ISD1810

- 2 -

1. GENERAL DESCRIPTION

Winbond's ISD1810 ChipCorder® provides high-quality, single chip, single-message, record/playback
solution with user-selectable durations of 8 to 16 seconds. The CMOS devices include an on-chip
oscillator (with external control), microphone preamplifier, automatic gain control, anti-aliasing filter,
multilevel storage array, smoothing filter, and speaker amplifier. A minimum record/playback
subsystem can be configured with a microphone, a speaker, several passive components, two push-
buttons, and a power source. Recordings are stored in on-chip nonvolatile memory cells, providing
zero-power message storage. This unique, single-chip solution is made possible through Winbond's
patented multilevel storage technology. Voice and audio signals are stored directly into memory in
their natural form, providing high-quality, solid-state voice reproduction.

2. FEATURES

Easy-to-use single-chip, single-message voice record/playback solution

High-quality, natural voice/audio reproduction

Push-button interface

o Playback can be edge- or level-activated

Variable record/playback duration controlled by external resistor selection which sets sample rate.

o 8 KHz sample rate = 8 seconds
o 6.4 KHz sample rate = 10 seconds
o 5.3 KHz sample rate = 12 seconds

4.0 KHz sample rate = 16 seconds

Automatic power-down mode

o Enters stanby mode immediately following a record or playback cycle
o 0.5 µA standby current (typical)

On-chip 8 speaker driver

Zero-power message storage

o Eliminates battery backup cuircuits

100-year message retention (typical)

10,000 record cycles (typical)

On-chip oscillator

No algorithm development required

Single +3 volt power supply

Available in die form and 28-pin 300mil SOIC

o 28-pin 600mil PDIP available for sampling only

ISD1810

- 4 -

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION............................................................................................................ 9

7.1. Detailed Description...................................................................................................................... 9

7.2. Functional Description Example ................................................................................................. 10

8. TIMING DIAGRAMS.......................................................................................................................... 12

9. Absolute Maximum Ratings

............................................................................................................ 15

9.1 Operating Conditions ................................................................................................................... 16

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 17

10.1. DC Parameters ......................................................................................................................... 17

10.2. AC Parameters

(1)

...................................................................................................................... 18

11. TYPICAL APPLICATION CIRCUIT................................................................................................. 19

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 20

12.1. 28-Lead 300mil Small Outline IC (SOIC) Package .................................................................. 20

12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) For Sampling Only........................ 21

12.3. ISD1810 Bonding Physical Layout ........................................................................................... 22

13. ORDERING INFORMATION........................................................................................................... 24

14. VERSION HISTORY ....................................................................................................................... 25

ISD1810

- 6 -

6. PIN DESCRIPTION

PIN NAME

PIN NO.

I/O

FUNCTION

SSD

, V

SSA

Ground Supplies: Similar to V

CCA

and V

CCD

, the

analog and digital circuits internal to the ISD1810
device use separate ground buses to minimize
noise. These pins should be tied together as
close as possible to the device.

REC

2 I

Record: The REC input is an active-HIGH record
signal. The device records whenever REC is
HIGH. This pin must remain HIGH for the duration
of the recording. REC takes precedence over
either playback (PLAYL or PLAYE) signal. If REC
is pulled HIGH during a playback cycle, the
playback immediately ceases and recording
begins. A record cycle is completed when REC is
pulled LOW. An End-of-Message (EOM) marker
is internally recorded, enabling a subsequent
playback cycle to terminate appropriately. The
device automatically powers down to standby
mode when REC goes LOW. This pin has an
internal pull-down device. Holding this pin HIGH
will increase standby current consumption.

PLAYE 3 I

Playback, Edge-activated: When a HIGH-going
transition is detected on this input pin, a playback
cycle begins. Playback continues until an End-of-
Message (EOM) marker is encountered or the
end of the memory space is reached. Upon
completion of the playback cycle, the device
automatically powers down into standby mode.
Taking PLAYE LOW during a playback cycle will
not terminate the current cycle. This pin has an
internal pull-down device. Holding this pin HIGH
will increase standby current consumption.

