ChipFind - документация

Электронный компонент: WSE128K16-35H1M

Скачать:  PDF   ZIP
1
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
128K
X
16 SRAM/EEPROM MODULE
PRELIMINARY*
FEATURES
s Access Times of 35ns (SRAM) and 150ns (EEPROM)
s Access Times of 45ns (SRAM) and 120ns (EEPROM)
s Access Times of 70ns (SRAM) and 300ns (EEPROM)
s Packaging
66 pin, PGA Type, 1.075" square HIP, Hermetic Ceramic
HIP (H1) (Package 400)
68 lead, Hermetic CQFP (G2T), 22mm (0.880") square
(Package 509). Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint (Fig. 2)
s 128Kx16 SRAM
s 128Kx16 EEPROM
s Organized as 128Kx16 of SRAM and 128Kx16 of EEPROM
Memory with separate Data Buses
s Both blocks of memory are User Configurable as 256Kx8
s Low Power CMOS
s Commercial, Industrial and Military Temperature Ranges
s TTL Compatible Inputs and Outputs
s Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
s Weight - 13 grams typical
EEPROM MEMORY FEATURES
s Write Endurance 10,000 Cycles
s Data Retention at 25
C, 10 Years
s Low Power CMOS Operation
s Automatic Page Write Operation
s Page Write Cycle Time 10ms Max.
s Data Polling for End of Write Detection
s Hardware and Software Data Protection
s TTL Compatible Inputs and Outputs
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
E W E E CS
E W E E CS
S W E S CS
128K x 8
SRAM
8
S D
0 - 7
1
1
128K x 8
SRAM
8
S D
8 - 1 5
2
2
128K x 8
EEPROM
8
E D
0 - 7
1
1
128K x 8
EEPROM
8
E D
8 - 1 5
2
2
A
0
-
1 6
O E
S W E S CS
BLOCK DIAGRAM
PIN DESCRIPTION
ED
0-15
EEPROM Data Inputs/Outputs
SD
0-15
SRAM Data Inputs/Outputs
A
0-16
Address Inputs
SWE
1-2
SRAM Write Enable
SCS
1-2
SRAM Chip Selects
OE
Output Enable
V
CC
Power Supply
GND
Ground
NC
Not Connected
EWE
1-2
EEPROM Write Enable
ECS
1-2
EEPROM Chip Select
SD
8
SD
9
SD
10
A
13
A
14
A
15
A
16
NC
SD
0
SD
1
SD
2
SWE
2
SCS
2
GND
SD
11
A
10
A
11
A
12
V
CC
SCS
1
NC
SD
3
SD
15
SD
14
SD
13
SD
12
OE
NC
SWE
1
SD
7
SD
6
SD
5
SD
4
ED
8
ED
9
ED
10
A
6
A
7
NC
A
8
A
9
ED
0
ED
1
ED
2
V
CC
ECS
2
EWE
2
ED
11
A
3
A
4
A
5
EWE
1
ECS
1
GND
ED
3
ED
15
ED
14
ED
13
ED
12
A
0
A
1
A
2
ED
7
ED
6
ED
5
ED
4
11 22 33 44 55 66
1 12 23 34 45 56
TOP VIEW
FIG.1
PIN CONFIGURATION FOR WSE128K16-XH1X
May 2001, Rev. 4
2
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
TOP VIEW
FIG. 2
PIN CONFIGURATION FOR WSE128K16-XG2TX
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
SD
0
SD
1
SD
2
SD
3
SD
4
SD
5
SD
6
SD
7
GND
SD
8
SD
9
SD
10
SD
11
SD
12
SD
13
SD
14
SD
15
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
SCS
1
OE
SCS
2
NC
SWE
2
EWE
1
EWE
2
NC
NC
NC
ED
0
ED
1
ED
2
ED
3
ED
4
ED
5
ED
6
ED
7
GND
ED
8
ED
9
ED
10
ED
11
ED
12
ED
13
ED
14
ED
15
NC
A
0
A
1
A
2
A
3
A
4
A
5
ECS
1
GND
ECS
2
SWE
1
A
6
A
7
A
8
A
9
A
10
V
CC
BLOCK DIAGRAM
PIN DESCRIPTION
ED
0-15
EEPROM Data Inputs/Outputs
SD
0-15
SRAM Data Inputs/Outputs
A
0-16
Address Inputs
SWE
1-2
SRAM Write Enable
SCS
1-2
SRAM Chip Selects
OE
Output Enable
V
CC
Power Supply
GND
Ground
NC
Not Connected
EWE
1-2
EEPROM Write Enable
ECS
1-2
EEPROM Chip Select
The WEDC 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
0.940"
E W E E CS
E W E E CS
S W E S CS
128K x 8
SRAM
8
S D
0 - 7
1
1
128K x 8
SRAM
8
S D
8 - 1 5
2
2
128K x 8
EEPROM
8
E D
0 - 7
1
1
128K x 8
EEPROM
8
E D
8 - 1 5
2
2
A
0
-
1 6
O E
S W E S CS
3
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
EEPROM TRUTH TABLE
RECOMMENDED OPERATING CONDITIONS
CS
OE
WE
Mode
Data I/O
H
X
X
Standby
High Z
L
L
H
Read
Data Out
L
H
L
Write
Data In
X
H
X
Out Disable
High Z/Data Out
X
X
H
Write
X
L
X
Inhibit
Parameter
Symbol
Min
Max
Unit
Supply Voltage
V
CC
4.5
5.5
V
Input High Voltage
V
IH
2.0
V
CC
+ 0.3
V
Input Low Voltage
V
IL
-0.3
+0.8
V
Operating Temp. (Mil.)
