I1800 SERIES
1. GENERAL DESCRIPTION
Winbond's I1800 ChipCorder
provides high-quality, single chip, single-message, record/playback
solution with user-selectable durations of 6 to 16 seconds. The CMOS devices include an on-chip
oscillator (with external control), microphone preamplifier, automatic gain control, anti-aliasing filter,
multilevel storage array, smoothing filter, and speaker amplifier. A minimum record/playback
subsystem can be configured with a microphone, a speaker, several passive components, two push
buttons, and a power source. Recordings are stored in on-chip nonvolatile memory cells, providing
zero-power message storage. This unique, single-chip solution is made possible through Winbond's
patented multilevel storage technology. Voice and audio signals are stored directly into memory in
their natural form, providing high-quality, solid-state voice reproduction.
2. FEATURES
Easy-to-use single-chip, single-message voice record/playback solution
High-quality, natural voice/audio reproduction
Push-button interface
o Playback can be edge- or level-activated
Variable record/playback duration controlled by external resistor selection, which sets sample rate.
Sample Rate
Duration
8 KHz
6.4 KHz
5.3 KHz
4 HKz
I1806
6 secs
7.5 secs
9 secs
12 secs
I1810
8 secs
10 secs
12 secs
16 secs
ROSC 80
K 100
K 120
K 160
K
Automatic power-down mode
o Enters standby mode immediately following a record or playback cycle
o 0.5 A standby current (typical)
On-chip 8 speaker driver
Zero-power message storage
o Eliminates battery backup circuits
100-year message retention (typical)
10,000 record cycles (typical)
On-chip oscillator
No algorithm development required
Single +3 volt power supply
Available in die form and 28-pin 300mil SOIC
o 28-pin 600mil PDIP available for samples only
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I1800 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION............................................................................................................ 9
7.1. Detailed Description
.................................................................................................................. 9
7.2. Functional Description Example
........................................................................................... 10
8. TIMING DIAGRAMS.......................................................................................................................... 12
9. ABSOLUTE MAXIMUM RATINGS
[1]
................................................................................................ 15
9.1 Operating Conditions
............................................................................................................... 16
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 17
10.1. DC Parameters
...................................................................................................................... 17
10.2. AC Parameters
[1]
................................................................................................................... 18
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 19
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 20
12.1. 28-Lead 300mil Small Outline IC (SOIC) Package
.......................................................... 20
12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) For Sampling Only
........... 21
12.3. I1800 Bonding Physical Layout (Die)
................................................................................. 22
13. ORDERING INFORMATION........................................................................................................... 24
14. VERSION HISTORY ....................................................................................................................... 25
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