulse Width
t
W L W H
t
WP
40
45
45
50
50
ns
Address Setup Time
t
AVWH
t
AS
0
0
0
0
0
ns
Data Setup Time
t
DVWH
t
DS
40
45
45
50
50
ns
Data Hold Time
t
WHDX
t
DH
0
0
0
0
0
ns
Address Hold Time
t
WHAX
t
AH
40
45
45
50
50
ns
Write Enable Pulse Width High
t
W H W L
t
WPH
20
20
20
20
20
ns
Duration of Byte Programming Operation (1)
t
W H W H 1
300
300
300
300
300
s
Sector Erase Time (2)
t
W H W H 2
15
15
15
15
15
sec
Read Recovery Time before Write
t
G H W L
0
0
0
0
0
ns
V
CC
Set-up Time
t
VCS
50
50
50
50
50
s
Chip Programming Time
11
11
11
11
11
sec
Output Enable Setup Time
t
OES
0
0
0
0
0
ns
Output Enable Hold Time (4)
t
OEH
10
10
10
10
10
ns
Chip Erase Time (3)
64
64
64
64
64
sec
AC C
HARACTERISTICS
W
RITE
/E
RASE
/P
ROGRAM
O
PERATIONS
, WE C
ONTROLLED
(V
CC
= 5.0V, T
A
= -55C
TO
+125C)
WF512K32-XXX5
WF512K32-XXX5
AC C
HARACTERISTICS
R
EAD
O
NLY
O
PERATIONS
(V
CC
= 5.0V, T
A
= -55C
TO
+125C)
NOTES:
1. Typical value for tWHWH1 is 7s.
2. Typical value for tWHWH2 is 1sec.
3. Typical value for Chip Erase Time is 8sec.
4. For Toggle and Data Polling.
1. Guaranteed by design, but not tested
Parameter
Symbol
-60
-70
-90
-120
-150
Unit
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
FIG. 5 AC W
AVEFORMS
F
OR
R
EAD
O
PERATIONS
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
F
IG
. 6 W
RITE
/E
RASE
/P
ROGRAM
O
PERATION
, WE C
ONTROLLED
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
F
IG
. 7 AC W
AVEFORMS
C
HIP
/S
ECTOR
E
RASE
O
PERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
A
ddresses
CS
OE
WE
Data
V
CC
5555H
2AAAH
2AAAH
S
A
5555H
5555H
t
WP
t
CS
t
VCS
10H/30H
55H
80H
55H
AAH
AAH
t
AH
t
AS
t
GHWL
t
WPH
t
DH
t
DS
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
F
IG
. 8 AC W
AVEFORMS
F
OR
D
ATA
P
OLLING
D
URING
E
MBEDDED
A
LGORITHM
O
PERATIONS
CS
OE
WE
t
OE
t
CE
t
CH
t
OH
D7
D7 =
Valid Data
High Z
D0-D6 = Invalid
D0-D7
Valid Data
t
DF
D7
D0-D6
t
OEH
t
WHWH 1 or 2
t
OE
Data
10
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
F
IG
. 9 A
LTERNATE
CS C
ONTROLLED
P
ROGRAMMING
O
PERATION
T
IMINGS
Notes:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
11
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
P
ACKAGE
400: 66 P
IN
, PGA T
YPE
, C
ERAMIC
H
EX
-I
N
-L
INE
P
ACKAGE
, H
IP
(H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
12
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
P
ACKAGE
510: 68 L
EAD
, C
ERAMIC
Q
UAD
F
LAT
P
ACK
, CQFP (G2U)
o
o
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
The White 68 lead G2U CQFP
fills the same fit and function
as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the
TCE and lead inspection
advantage of the CQFP form.