T
A
-55
+125
C
DC CHARACTERISTICS
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55
C to +125
C)
Parameter
Symbol
Conditions
Min
Max
Unit
Input Leakage Current
I
LI
V
CC
= 5.5, V
IN
= GND to V
CC
10
A
Output Leakage Current
I
LO
SCS = V
IH
, OE = V
IH,
V
OUT
= GND to V
CC
10
A
SRAM Operating Supply Current x 16 Mode
I
CCx16
SCS = V
IL
, OE = ECS = V
IH,
f = 5MHz, V
CC
= 5.5
360
mA
Standby Current
I
SB
ECS = SCS = V
IH
, OE = V
IH,
f = 5MHz, V
CC
= 5.5
31.2
mA
SRAM Output Low Voltage
(35 to 45ns)
V
OL
I
OL
= 8.0mA, V
CC
= 4.5
0.4
V
(70ns)
V
OL
I
OL
= 2.1mA, V
CC
= 4.5
0.4
V
SRAM Output High Voltage
(35 to 45ns)
V
OH
I
OH
= -4.0mA, V
CC
= 4.5
2.4
V
(70ns)
V
OH
I
OH
= -1mA, V
CC
= 4.5
2.4
V
EEPROM Operating Supply Current x 16 Mode
I
CC1
ECS = V
IL
, OE = SCS = V
IH
155
mA
EEPROM Output Low Voltage
V
OL
I
OL
= 2.1 mA, V
CC
= 4.5V
0.45
V
EEPROM Output High Voltage
V
OH1
I
OH
= 400
A, V
CC
= 4.5V
2.4
V
NOTES:
1. The I
CC
current listed includes both the DC operating current and the frequency dependent component (@ 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE at V
IH
.
2. DC test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Operating Temperature
T
A
-55
+125
C
Storage Temperature
T
STG
-65
+150
C
Signal Voltage Relative to GND
V
G
-0.5
Vcc+0.5
V
Junction Temperature
T
J
150
C
Supply Voltage
V
CC
-0.5
7.0
V
CAPACITANCE
(T
A
= +25
C)
Parameter
Symbol
Conditions
Max
Unit
OE capacitance
C
OE
V
IN
= 0 V, f = 1.0 MHz
50
pF
WE
1-4
capacitance
C
WE
V
IN
= 0 V, f = 1.0 MHz
pF
HIP (PGA)
20
CQFP G2T
20
CS
1-4
capacitance
C
CS
V
IN
= 0 V, f = 1.0 MHz
20
pF
Data I/O capacitance
C
I/O
V
I/O
= 0 V, f = 1.0 MHz
20
pF
Address input capacitance
C
AD
V
IN
= 0 V, f = 1.0 MHz
50
pF
This parameter is guaranteed by design but not tested.
SRAM TRUTH TABLE
SCS
OE
SWE
Mode
Data I/O
Power
H
X
X
Standby
High Z
Standby
L
L
H
Read
Data Out
Active
L
H
H
Read
High Z
Active
L
X
L
Write
Data In
Active
4
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
FIG. 3
AC TEST CIRCUIT
AC TEST CONDITIONS
I
Current Source
D.U.T.