PLAYL 4 I

Playback, Level-activated: When this input pin
trasitions from LOW to HIGH, a playback cycle is
initiated. Playback continues until PLAYL is pulled
LOW or an End-of-Message (EOM) marker is
detected, or the end of the memory space is
reached. The device automatically powers down
to standby mode upon completion of the playback
cycle. This pin has an internal pull-down device.
Holding this pin HIGH will increase standby
current consumption.

5, 6, 7, 8, 9,

11, 14, 20, 21,

22, 23, 24

Not

Connected.

ISD1810

Publication Release Date: February 2003

- 7 -

Revision 0.1

PIN NAME

PIN NO.

I/O

FUNCTION

MIC 10 I

Micorphone Input: The microphone input
transfers its signals to the on-chip preamplifier. An
on-chip Automatic Gain Control (AGC) circuit
controls the gain of the preamplifier. An external
microphone should be AC coupled to this pin via
a series capacitor. The capacitor value, together
with the internal 10 K resistance on this pin,
determine the low-frequency cutoff for the
ISD1810 passband.

MIC REF

Microphone Reference: The MIC REF input is
the inverting input to the microphone preamplifier.
This provides input noise-cancellation, or
common-mode rejection, when the microphone is
connected differentially to the device.

AGC 13 I

Automatic Gain Control: The AGC dynamically
adjusts the gain of the preamplifier to compensate
for the wide range of microphone input levels. The
AGC allows the full range of sound, from whispers
to loud sounds, to be recorded with minimal
distortion. Nominal values of 4.7 µF give
satisfactory results in most cases.

SP-/SP+ 15,

17 O

Speaker Outputs: The SP+ and SP- pins provide
direct drive for loud-speakers with impedances as
low as 8. A single output may be used, but, for
direct-drive loud-speakers, the two opposite-
polarity outputs provide an improvement in output
power of up to four times over a single-ended
connection. Furthermore, when SP+ and SP- are
used, a speaker coupling capacitor is not
required. A single-ended connection will require
an AC-coupling capacitor between the SP pin and
the speaker.
The SP+ pin and the SP- pin are internally
connected through a 50 K resistance. When not
in playback mode, they are floating.

CCA

, V

CCD

18,

Voltage Supplies: Analog and digital circuits
internal to the ISD1810 device use separate
power buses to minimize noise on the chip. These
power buses are brought out to separate pins on
the package and should be tied together as close
to the power supply as possible. It is important
that the power supply be decoupled as close as
possible to the package.

ISD1810

- 8 -

PIN NAME

PIN NO.

I/O

FUNCTION

ROSC 19 I

The Resistor Controlled Oscillator input: This
enables the user to vary the ISD1810 device
record and playback duration. The resistor
connected between the ROSC pin and V

(R2)

determines the sample frequency and the filter
upper pass band for the ISD1810 device.
Winbond recommends an ROSC resistor value of
100 K.

FT 25

Feed Through: This mode allows use of the
speaker drivers for external signals. The signal
between the MIC and MIC_REF pins will pass
through the AGC, the filter and the speaker
drivers to the speaker ouptputs SP+ and SP-. The
input FT controls the feed through mode. To
operate this mode, the control pins REC, PLAYE
and PLAYL are held LOW at V

. The pin FT is

held HIGH to V

. For normal operation of record,

play and power down, the FT pin is held at V

The FT pin has a weak pull-down to V

XCLK 26

The External Clock input: For the ISD1810
devices has an internal pull-down resistor. This
pin is used for test purposes only. Do not bond
this pad.

RECLED

28 O

Record LED output: The

RECLED

output is

LOW during a record cycle. It can be used to
drive an LED to provide feedback that a record
cycle is in progress. In addition,

RECLED

pulses

LOW momentarily when and End-of-Message
(EOM) or end-of-memory marker is encountered
in a playback cycle.

Note:

The REC signal is internally debounced on the rising edge to prevent a false re-triggering from a push-

button switch.

ISD1810

Publication Release Date: February 2003

- 9 -

Revision 0.1

7. FUNCTIONAL DESCRIPTION

7.1. D

ETAILED

ESCRIPTION

Speech/Sound Quality
Winbond's patented ChipCorder® technology provides natural record and playback. The input voice
signals are stored directly in nonvolatile cells and are reproduced without the synthetic effect often
heard with digital solid-state speech solutions. A complete sample is stored in a single cell, minimizing
the memory necessary to store a single message.