Note 1: Package Not Recommended for New Design
P
ACKAGE
519: 68 L
EAD
, C
ERAMIC
Q
UAD
F
LAT
P
ACK
, L
OW
P
ROFILE
CQFP (G1U)
1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
13
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
25.15 (0.990) 0.25 (0.010) MAX
22.36 (0.880) 0.25 (0.010) MAX
20.31 (0.800) REF
0.38 (0.015) 0.05 (0.002)
1.27 (0.050) TYP
5.10 (0.200) MAX
0.25 (0.010) 0.10 (0.002)
24.0 (0.946)
0.25 (0.010)
0.23 (0.009) REF
R 0.127
(0.005)
2
O
/ 9
O
0.89 (0.035)
1.14 (0.045)
1.37 (0.054) MIN 0.004
25.27 (0.995)
0.13 (0.005) SQ
23.88 (0.940)
0.25 (0.010) SQ
0.38 (0.015)
0.05 (0.002)
20.3 (0.800) REF
1.27 (0.050)
4.06 (0.160) MAX
0.25 (0.010) MAX
SEE DETAIL "A"
0.84 (0.033) REF
DETAIL A
0.83 (0.033)
0.32 (0.013)
0
0
/8
0
P
ACKAGE
524: 68 L
EAD
, C
ERAMIC
Q
UAD
F
LAT
P
ACK
, L
OW
P
ROFILE
CQFP (G1T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940" TYP
P
ACKAGE
528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
14
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015)
0.08 (0.003)
68 PLACES
1.27 (0.050)
TYP
5.1 (0.200) MAX
39.6 (1.56) 0.38 (0.015) SQ
38 (1.50) TYP
4 PLACES
5.1 (0.200)
0.25 (0.010)
4 PLACES
12.7 (0.500)
0.5 (0.020)
4 PLACES
0.25 (0.010)
0.05 (0.002)
1.27 (0.050)
0.1 (0.005)
PIN 1 IDENTIFIER
Pin 1
Note 1: Package Not Recommended for New Design
P
ACKAGE
502: 68 L
EAD
, C
ERAMIC
Q
UAD
F
LAT
P
ACK
, L
OW
P
ROFILE
CQFP (G4T)
1
0.38 (0.015)
0.08 (0.003)
68 PLACES
1.27 (0.050)
TYP
5.1 (0.200) MAX
39.6 (1.56) 0.38 (0.015) SQ
38 (1.50) TYP
4 PLACES
5.1 (0.200)
0.25 (0.010)
4 PLACES
12.7 (0.500)
0.5 (0.020)
4 PLACES
0.25 (0.010)
0.05 (0.002)
1.27 (0.050)
0.1 (0.005)
PIN 1 IDENTIFIER
Pin 1
P
ACKAGE
501: 68 L
EAD
, C
ERAMIC
Q
UAD
F
LAT
P
ACK
, CQFP (G4)
1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended for New Design
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
O
RDERING
I
NFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
V
PP
PROGRAMMING VOLTAGE
5 = 5 V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55C to +125C
I = Industrial
-40C to +85C
C = Commercial
0C to +70C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400*)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G1T = 23.9mm Low Profile CQFP (Package 524)
G1U
1
= 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G4
1
= 40 Low Profile CQFP (Package 501)
G4T
1
= 40mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 21 and 39 in HIP for Upgrade
ORGANIZATION, 512K x 32
User configurable as 1M x 16 or 2M x 8
FLASH
WHITE ELECTRONIC DESIGNS CORP.
W F 512K32 X - XXX X X 5 X
Note 1: Package Not Recommended for New Design
* Call factory for PGA type (HIP) package options
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WF512K32-XXX5
White Electronic Designs
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
512K x 32 Flash Module
150ns
66 pin HIP (H1) 1.075" sq.
5962-94612 01H4X
512K x 32 Flash Module
120ns
66 pin HIP (H1) 1.075" sq.
5962-94612 02H4X
512K x 32 Flash Module
90ns
66 pin HIP (H1) 1.075" sq.
5962-94612 03H4X
512K x 32 Flash Module
70ns
66 pin HIP (H1) 1.075" sq.
5962-94612 04H4X
512K x 32 Flash Module
150ns
68 lead CQFP Low Profile (G4T)
1
5962-94612 01HTX
1
512K x 32 Flash Module
120ns
68 lead CQFP Low Profile (G4T)
1
5962-94612 02HTX
1
512K x 32 Flash Module
90ns
68 lead CQFP Low Profile (G4T)
1
5962-94612 03HTX
1
512K x 32 Flash Module
70ns
68 lead CQFP Low Profile (G4T)
1
5962-94612 04HTX
1
512K x 32 Flash Module
150ns
68 lead Low Capacitance
5962-94612 01HNX
1
CQFP (G4)
1
512K x 32 Flash Module
120ns
68 lead Low Capacitance
5962-94612 02HNX
1
CQFP (G4)
1
512K x 32 Flash Module
90ns
68 lead Low Capacitance
5962-94612 03HNX
1
CQFP (G4)
1
512K x 32 Flash Module
70ns
68 lead Low Capacitance
5962-94612 04HNX
1
CQFP (G4)
1
512K x 32 Flash Module
150ns
68 lead CQFP/J (G2U)
5962-94612 01HZX
512K x 32 Flash Module
120ns
68 lead CQFP/J (G2U)
5962-94612 02HZX
512K x 32 Flash Module
90ns
68 lead CQFP/J (G2U)
5962-94612 03HZX
512K x 32 Flash Module
70ns
68 lead CQFP/J (G2U)
5962-94612 04HZX
512K x 32 Flash Module
150ns
68 lead CQFP (G1U)
1
5962-94612 01H9X
1
512K x 32 Flash Module
120ns
68 lead CQFP (G1U)
1
5962-94612 02H9X
1
512K x 32 Flash Module
90ns
68 lead CQFP (G1U)
1
5962-94612 03H9X
1
512K x 32 Flash Module
70ns
68 lead CQFP (G1U)
1
5962-94612 04H9X
1
512K x 32 Flash Module
150ns
68 lead CQFP (G2L)
5962-94612 01HAX
512K x 32 Flash Module
120ns
68 lead CQFP (G2L)
5962-94612 02HAX
512K x 32 Flash Module
90ns
68 lead CQFP (G2L)
5962-94612 03HAX
512K x 32 Flash Module
70ns
68 lead CQFP (G2L)
5962-94612 04HAX
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