C = 50 pf
eff
I
OL
V
1.5V
(Bipolar Supply)
Z
Current Source
OH
NOTES:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z
0
= 75
.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
Parameter
Typ
Unit
Input Pulse Levels
V
IL
= 0, V
IH
= 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
SRAM AC CHARACTERISTICS
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
Parameter
Symbol
-35
-45
-70
Units
Read Cycle
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
RC
35
45
70
ns
Address Access Time
t
AA
35
45
70
ns
Output Hold from Address Change
t
OH
0
0
3
ns
Chip Select Access Time
t
ACS
35
45
70
ns
Output Enable to Output Valid
t
OE
20
25
35
ns
Chip Select to Output in Low Z
t
CLZ
1
3
3
3
ns
Output Enable to Output in Low Z
t
OLZ
1
0
0
0
ns
Chip Disable to Output in High Z
t
CHZ
1
20
20
25
ns
Output Disable to Output in High Z
t
OHZ
1
20
20
25
ns
1. This parameter is guaranteed by design but not tested.
SRAM AC CHARACTERISTICS
(V
CC
= 5.0V, GND = 0V, T
A
= -55
C to +125
C)
Parameter
Symbol
-35
-45
-70
Units
Write Cycle
Min
Max
Min
Max
Min
Max
Write Cycle Time
t
WC
35
45
70
ns
Chip Select to End of Write
t
CW
25
30
60
ns
Address Valid to End of Write
t
AW
25
30
60
ns
Data Valid to End of Write
t
DW
20
25
30
ns
Write Pulse Width
t
WP
25
30
50
ns
Address Setup Time
t
AS
0
0
5
ns
Address Hold Time
t
AH
0
0
5
ns
Output Active from End of Write
t
OW
1
4
4
5
ns
Write Enable to Output in High Z
t
WHZ
1
20
25
25
ns
Data Hold Time
t
DH
0
0
0
ns
1. This parameter is guaranteed by design but not tested.
5
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS32K32-XHX
FIG. 4
SRAM READ CYCLE
FIG. 6
SRAM WRITE CYCLE
SCS CONTROLLED
FIG. 5
SRAM WRITE CYCLE
SWE CONTROLLED
ADDRESS
DATA I/O
WRITE CYCLE 1, SWE CONTROLLED
t
AW
t
CW
t
AH
t
WP
t
DW
t
WHZ
t
AS
t
OW
t
DH
t
WC
DATA VALID
SCS
SWE
ADDRESS
DATA I/O
WRITE CYCLE 2, SCS CONTROLLED
t
AW
t
AS
t
CW
t
AH
t
WP
t
DH
t
DW
t
WC
SCS
SWE
DATA VALID
ADDRESS
DATA I/O
READ CYCLE 2, (SWE = V
IH
)
t
AA
t
ACS
t
OE
t
CLZ
t
OLZ
t
OHZ
t
RC
DATA VALID
HIGH IMPEDANCE
SCS
SOE
t
CHZ
ADDRESS
DATA I/O
READ CYCLE 1, (SCS = OE = V
IL
, SWE = V
IH
)
t
AA
t
OH
t
RC
DATA VALID
PREVIOUS DATA VALID
SRAM
SRAM
SRAM
SRAM
6
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
EEPROM WRITE
A write cycle is initiated when OE is high and a low pulse is on
EWE or ECS with ECS or EWE low. The address is latched on the
falling edge of ECS or EWE whichever occurs last. The data is
latched by the rising edge of ECS or EWE, whichever occurs first.
A byte write operation will automatically continue to completion.
WRITE CYCLE TIMING
Figures 7 and 8 show the write cycle timing relationships. A
write cycle begins with address application, write enable and
chip select. Chip select is accomplished by placing the ECS
line low. Write enable consists of setting the EWE line low.
The write cycle begins when the last of either ECS or EWE goes
low.
The EWE line transition from high to low also initiates an
internal 150
sec delay timer to permit page mode operation.
Each subsequent EWE transition from high to low that occurs
before the completion of the 150
sec time out will restart the
timer from zero. The operation of the timer is the same as a
retriggerable one-shot.