Duration
The ISD1810 devices offer single-chip solutions with 8 to 16 seconds of record/playback duration
capacity. Sampling rate and duration are determined by an external resistor connected to the ROSC
pin. These specifications apply with the required resistor value for 10-second minimum playback
duration.

Part Number

Minimum Duration

[1]

(Seconds)

Maximum Input Sample Rate

[1]

(KHz)

Typical Filter Upper

Pass Band (KHz)

[2]

ISD1810 10

6.4

2.6

[1] A resistor value of 100 K at the ROSC pin provides this specified duration. Only this duration is guaranteed
and tested.

[2] This parameter is not checked during production testing and may vary due to process variations and other
functions. Therefore, the customer shold not rely on this value for testing purposes.

Non-Volatile Storage
The ISD1810 product utilizes the on-chip Flash memory, which incorporates SuperFlash® technology,
providing zero-power message storage. The message is retained for up to 100 years without power.
In addition, the device can be re-recorded typically over 10,000 times.

Basic Operation
The ISD1810 ChipCorder® device is controlled by the REC pin, and either of two playback pins,
PLAYE (edge-activated playback), and PLAYL (level-activated playback). The ISD1810 parts are
configured for design simplicity in a single-message application. Device operation is explained in
section 7.2, "Functional Description Example".

Automatic Power-Down Mode
At the end of a playback or record cycle, the ISD1810 device automatically returns to a low-power
standby mode, consuming typically 0.5µA, provided that Play REC, XCLK, and FT pins are LOW (see
DC parameters, section 10). During a playback cycle, the device powers down automatically at the
end of the message. During a record cycle, the device powers down immediately after REC is
released LOW.

ISD1810

- 10 -

7.2. F

UNCTIONAL

ESCRIPTION

XAMPLE

The following example operating sequence demonstrates the functionality of the ISD1810 devices.

1. Record a message filling the memory
Pulling the REC pin HIGH initiates a record cycle form the beginning of the message space. The
device will automatically power down after REC is release LOW. An EOM marker is written at the end
of message. If REC is held HIGH, the recording continues until the message space has been filled.
Once the message space is filled, recording ceases.

2. Edge-activated playback
Pulling the PLAYE pin HIGH initiates a playback cycle from the beginning of the message space.
When the device reaches the EOM marker, it automatically powers down. If a recording has filled the
message space, the entire message is played. A subsequent rising edge on PLAYE initiates a new
play cycle from the beginning of the memory.

3. Level-activated playback
Pulling the PLAYL pin HIGH initiates a playback cycle from the beginning of the message space.
When the device reaches the EOM marker, it automatically powers down. If a recording has filled the
message space, the entire message is played. A subsequent rising edge on PLAYL initiates a new
play cycle from the beginning of the memory.

4. Level-activated playback (truncated)
If PLAYL is pulled LOW any time during the playback cycle, the device stops playing and enters the
power-down mode. A subsequent rising edge on PLAYL initiates a new play cycle from the beginning
of the memory.

5. Record (interrupting playback)
The REC pin takes precedence over other operations. Any HIGH-going transition on REC initiates a
new record operation from the beginning of the memory, regardless of any current operation
inprogress.

6. Record a message, partially filling the memory
A record operation need not fill the entire memory. Releasing the REC pin LOW before filling the
message space causes the recording to stop and an EOM marker to be placed. The deivce powers
down automatically.

7. Playback a message that partially fills the memory
Pulling the PLAYE or PLAYL pin HIGH initiates a playback cycle. The playback cycle ceases when the
EOM marker is encountered and the device then powers down.

ISD1810

Publication Release Date: February 2003

- 11 -

Revision 0.1

8. RECLED operation

The

RECLED

output pin provides an active-LOW signal which can be used to drive an LED as a

"record-in-progress" indicator. It returns to a HIGH state when the REC pin is released LOW or when
the recording is completed due to the memory being filled. This pin also pulses LOW to indicate the
end of a message has been reached.