EEPROM AC WRITE CHARACTERISTICS
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55
C to +125
C)
Write Cycle Parameter
Symbol
Min
Max
Unit
Write Cycle Time, TYP = 6ms
t
WC
10
ms
Address Set-up Time
t
AS
0
ns
Write Pulse Width (EWE or ECS)
t
WP
150
ns
Chip Select Set-up Time
t
CS
0
ns
Address Hold Time
t
AH
100
ns
Data Hold Time
t
DH
10
ns
Chip Select Hold Time
t
CSH
0
ns
Data Set-up Time
t
DS
100
ns
Output Enable Set-up Time
t
OES
10
ns
Output Enable Hold Time
t
OEH
10
ns
Write Pulse Width High
t
WPH
50
ns
7
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
FIG. 7
EEPROM WRITE WAVEFORMS
EWE CONTROLLED
FIG. 8
EEPROM WRITE WAVEFORMS
ECS CONTROLLED
t
ADDRESS
ECS
1-2
EWE
1-2
EEPROM
DATA IN
DH
t
WPH
t
WP
t
CSH
t
OEH
t
AH
t
OES
t
AS
t
CS
OE
t
WC
t
DS
t
ADDRESS
DH
t
WPH
t
WP
t
CSH
t
OEH
t
AH
t
OES
t
AS
t
CS
OE
t
DS
t
WC
ECS
1-2
EWE
1-2
EEPROM
DATA IN
8
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
EEPROM AC READ CHARACTERISTICS
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55
C to +125
C)
FIG. 9
EEPROM READ WAVEFORMS
t
ADDRESS
ECS
1-2
OE
EEPROM
DATA
OUTPUT
OH
t
DF
t
ACC
t
RC
t
OE
t
ACS
OUTPUT
VALID
ADDRESS VALID
HIGH Z
EEPROM READ
The WSE128K16-XXX EEPROM stores data at the memory
location determined by the address pins. When ECS and OE
are low and EWE is high, this data is present on the outputs.
When ECS and OE are high, the outputs are in a high imped-
ance state. This two line control prevents bus contention.
NOTES:
OE may be delayed up to t
ACS
- t
OE
after the
falling edge of ECS without impact on t
OE
or by
t
ACC
- t
OE
after an address change without
impact on t
ACC
.
Read Cycle Parameter
Symbol
-120
-150
-300
Unit
Min
Max
Min
Max
Min
Max
Read Cycle Time
t
RC
120
150
300
ns
Address Access Time
t
ACC
120
150
300
ns
Chip Select Access Time
t
ACS
120
150
300
ns
Output Hold from Add. Change, OE or ECS
t
OH
0
0
0
ns
Output Enable to Output Valid
t
OE
0
50
0
55
0
85
ns
Chip Select or OE to High Z Output
t
DF
70
70
70
ns
9
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
EEPROM DATA POLLING
The WSE128K16-XXX offers a data polling feature for the
EEPROM which allows a faster method of writing to the device.
Figure 11 shows the timing diagram for this function. During a
byte or page write cycle, an attempted read of the last byte
written will result in the complement of the written data on D
7
(for each chip.) Once the write cycle has been completed, true
data is valid on all outputs and the next cycle may begin. Data
polling may begin at any time during the write cycle.
EEPROM DATA POLLING CHARACTERISTICS
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55
C to +125
C)
FIG. 10
EEPROM DATA POLLING WAVEFORMS
Parameter
Symbol
Min
Max
Unit
Data Hold Time
t
DH
10
ns
OE Hold Time
t
OEH
10
ns
OE To Output Valid
t
OE
55
ns
Write Recovery Time
t
WR
0
ns
EWE
1-2
t
OEH
t
DH
t
OE
t
WR
HIGH Z
ECS
1-2
OE
ED
7
ADDRESS
10
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
EEPROM PAGE WRITE OPERATION
The WSE128K16-XXX has a page write operation that allows one
to 128 bytes of data to be written into the device and consecutively
loads during the internal programming period. Successive bytes
may be loaded in the same manner after the first data byte has
been loaded. An internal timer begins a time out operation at each
write cycle. If another write cycle is completed within 150
s or
less, a new time out period begins. Each write cycle restarts the
delay period. The write cycles can be continued as long as the
interval is less than the time out period.
The usual procedure is to increment the least significant
address lines from A0 through A6 at each write cycle. In this
manner a page of up to 128 bytes can be loaded in to the
EEPROM in a burst mode before beginning the relatively long
interval programming cycle.
After the 150
s time out is completed, the EEPROM begins an
internal write cycle. During this cycle the entire page of bytes
will be written at the same time. The internal programming
cycle is the same regardless of the number of bytes accessed.