9. ROSC operation
The duration of the device can be varied by changing the value of R2 (R

OSC

). This means the ISD1810

device can actually be between 8 to 16 seconds duration. See the curve below which charts typical
durations when the R

OSC

is varied from 80 K to 160 K.

This feature allows frequency shifting where a recorded voice or sound can be played back faster or
slower than normal for special effects. For example, use a 100 K resistor to make the recording and
then playback with either an 80 K resistor for faster "chipmunk" talk or with a 120 K resistor for a
slower, lower voice.
Another feature is a "Pause" or interrupt function that can be done by taking the R

OSC

resistor to V

stop playback momentarily, resuming when the resistor is connected back to ground.

Chart 1: ISD Duration Versus R

OSC

at T

= 25°C and V

= 3.0V

80 100 120 140 160

Typical R

OSC

(K )

cal

rat

i
o

ec)

ISD1810

Publication Release Date: February 2003

- 13 -

Revision 0.1

Power-Down

Debounce

84 ms

W ink 84 ms

Power-Down

Operation

PLAYL

PLAYE

REC

RECLED

MIC

MIC REF

Open

Play

SP +

SP -

Open

1.2 VOLTS

Don't Care

No Edges

FIGURE 3: PLAY EDGE (PLAYE) PLAY UNTIL END OF MESSAGE

Power-Down

Debounce

84 ms

Wink 84 ms

Power-Down

Operation

PLAYL

PLAYE

REC

RECLED

MIC

MIC REF

Open

Play

SP +

SP -

Open

1.2 VOLTS

FIGURE 4: PLAY LEVEL (PLAYL) PLAY UNTIL END OF MESSAGE

ISD1810

Publication Release Date: February 2003

- 15 -

Revision 0.1

9. ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITION

VALUE

Junction temperature

150ºC

Storage temperature range

-65ºC to +150ºC

Voltage applied to any pin

0.3V) to

+0.3V)

-0.3V to +7.0V

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITION

VALUE

Junction temperature

150ºC

Storage temperature range

-65ºC to +150ºC

Voltage applied to any pin

0.3V) to

+0.3V)

Lead temperature (Soldering 10sec)

300ºC

-0.3V to +7.0V

Note:

Stresses above those listed may cause permanent damage to the device. Exposure to the absolute

maximum ratings may affect device reliability and performance. Functional operation is not implied at these
conditions.

ISD1810

Publication Release Date: February 2003

- 17 -

Revision 0.1

10. ELECTRICAL CHARACTERISTICS

10.1. DC P

ARAMETERS

PARAMETER

SYMBOL

MIN

(2)

TYP

(1)

MAX

(2)

UNITS

CONDITIONS

Input Low Voltage

0.8

Input High Voltage

2.0

Output Low Voltage

0.4

= 4.0 mA

(3)

Output High Voltage

2.4

= -1.6 mA

(3)

Current (Operating)

= 4.5V

Current (Standby)

0.5

µA

(4) (5)

Input Leakage Current

ILPD1

+1 µA

Force

(6)

Input Current HIGH

ILPD2

150

400

µA

Force

(7)

Input Current HIGH

ILPD3

130

µA

Force

(8)

Output Load Impedance

EXT

Speaker

Load,

SP+ to SP-

Preamp Input Resistance R

MIC,

MICREF

10 K

MIC SP+/- Gain

MSP

AGC = 0.0V

Typical values @ T

= 25º and 3.0V.

All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.

Record LED output, RECLED .

4. V

CCA

and V

CCD

connected together.

REC, PLAYL, PLAYE, XCLK, and FT must be at V

SSD

REC, PLAYL and PLAYE.

Test limits of Final Test.

ISD1810

- 18 -

10.2. AC P

ARAMETERS

(1)

CHARACTERISTIC

SYMBOL

MIN

(3)

TYP

(2)

MAX

(3)

UNITS

CONDITIONS

Sampling Frequency

6.4

KHz

(4)

Filter Pass Band

2.6

KHz

3 dB Roll-Off
Point

(5)(6)

Record Duration

REC

sec

(4)

Playback Duration

PLAY

sec

(4)

EOM Pulse Width

EOM

msec

Debounce Time

msec

Total Harmonic Distortion THD

@ 1KHz,
V

=15mV

Peak-to-Peak

Speaker Output Power

OUT

24.4 mW

EXT

= 8

Voltage Across Speaker
Pins

OUT

1.25

2.5

Vp-p

EXT

= 600

MIC Input Voltage

300

Peak-to-Peak

(7)

These specifications apply with R

OSC

equaling 100.