EEPROM PAGE WRITE CHARACTERISTICS
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55
C to +125
C)
FIG. 11
EEPROM PAGE MODE
WRITE WAVEFORMS
1. Page address must remain valid for duration of write cycle.
Page Mode Write Characteristics
Symbol
Unit
Parameter
Min
Max
Write Cycle Time, TYP = 6ms
t
WC
10
ms
Address Set-up Time
t
AS
0
ns
Address Hold Time (1)
t
AH
100
ns
Data Set-up Time
t
DS
100
ns
Data Hold Time
t
DH
10
ns
Write Pulse Width
t
WP
150
ns
Byte Load Cycle Time
t
BLC
150
s
Write Pulse Width High
t
WPH
50
ns
OE
BYTE 0
BYTE 1
BYTE 2
BYTE 3
VALID DATA
VALID
ADDRESS
t
WC
t
BLC
t
WPH
t
WP
ADDRESS
EEPROM
DATA
ECS
1-2
EWE
1-2
BYTE 127
t
DS
t
DH
t
AS
t
AH
11
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS
(4)
LOAD LAST BYTE
TO
LAST ADDRESS
FIG. 12
EEPROM SOFTWARE DATA PROTECTION
ENABLE ALGORITHM
(1)
WRITES ENABLED
(2)
NOTES:
1. Data Format: ED
7
- ED
0
(Hex);
Address Format: A
16
- A
0
(Hex).
2. Write Protect state will be activated at end of write even if no other
data is loaded.
3. Write Protect state will be deactivated at end of write period even if
no other data is loaded.
4. 1 to 128 bytes of data may be loaded.
ENTER DATA
PROTECT STATE
12
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
EEPROM HARDWARE DATA PROTECTION
These features protect against inadvertent writes to the
WSE128K16-XXX. These are included to improve reliability
during normal operation:
a) V
CC
power on delay
As V
CC
climbs past 3.8V typical the device will wait 5msec
typical before allowing write cycles.
b) V
CC
sense
While below 3.8V typical write cycles are inhibited.
c) Write inhibiting
Holding OE low and either ECS or EWE high inhibits write
cycles.
d) Noise filter
Pulses of <8ns (typ) on EWE or ECS will not initiate a write
cycle.
EEPROM SOFTWARE DATA PROTECTION
A software write protection feature may be enabled or disabled
by the user. When shipped by WEDC, the WSE128K16-XXX has
the feature disabled. Write access to the device is unre-
stricted.
To enable software write protection, the user writes three
access code bytes to three special internal locations. Once
write protection has been enabled, each write to the EEPROM
must use the same three byte write sequence to permit writing.
After setting software data protection, any attempt to write to
the device without the three-byte command sequence will start
the internal write timers. No data will be written to the device,
however, for the duration of t
WC
. The write protection feature
can be disabled by a six byte write sequence of specific data to
specific locations. Power transitions will not reset the
software write protection.
Each 128K byte block of the EEPROM has independent write
protection. One or more blocks may be enabled and the rest
disabled in any combination. The software write protection
guards against inadvertent writes during power transitions, or
unauthorized modification using a PROM programmer.
FIG. 13
EEPROM SOFTWARE DATA PROTECTION
DISABLE ALGORITHM
(1)
EXIT DATA
PROTECT STATE
NOTES:
1. Data Format: ED
7
- ED
0
(Hex);
Address Format: A
16
- A
0
(Hex).
2. Write Protect state will be activated at end of write even if no other
data is loaded.
3. Write Protect state will be deactivated at end of write period even if
no other data is loaded.
4. 1 to 128 bytes of data may be loaded.
(3)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 20
TO
ADDRESS 5555
LOAD DATA XX
TO
ANY ADDRESS
(4)
LOAD LAST BYTE
TO
LAST ADDRESS
13
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
PACKAGE 400:
66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
27.3 (1.075)
0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
15.24 (0.600) TYP
0.76 (0.030)
0.13 (0.005)
4.34 (0.171)
MAX
3.81 (0.150)
0.13 (0.005)
2.54 (0.100)
TYP
25.4 (1.0) TYP
1.42 (0.056)
0.13 (0.005)
1.27 (0.050) TYP DIA
0.46 (0.018)
0.05 (0.002) DIA
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
14
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WSE128K16-XXX
PACKAGE 509:
68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
0.05 (0.002)
0.27 (0.011)
0.04 (0.002)
25.15 (0.990)
0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
0.26 (0.010)
22.36 (0.880)
0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
0.127 (0.005)
0.25 (0.010) REF
1
/ 7
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The WEDC 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
15
WSE128K16-XXX
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55
C to +125
C
I = Industrial
-40
C to +85
C
C = Commercial
0
C to +70
C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
ACCESS TIME (ns)
35 = 35ns SRAM and 150ns EEPROM
42 = 45ns SRAM and 120ns EEPROM
73 = 70ns SRAM and 300ns EEPROM
ORGANIZATION, 128K x 16
EEPROM
SRAM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W S E 128K16 - XXX X X X