Typical values @ T

= 25º and 3.0V.

All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.

Oscillator stability may vary as much as +5% over the operating temperature and voltage ranges. (Only
the 10sec duration is tested/guaranteed)

Low-frequency cutoff depends upon value of external capacitors (see Pin Descriptions)

Filter specification applies to the antialiasing filter and to the smoothing filter.

Balanced input signal applied between MIC and MIC REF as shown in the applications example. Single-
ended MIC or MIC REF recommended to be less than 100 mV peak to peak.

ISD1810

Publication Release Date: February 2003

- 23 -

Revision 0.1

ISD1810 PAD (X,Y) COORDINATES

(WITH RESPECT TO DIE CENTER)

PAD #

PAD Name

Pin #

X Axis (µm)

Y Axis (µm)

1 AGC

-522.35

-1037.20

RECLED

28 -126.05 1038.70

3 VCCD

122.15

1038.70

4 XCLK

358.38

1038.70

5 FT

630.45

1018.90

6 VSSD

-368.95

1038.70

7 REC

-558.98

1038.70

8 PLAYE

-760.15

1038.70

9 PLAYL

-977.35

1038.70

10 SP+

465.85

-1024.10

11 ROSC

1007.85

-1037.20

12 VCCA

772.85

-1037.20

13 VSSA

158.85

-1037.20

14 SP-

-148.15

-1024.10

15 MIC

-977.75

-1037.20

16 MIC

REF

-741.75

-1037.20

ISD1810

- 26 -

Headquarters

Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III

2727 North First Street, San Jose,

27F, 299 Yan An W. Rd. Shanghai,

Science-Based Industrial Park, CA 95134, U.S.A.

200336 China

Hsinchu, Taiwan

TEL: 1-408-9436666

TEL: 86-21-62365999

TEL: 886-3-5770066

FAX: 1-408-5441797

FAX: 86-21-62356998

FAX: 886-3-5665577

http://www.winbond-usa.com/

http://www.winbond.com.tw/

Taipei Office

Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.

9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18

Unit 9-15, 22F, Millennium City,

Neihu District

Shinyokohama Kohokuku,

No. 378 Kwun Tong Rd.,

Taipei, 114 Taiwan

Yokohama, 222-0033

Kowloon, Hong Kong

TEL: 886-2-81777168

TEL: 81-45-4781881

TEL: 852-27513100

FAX: 886-2-87153579

FAX: 81-45-4781800

FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
This product incorporates SuperFlash® technology licensed From SST.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond
makes no representation or warranties with respect to the accuracy or completeness of the contents of this
publication and reserves the right to discontinue or make changes to specifications and product descriptions at
any time without notice. No license, whether express or implied, to any intellectual property or other right of
Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and
Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of
merchantability, fitness for a particular purpose or infringement of any Intellectual property.

Winbond products are not designed, intended, authorized or warranted for use as components in systems or
equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other
applications intended to support or sustain life. Further more, Winbond products are not intended for applications
wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe
property or environmental injury could occur.

Application examples and alternative uses of any integrated circuit contained in this publication are for illustration
only and Winbond makes no representation or warranty that such applications shall be suitable for the use
specified.

ISD® and ChipCorder® are treademarks of Winbond Electronics Corporation. SuperFlash® is the trademark of
Silicon Storage Technology, Inc.

The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as
published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond.

Information contained in this ISD® ChipCorder® data sheet supersedes all data for the ISD ChipCorder products
published by ISD® prior to August, 1998.

This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD®
ChipCorder® product specifications. In the event any inconsistencies exist between the information in this and
other product documentation, or in the event that other product documentation contains information in addition to
the information in this, the information contained herein supersedes and governs such other information in its
entirety.

Copyright© 2003, Winbond Electronics Corporation. All rights reserved. ISD® is a registered trademark of
Winbond. ChipCorder® is a treademark of Winbond. All other trademarks are properties of their respective
owners.

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